Patents Examined by David M Sinclair
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Patent number: 11929213Abstract: A structure of capacitors connected in parallel includes a substrate. A trench embedded in the substrate. Numerous electrode layers respectively conformally fill in and cover the trench. The electrode layers are formed of numerous nth electrode layers, wherein n is a positive integer from 1 to M, and M is not less than 3. The nth electrode layer with smaller n is closer to the sidewall of the trench. When n equals to M, the Mth electrode layer fills in the center of the trench, and the top surface of the Mth electrode is aligned with the top surface of the substrate. A capacitor dielectric layer is disposed between the adjacent electrode layers. A first conductive plug contacts the nth electrode layer with odd-numbered n. A second conductive plug contacts the nth electrode layer with even-numbered n.Type: GrantFiled: April 21, 2020Date of Patent: March 12, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Purakh Raj Verma, Ching-Yang Wen, Xingxing Chen, Chao Jin
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Patent number: 11929206Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.Type: GrantFiled: September 16, 2021Date of Patent: March 12, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jun Jung, Yun Kim, Hyun Kim, Sim Chung Kang, Eun Jung Lee
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Patent number: 11923139Abstract: An energy storage device, especially a super capacitor, useful for high temperature applications has current collector elements supporting a carbonaceous matrix modified or doped with pseudo-capacitive materials, including one or more transition metal dichalcogenides, transition metal oxides and mixtures thereof, in contact with a non-aqueous electrolyte composition whereby it is possible to exploit the faradic mechanism in addition to the electric double layer mechanism as an energy storage principle.Type: GrantFiled: April 16, 2019Date of Patent: March 5, 2024Assignee: ENI S.P.A.Inventors: Andrea Lamberti, Massimo Zampato, Stefano Carminati, Mara Serrapede, Arnaud Nicholas Gigot
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Patent number: 11923152Abstract: An electrolytic capacitor includes a capacitor element that includes an anode body that has a porous structure, a dielectric layer disposed on a surface of the anode body, and a solid electrolyte layer that covers at least a part of the dielectric layer. The anode body contains a first group metal including at least one selected from the group consisting of tantalum, niobium, titanium, aluminum, and zirconium. The dielectric layer contains an oxide of the first group metal and a second group metal including at least one selected from the group consisting of iron, chromium, copper, silicon, molybdenum, sodium, and nickel. A ratio X of a total number of atoms of the second group metal to a total number of atoms of the first group metal in the dielectric layer is equal to or less than 100 ppm.Type: GrantFiled: February 22, 2022Date of Patent: March 5, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masahiro Ueda, Kohei Yamaguchi, Toshiyuki Kato, Takashi Umemoto
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Patent number: 11923145Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 1<A2/M1?1.5 and A2<A1 in which A1 is an average grain size of the dielectric layers in a central region of the active portion, A2 is an average grain size of the dielectric layers at an active boundary part of the active portion adjacent to the side margin portion, and M1 is an average grain size of the dielectric layers in a central region of the side margin portion.Type: GrantFiled: September 2, 2021Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Je Hee Lee, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hyoung Uk Kim, Jae Sung Park
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Patent number: 11915885Abstract: An electrode foil for an electrolytic capacitor includes: an anode body including a first metal; a first dielectric layer covering at least a part of the anode body and including an oxide of the first metal; and a second dielectric layer covering at least a part of the first dielectric layer and including an oxide of a second metal. The first metal includes at least one selected from the group consisting of titanium, tantalum, niobium, and aluminum. And the second metal includes at least one selected from the group consisting of silicon, zirconium, hafnium, and tantalum. A thickness T2 of the second dielectric layer is smaller than a thickness T1 of the first dielectric layer.Type: GrantFiled: September 4, 2020Date of Patent: February 27, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Miwa Ogawa, Naomi Kurihara
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Patent number: 11915880Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers, side margin portions disposed on the body, and external electrodes disposed on the body. The reliability of the multilayer electronic component is improved by controlling the contents of Si for each position of the dielectric layer and the side margin portion.Type: GrantFiled: October 12, 2021Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hee Sun Chun, Hyoung Uk Kim, Jae Sung Park, Hyeg Soon An, Ku Tak Lee, Eun Ha Jang
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Patent number: 11915887Abstract: A capacitor 1 includes a capacitor element 3 holding solution between an anode foil 5 and a cathode foil 7 that are wound up with a separator 6 in between, a body case 2 for housing the capacitor element 3, and a sealing member 4 for sealing the body case 2. A part of the separator 6 makes contact, at a plurality of points or over an area, with the face of the sealing member 4 facing the capacitor element 3 so as to rest on that face. The solution contains, dissolved in a lipophilic solvent, deterioration preventing agent that solidifies by oxidation. The solution is supplied through the separator 6 to the sealing member 4 and permeates the sealing member 4, so that a coating 17 resulting from the agent solidifying coats the outer face of the sealing member 4, leaving the solution present in the sealing member 4.Type: GrantFiled: July 29, 2020Date of Patent: February 27, 2024Assignee: SUN Electronic Industries Corp.Inventors: Takashi Takezawa, Masakazu Hosogi, Hirokazu Nishikori
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Patent number: 11915881Abstract: A ceramic electronic component includes an element body and at least one external electrode. The element body includes a dielectric and at least one internal electrode therein. The element body has a plurality of surfaces that includes a first surface and a second surface opposite the first surface. Two end regions are defined on the second surface at opposite ends of the second surface, and an intermediate region is defined on the second surface between the two end regions. The intermediate region has a surface roughness smaller than each of the two end regions. The respective external electrode is formed on the element body at a position away from the second surface. The respective external electrode includes a base layer formed on the element body and a plating layer formed on the base layer. The base layer is connected to the respective internal electrode and contains at least one metal.Type: GrantFiled: November 3, 2021Date of Patent: February 27, 2024Assignee: TAIYO YUDEN CO., LTD.Inventor: Takashi Shimada
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Patent number: 11908628Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.Type: GrantFiled: December 6, 2022Date of Patent: February 20, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Muramatsu, Ken Tominaga
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Patent number: 11908630Abstract: A solid electrolytic capacitor according to an aspect includes an anode body made of a valve metal, a dielectric layer formed on the anode body, a solid electrolyte layer formed on the dielectric layer, and a cathode body layer formed on the solid electrolyte layer. The solid electrolyte layer includes a first layer containing a first conductive polymer doped with a monomolecular dopant, and a second conductive polymer composed of a self-doped-type conductive polymer containing a plurality of side chains containing a functional group, the functional group being able to be doped, and a second layer formed on the first layer and containing a third conductive polymer doped with a polymer dopant; and the first conductive polymer is in contact with the third conductive polymer (the second layer).Type: GrantFiled: April 18, 2022Date of Patent: February 20, 2024Assignee: TOKIN CORPORATIONInventors: Yusuke Hoshina, Masami Ishijima, Tadamasa Asami, Yasuhisa Sugawara
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Patent number: 11908623Abstract: A multilayer capacitor includes a body including dielectric layers and internal electrodes and external electrodes disposed on an external surface of the body and connected to the internal electrodes. The body includes a first surface and a second surface to which the internal electrodes are exposed, the first surface and the second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction which is a direction in which the dielectric layers are stacked, and a fifth surface and a sixth surface opposing each other in a third direction. At least one of the internal electrodes include a first bottleneck structure having a first directional length of a third-directional outer region smaller than an inner region thereof and a second bottleneck structure having a third directional length of a first directional outer region smaller than an inner region thereof.Type: GrantFiled: March 18, 2021Date of Patent: February 20, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Myung Chan Son, Sim Chung Kang, Eun Jin Shim, Sun Hwa Kim, Byung Soo Kim
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Patent number: 11908632Abstract: A solid electrolytic capacitor (1) includes an anode foil (2a) having formed thereon an oxide film, a cathode foil (2c), and a separator (2d), and is equipped with a solid electrolyte (20) formed of an electroconductive polymer compound in a fine particle form, and a water-soluble compound solution (30) introduced to surround the solid electrolyte (20), the solid electrolyte (20) contains a polyol compound having a molecular weight of less than 200 and a number of hydroxy groups of 4 or more as a first water-soluble compound (2f1), the water-soluble compound solution (30) contains one kind or multiple kinds of a glycol compound in a liquid form as a second water-soluble compound (2f2), and the second water-soluble compound (2f2) has an average molecular weight of less than 400.Type: GrantFiled: June 18, 2020Date of Patent: February 20, 2024Assignee: RUBYCON CORPORATIONInventors: Masayuki Sakaguchi, Tetsushi Ogawara, Yoshishige Sakurai, Akira Iijima, Yosuke Nozawa
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Patent number: 11901125Abstract: A capacitor component includes a body including a capacitance formation portion including a plurality of unit devices including a first internal electrode, a first dielectric film surrounding the first internal electrode, and a second internal electrode surrounding the first dielectric film, and a molded portion surrounding the capacitance formation portion, first and second external electrodes respectively disposed on a first surface and a second surface of the body opposing each other in a first direction to be respectively connected to the first and second internal electrodes. Cross-sections perpendicular to the first direction of at least two of the plurality of unit devices have a polygonal shape.Type: GrantFiled: August 10, 2022Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Jong Lee, Han Kim, Min Cheol Park, Su Bong Jang
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Patent number: 11901131Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.Type: GrantFiled: September 3, 2021Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol Lee, Seung Hun Han, In Young Kang, Jung Min Kim, Jeong Ryeol Kim
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Patent number: 11894200Abstract: A capacitor that is capable of exhibiting good electrical properties under a wide variety of different conditions is provided. The capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric and includes a conductive polymer. The capacitor also contains multiple exposed anode lead portions that are electrically connected to respective anode terminations and a planar cathode termination that is electrically connected to the solid electrolyte.Type: GrantFiled: September 3, 2021Date of Patent: February 6, 2024Assignee: KYOCERA AVX Components CorporationInventor: Jeffrey Cain
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Patent number: 11887787Abstract: A multilayer ceramic electronic component includes a first metal terminal including a first plating film on a surface of a first terminal main body, and a second metal terminal including a second plating film on a surface of the second terminal main body. The first metal terminal includes a surface connected to the first external electrode on which a first recess portion is provided such that the first terminal main body is exposed. The second metal terminal includes a surface connected to the second external electrode on which a second recess portion is provided such that the second terminal main body is exposed. The first and second recess portions each include cavities. An exterior material covers the multilayer ceramic electronic component main body, the bonding material, a portion of the first metal terminal, and a portion of the second metal terminal.Type: GrantFiled: August 18, 2021Date of Patent: January 30, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Satoshi Miyauchi
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Patent number: 11875945Abstract: A capacitor component includes a body having a stacked portion in which first internal electrodes and second internal electrodes are alternately stacked with each other and with dielectric layers therebetween in a first direction, and having first and second connection portions disposed on opposite surfaces of the stacked portion, respectively, in a second direction perpendicular to the first direction. First and second external electrodes are disposed on the first and second connection portions, respectively. The first and second connection portions each include a metal layer disposed on the stacked portion and a ceramic layer disposed on the metal layer. Corners of the body have a rounded shape in a cross-section of the body extending in the first and second directions.Type: GrantFiled: September 24, 2021Date of Patent: January 16, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Park, Ki Pyo Hong, Jung Tae Park, Jong Hwa Lee
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Patent number: 11869722Abstract: A capacitor component includes a body having a first surface and a second surface opposing each other and including a multilayer structure in which a plurality of dielectric layers are stacked and first and second internal electrodes are alternately disposed with respective dielectric layers interposed therebetween and exposed to the first surface and the second surface, respectively, first and second metal layers covering the first surface and the second surface and connected to the first and second internal electrodes, respectively, first and second ceramic layers covering the first and second metal layers, and first and second external electrodes covering the first and second ceramic layers and connected to the first and second metal layers to be electrically connected to the first and second internal electrodes, respectively.Type: GrantFiled: July 23, 2021Date of Patent: January 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Hyun Cho, Byeong Chan Kwon, Yong Jin Yun, Ki Pyo Hong, Jae Yeol Choi
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Patent number: 11862404Abstract: A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region, in which electrode layers are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between an electrode layer and a conductive resin layer of an external electrode, and thus, may improve bending strength and humidity resistance reliability.Type: GrantFiled: May 26, 2022Date of Patent: January 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Yeong Kim, Ji Hong Jo, Woo Chul Shin