Patents Examined by Davis D Hwu
  • Patent number: 11968805
    Abstract: A heatsink with an air-partitioning baffle. In one embodiment, the heatsink comprises a plurality of fins defining a plurality of channels, an inlet channel that is at least partially defined by the plurality of fins and extends across the plurality of channels, and a baffle at least partially within the inlet channel. The baffle is configured to direct a first fluid flow, such as warm air, from a first portion of the plurality of channels and to direct a second fluid flow, such as cooling air, through at least one inlet of the inlet channel to a second portion of the plurality of channels.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: April 23, 2024
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Stefan Skoglund, Adrianus Van Gaal, Elisabet Aldurén
  • Patent number: 11964589
    Abstract: An electrified vehicle includes a storage compartment positioned forward of a vehicle passenger cabin and accessible by opening a vehicle hood, a thermally conductive plate or heat exchanger in contact with a bottom surface of the storage compartment and having an associated conduit configured for circulating a working fluid from a vehicle cooling system, and a valve operable to control flow of the working fluid through the conduit. The storage compartment may be filled with a cooling medium, such as ice or dry ice, to provide enhanced cooling during high-demand operation or charging of the vehicle, such as when operating in a performance/track mode, towing a trailer, or in other extreme use scenarios. The valve may be controlled so that the working fluid bypasses the conduit when the storage compartment is used for cargo and/or enhanced cooling is not desired.
    Type: Grant
    Filed: November 10, 2021
    Date of Patent: April 23, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Patrick Gordon Collins, David Michael Horan, Thomas Karl Rothermel, Jacob Gregory Powers
  • Patent number: 11959684
    Abstract: A cooling device comprising a cooling circuit, is described. The cooling circuit further comprises a compressor adapted to compress cooling agent present in the cooling circuit during an active cooling mode, wherein the compressed cooling agent contains lubricant oil from the compressor; a condensing unit connected to the compressor by a first fluid line of the cooling circuit; and an evaporating unit, which is connected to the condensing unit by a second fluid line of the cooling circuit. The cooling circuit further comprises an expansion device arranged in the second fluid line; and an additional evaporator connected to the evaporating unit by a third fluid line of the cooling circuit, and connected to the compressor by a fourth fluid line of the cooling circuit.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: April 16, 2024
    Assignee: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
    Inventors: Sviataslau Alehavich Filatau, Yongqi Qiu
  • Patent number: 11959702
    Abstract: An air separation device can include: a first compressor and a second compressor for compressing feed air; a first refrigerator and a second refrigerator for cooling the feed air; a pre-purification unit for pre-purifying the feed air; a flow rate measuring unit for measuring the flow rate of the feed air; a main heat exchanger for subjecting the feed air to heat exchange; a purification portion into which the feed air led out from the main heat exchanger is fed, and which separates and purifies product nitrogen and/or product oxygen from the feed air; and a compressor control unit for controlling the feed quantity of the feed air in accordance with an increase or decrease in the production quantity of product nitrogen and/or product oxygen.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: April 16, 2024
    Assignee: L'Air Liquide, Societe Anonyme Pour L'Etude Et L'Exploitation Des Procedes Georges Claude
    Inventors: Takuya Kaneda, Tsuyoshi Sugitani
  • Patent number: 11953271
    Abstract: A thermal energy storage apparatus includes at least one hollow tube having an internal cavity and at least one basic module placed inside the internal cavity. The at least one basic module has at least one slab, at least one pair of spacer bars, and at least one through channel adapted for the passage of a heat transfer fluid.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 9, 2024
    Assignee: ENI S.P.A.
    Inventors: Gabriele Bianchi, Carla Lazzari, Carmen Sama', Tamara Passera
  • Patent number: 11951824
    Abstract: A shutter device includes a frame member, a plurality of blades, an actuator device, and an auxiliary member. The frame member is formed in a casing shape, and air introduced from a front opening of the vehicle flows through an inside passage of the frame member. The blades are supported by the frame member in a rotatable manner, and open and close space within a casing of the frame member. The actuator device opens and closes the blades. Auxiliary member is assembled to the frame member to assist a blades supporting function of the frame member.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: April 9, 2024
    Assignee: DENSO CORPORATION
    Inventors: Takuya Mitsuhashi, Yukio Shidara
  • Patent number: 11952529
    Abstract: The present invention provides a refrigerant-containing composition by using a refrigerant that has a refrigerating capacity equivalent to that of widely used R404A, and a low GWP. Specifically, the present invention provides a composition that contains a refrigerant containing difluoromethane (R32), pentafluoroethane (R125), 1,1,1-trifluoroethane (R143a), 2,3,3,3-tetrafluropropene (R1234yf), and 1,1,1,2-tetrafluoroethane (R134a) in specific concentrations.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: April 9, 2024
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Mitsushi Itano, Hitomi Kuroki, Shun Ohkubo, Tatsumi Tsuchiya, Kenji Gobou
  • Patent number: 11953272
    Abstract: A cycling heat dissipation module suited for dissipating heat generated from a heat source is provided. The cycling heat dissipation module includes an evaporator, a condenser, and a micro/nano-structure. The evaporator is thermal contacted with the heat source to absorb heat generated therefrom. The condenser is connected to the evaporator to form a loop, and a working fluid is filled in the loop. The working fluid in liquid state is transformed to vapor state by absorbing heat in the evaporator, and the working fluid in vapor state is transformed to liquid state by dissipating heat in the condenser. The micro/nano-structure is disposed in the condenser to destroy a boundary layer of the working fluid while passing through the condenser.
    Type: Grant
    Filed: March 24, 2021
    Date of Patent: April 9, 2024
    Assignee: Acer Incorporated
    Inventors: Cheng-Yu Cheng, Wen-Neng Liao, Cheng-Wen Hsieh
  • Patent number: 11951805
    Abstract: A heat management system includes a high-temperature heat medium circuit, a low-temperature heat medium circuit, a circuit connection part, and a circuit switching part. The high-temperature heat medium circuit connects a heat medium and refrigerant heat exchanger and a heater core. The low-temperature heat medium circuit connects a radiator and a heat generation equipment. The circuit connection part connects the high-temperature heat medium circuit and the low-temperature heat medium circuit such that the heat medium can flow in and out. The heat management system is switched by the circuit switching part between an operation mode in which the heat medium heated by the heat medium and refrigerant heat exchanger is circulated through the heater core and an operation mode in which the heat medium heated by the heat generation equipment and the heat medium and refrigerant heat exchanger is circulated through the heater core.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: April 9, 2024
    Assignee: DENSO CORPORATION
    Inventors: Yasuteru Fukui, Nobuharu Kakehashi, Tomohiro Hayase
  • Patent number: 11913667
    Abstract: Cooling systems are provided. The cooling systems include a plurality of cooling units. Each cooling unit has a base having a housing with control components, a cooling tower attached to the base at a first end of the cooling tower, with an inner flow path and an exterior surface, and an air distribution system attached to the cooling tower at a second end. The air distribution system includes an air distribution chamber between first and second enclosures, cool and warm air dispensers are configured in the first enclosure, and a cover is disposed on an exterior of the enclosures. The control components are configured to convey air through the base, the cooling tower, and the air distribution system to dispense air through the air dispensers. At least two of the cooling units of the plurality of cooling units are arranged in a linear arrangement.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 27, 2024
    Assignee: CARRIER CORPORATION
    Inventor: Michel Grabon
  • Patent number: 11913664
    Abstract: An air-conditioning apparatus including heat source apparatuses each including a compressor and an accumulator includes: a refrigerant amount calculation unit that calculates an amount of the refrigerant accumulated in the accumulator in one of the heat source apparatuses that is to be controlled; a refrigerant differential amount calculation unit configured to calculate, when the number of the heat source apparatuses is two, a differential amount between the calculated amount and an amount of the refrigerant in the accumulator in the other heat source apparatus, and calculate, when the number of the heat source apparatuses is three or more, a differential amount between the calculated amount of the refrigerant and an average amount of amounts of the refrigerant accumulated in the accumulators in the heat source apparatuses; and a liquid equalization control unit that controls the heat source apparatus to be controlled, based on the calculated differential amount.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: February 27, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroaki Asanuma, Hiroyuki Okano
  • Patent number: 11913702
    Abstract: A cooling system is disclosed.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: February 27, 2024
    Assignee: MH TECHNOLOGIES INC.
    Inventors: Jin-Ho Yoo, Jung Hoon Lee
  • Patent number: 11913691
    Abstract: An electronic expansion valve and a thermal management assembly. The electronic expansion valve has a valve port and a valve core. A valve body includes a first flow portion, a second flow portion, a first cavity and a second cavity. The first flow portion comprises a first connection section and a first subsection, and the first subsection is directly in communication with the first cavity. The second flow portion comprises a second connection section and a second subsection, and the second subsection is directly in communication with the second cavity. In a clockwise direction, an angle formed between at least one of the center line of the first subsection and the center line of the second subsection and the center line of the valve core is an acute angle.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: February 27, 2024
    Assignee: Zhejiang Sanhua Intelligent Controls Co., Ltd.
    Inventors: Quanfeng Huang, Yingchong Lu, Rongrong Zhang, Dazhao Zha, Wei Zhang
  • Patent number: 11915993
    Abstract: A two-pack curable composition set having: a first agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, a thermally conductive filler, a silica powder, and a platinum catalyst, and having a viscosity at 25° C. at a shear rate of 10 s?1 of 20 to 150 Pa·s; and a second agent comprising an organopolysiloxane having a branched structure and having a vinyl group at least at an end or in a side chain, and a polydimethylsiloxane having a hydrosilyl group at least at an end or in a side chain, a thermally conductive filler, and a silica powder, and having a viscosity at 25° C. at a shear rate of 10 s?1 of 20 to 150 Pa·s.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: February 27, 2024
    Assignee: Denka Company Limited
    Inventor: Masahiro Kato
  • Patent number: 11912100
    Abstract: The invention relates to a thermal conditioning circuit (1) for a hybrid or electric motor vehicle, in which a refrigerant can circulate, said circuit (1) comprising a compressor (3), a condenser (5), an evaporator-condenser (7), an evaporator (9) and a heat exchanger (11) thermally coupled to an electric member, e.g. a vehicle electric battery, characterized in that the circuit is configured to operate at least in the following three modes in which the refrigerant can circulate in a cascade and successively:—via the condenser (5), the evaporator-condenser (7) and the evaporator (9) in a first mode;—via the condenser (5), the evaporator (9) and the evaporator-condenser (7) in a second mode; and—in another mode, i.e.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: February 27, 2024
    Assignee: Valeo Systemes Thermiques
    Inventors: Bertrand Nicolas, Mohamed Yahia
  • Patent number: 11906187
    Abstract: A refrigerating cycle apparatus includes a refrigerating cycle device having a refrigerating cycle, the refrigerating cycle in which a refrigerant is compressed in a compressor and made to circulate, and by a heat exchanger, heat is absorbed from a low temperature heat source and heat is exhausted to a high temperature heat source, and a control device that controls operation of the refrigerating cycle device. An obtaining unit obtains an operation operating request that controls the refrigerating cycle device arranged in a structure's interior to a target state. An operation control unit, when the operation operating request transmitted from an outside is obtained, controls the refrigerating cycle device to the target state with lower operation capacity than operation capacity of the refrigerating cycle device of a case where the operation operating request is transmitted from the structure's interior.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: February 20, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Takashi Matsumoto
  • Patent number: 11906249
    Abstract: A heat exchanger has: a first manifold assembly having a stack of plates; a second manifold assembly having a stack of plates; and a plurality of tubes extending from the first manifold assembly to the second manifold assembly. The plurality of tubes is a plurality groups of tubes. For each of the groups of the tubes: the tubes of the group have first ends mounted between plates of the first manifold assembly; and the tubes of the group have second ends mounted between plates of the second manifold assembly.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 20, 2024
    Assignee: RTX Corporation
    Inventor: James F. Wiedenhoefer
  • Patent number: 11896980
    Abstract: A temperature-controlled component and a method for producing a temperature-controlled component, the temperature-controlled component includes a base body including at least one hollow space, through which a temperature control medium can flow. It is provided that in a first region, a first wall thickness is formed between an inner jacket surface of the hollow space and a jacket surface of the base body, and that in a second region, a second wall thickness is formed between an inner jacket surface of the hollow space and a jacket surface of the base body. The second region is a wear region of the component, and the second wall thickness is larger than the first wall thickness in this wear region.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: February 13, 2024
    Assignee: NETZSCH-Feinmahltechnik GmbH
    Inventor: Holger Möschl
  • Patent number: 11898808
    Abstract: An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: February 13, 2024
    Assignee: APPLE INC.
    Inventors: Robert F. Meyer, William A. Counts, Michael D. Quinones, Jason P. Shannon, David A. Pakula
  • Patent number: 11891309
    Abstract: A method of controlling cooling water treatment at a cooling tower may involve measuring operating data of one or more downstream heat exchangers that receive cooling water from the cooling tower. For example, the inlet and outlet temperatures of both the hot and cold streams of a downstream heat exchanger may be measured, optionally along with a flow rate of the cooling water stream passing through the heat exchanger. Data from the streams passing through the heat exchanger may be used to determine a heat transfer efficiency for the heat exchanger. The heat transfer efficiency can be trended over a period of time and changes in the trend detected to identify cooling water fouling issues. A chemical additive selected to reduce, eliminate, or otherwise control the cooling water fouling can be controlled based on the changes in heat transfer efficiency detected at the downstream heat exchanger.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: February 6, 2024
    Assignee: Ecolab USA Inc.
    Inventors: Anupam Prakash, Stephen J. Hinterlong, Hung-Ting Chen, Craig Myers, Walter H. Goodman, Daniel Meier