Abstract: This invention discloses a method for electroplating nickel/gold on electrically connecting pads on a substrate for chip package and structure thereof. The method comprises: forming a conductive film on a substrate circuit-patterned and defined with a circuit layer; forming on the substrate a resist with an opening for exposing a portion of the conductive film in an electrically connecting pad area intended for the circuit layer; removing a portion of the conductive film not covered with the resist; forming another resist on the substrate to cover a portion of the conductive film residually exposing from the resist; electroplating nickel/gold on at least one electrically connecting pad on the substrate such that the electrically connecting pad is electroplated with a nickel/gold layer; removing the resists and the conductive film thereunder; and forming a solder mask on the substrate, wherein the electrically connecting pad electroplated with the nickel/gold layer is exposed from the solder mask.

Abstract: The disclosure relates to circuits and methods for the manufacture of circuits, such as those which avoid the formation of undesirable short circuit paths. One such method maintains a layout area of a fluid composition receiving layer within a layout area of a dielectric layer. Another such method relates to the application of fluid composition receiving layers, conductive layers, and dielectric layers, such as in the provision of printed circuits.

Abstract: First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.

Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

Abstract: There are proposed a manufacturing method of a winding assembly of a rotating electrical machine using a rotation block and a fixed block and a manufacturing apparatus used for the same. The rotation block includes a rotation surface rotatable around a rotation axis, and the fixed block includes a first surface and a second surface opposite to each other and a shaping surface. The shaping surface is formed between end parts of the first and the second surfaces, is made to have an almost semicircular shape with the rotation axis as the center, and extends along the rotation axis. Plural wire rods are simultaneously fed from the first surface of the fixed block to the rotation surface of the rotation block, and the wire rods positioned on the rotation surface are bent by rotation of the rotation block.

Abstract: An apparatus and associated method is provided for precisely positioning a datum surface of a component. The apparatus has a housing defining a tooling datum surface. A collet is supported by the housing, and is thereby selectively operable between an expanded mode and a retracted mode. In the expanded mode, a clearing disengagement is defined with the component. In the retracted mode, a contacting engagement is defined with the component as well as a simultaneous longitudinal force that is transferred by the contacting engagement to the component capable of pressingly engaging the datum surfaces together. The apparatus further has a bias member urging the collet to the retracted mode.

Abstract: A micromachine successfully reduced in parasitic capacity between input and output electrodes, and having an oscillator configured as ensuring a high S/N ratio under operation at higher frequencies is disclosed. The micromachine comprises an insulating layer formed on a substrate; a first electrode for signal input formed on the insulating layer; a second electrode for signal output formed on the insulating layer; and an oscillator electrode formed as being opposed with the first electrode and the second electrode and as being spaced therefrom by an air gap, wherein the insulating layer has a groove formed therein at least between the first electrode and the second electrode.

Abstract: An apparatus is provided for supporting a PCB substrate during printing. The apparatus includes first and second fixing units that cooperate to edge-clamp the substrate. The first fixing unit includes a first movable plate, a first actuator, and a first stopper that limits outward movement of the first movable plate. The second fixing unit includes a second movable plate, a second actuator, and a second stopper that limits outward movement of the second movable plate. When printing the substrate from the first edge to the second edge, the first and second fixing units operate so that the second actuator moves the second movable plate outwardly to contact the second stopper, and the first actuator moves the first movable plate inwardly to press the substrate toward the second movable plate. When printing the substrate from the second edge to the first edge the first and second fixing units operate oppositely.

Abstract: The present invention relates to an apparatus for producing a comb-like capacitor element member including a guide member and a plurality of rectangular metal foil pieces bonded to the guide member, comprising an automatic feed mechanism for feeding tape-like metal foil by a constant length toward the guide member, a bonding mechanism for bonding the metal foil to the guide member, and a cutting mechanism for cutting the bonded metal foil. According to the apparatus of the present invention, a comb-like capacitor element member having a plurality of rectangular metal foil pieces bonded can be produced efficiently, by bonding the elongated tape-like metal foil without damaging it.

Abstract: Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other integrated circuit to a substrate; applying and curing a relatively-soft, protective material over the sensing portion of the sensing device; positioning a covering tool over the cured material; applying and curing a relatively-hard, protective coating around the covering tool and the relatively-soft, protective material; and applying a second, relatively-soft, protective material in the void left by the withdrawn covering tool.

Abstract: Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component contained within the chassis, an electrical connector engaged with a receptacle on the electrical component, and a retainer to prevent disengagement of the electrical connector from the receptacle. The retainer has a mounting portion that can attach to at least one of the electrical component or the computer chassis, and a connector interface adjacent to the electrical connector to prevent the connector from disengaging from the receptacle on the electrical component. In one aspect of this embodiment, the retainer is a one-piece retainer with a mounting portion that attaches to only one surface of the electrical component. In other embodiments, the retainer can be a two-piece retainer having a bracket and a movable retainer portion.

Abstract: While a piezoelectric element is being formed by sequentially laminating a lower electrode whose uppermost layer is made of iridium, a titanium layer, a piezoelectric layer and an upper electrode to each other on a substrate, the piezoelectric layer is formed, by an MOD method, on the titanium layer with an contact angle of water to the surface thereof which is no less than 40°.

Abstract: The present invention provides a circuit board structure and a method of fabricating circuit board structure the same, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with at least one through hole penetrating the first and second surfaces; a conductive pillar formed in the through hole by electroplating; and a first circuit layer and a second circuit layer respectively formed on the first and second surfaces of the carrier board, the first and second circuit layers being electrically connected to the two end portions of the conductive pillar, thereby reducing spacing between adjacent conductive pillars of the carrier board and achieving high density circuit layout.

Abstract: There is disclosed a method of producing an inkjet printhead including a cavity unit having therein ink passages and formed by stacking a plurality of kinds of flat plates each of which has a specific ink-passage pattern for constituting the ink passages.

Abstract: Methods of creating an internal channel of a fluid-ejection device are provided. One method includes encapsulating a channel core in an element of the fluid-ejection device that corresponds to the internal channel and dissolving at least a portion of the channel core.

Abstract: The method manufactures a liquid ejection head in which piezoelectric bodies are formed on a diaphragm which constitutes walls of a plurality of pressure chambers. The method comprises the steps of: filling piezoelectric material into a plurality of recess sections of a molding substrate formed with the plurality of recess sections so as to correspond to the pressure chambers; then performing a lamination step of arranging a first green sheet that is to form the diaphragm onto the molding substrate in such a manner that the first green sheet covers the recess sections filled with the piezoelectric material; then performing a first heating step of heating the piezoelectric material filled in the recess sections; and then separating the piezoelectric material from the molding substrate.

Abstract: A tool adaptor for securing a compression type end connector to the prepared end of a coaxial cable. The adaptor includes two slide members that are mated in an interlocking sliding relationship with the end connector placed in engagement with contoured seats located in each of the slide members. Opposed drive surfaces are located in the slide members that can be engaged between the jaws of a crimping tool to apply an axial force to the end connector so as to radially compress a deformable section of the connector into tight frictional engagement with the coaxial cable.

Abstract: An electro-fluidic interconnection. The interconnection includes a body (200) formed of a ceramic material. The body (200) is provided with an aperture (206) having a profile suitable for receiving an interconnecting conduit (400). The interconnecting conduit (400) can be formed of the same type of ceramic material as the body (200). The conduit (400) is defined by an outer shell (403) with a hollow bore (402) for transporting a fluid. A mating portion (404) of the conduit has an exterior profile that matches the profile of the aperture. Moreover, the mating portion (404) of the conduit (400) can be compression fitted within the aperture (206). Conductive traces (406, 208) on the conduit and the body can be electrically connected to complete the electro-fluidic interconnection.

Abstract: A method for manufacturing a magnetoresistive multilayer film. An antiferromagnetic layer, a pinned-magnetization layer, a nonmagnetic spacer layer and a free-magnetization layer are laminated on a substrate in this order. A film for the antiferromagnetic layer is deposited by a sputtering process as oxygen gas is added to a gas for sputtering. A film for an extra layer interposed between the substrate and the antiferromagnetic layer is deposited by a sputtering process as oxygen gas is added to a gas for sputtering. A film for the antiferromagnetic layer is deposited by a sputtering process with a gas mixture of argon and another gas of larger atomic number than argon.

Abstract: An optical lapping guide for determining an amount of lapping performed on a row of sliders in a process for manufacturing sliders for magnetic data recording. The optical lapping guide is constructed with a front edge that is at an angle with respect to an air bearing surface plane ABS plane, such that a portion of the lapping guides is in front of the ABS and portion of the lapping guide is behind the ABS. As lapping progresses, an increasing amount of the lapping guide will be exposed at the ABS and visible for inspection. Therefore, after a lapping process has been performed, the optical lapping guide can be inspected to determine the amount of material removed by lapping. The greater the amount of the lapping guide that is exposed and visible, the greater the amount of material removed by lapping.