Abstract: A mirror for a piezoelectric resonator consisting of alternately arranged layers of high and low acoustic impedance is manufactured by at first producing a first layer on which a second layer is produced, so that the second layer partially covers the first layer. Then, a planarization layer is applied on the first layer and on the second layer. Subsequently, a portion of the second layer is exposed by structuring the planarization layer, wherein the portion is associated with an active region of the piezoelectric resonator. Finally, the resulting structure is planarized by removing the portions of the planarization layer remaining outside the portion.

Abstract: A wire insertion tool for a push-in wire connector has a frame and a slide assembly mounted for reciprocating motion on the frame. The frame includes a carriage on which a push-in wire connector is mounted. The slide assembly carries a wire holder which mounts an electric wire opposite the wire connector. An actuator extends to advance the slide assembly and carry a wire in the holder in a direction parallel to the axis of the wire. Advancement of the wire holder inserts the wire into the connector. The wire holder is then released and the slide assembly is retracted to prepare for the next insertion cycle.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: A piezoelectric resonator includes a resonator substrate, a base substrate supporting the resonator substrate, a lid substrate covering a surface of the resonator substrate, the surface being on an opposite side of a surface facing the base substrate, a first excitation electrode formed on the surface of the resonator substrate facing the lid substrate, a second excitation electrode formed on the surface of the resonator substrate facing the base substrate, and a third electrode provided on the surface of the resonator substrate facing the base substrate, the third electrode being electrically connected to the first excitation electrode through a concave portion which is formed on a side surface of the resonator substrate.

Abstract: A system and method are disclosed for improving suspension-to-slider attachment in a hard disk drive. A slider having a number of bond pads on its leading edge and a number of bond pads on its trailing edge is to be coupled to a suspension flexure having a number of leading bond pads and a number of trailing bond pads. The slider is to be coupled to the suspension flexure at the leading bond pads and the trailing bond pads by a method such as gold ball, solder ball, or solder bump bonding.

Abstract: A pusher 30 is composed of a pusher base 31 and a pressing body 32 attached to the pusher base 31 in a removable way. Specifically, a base portion of the pressing body 32 is provided with a flange portion 321, and the pusher base 31 is provided with a plate 33 having a U-shape when seen two-dimensionally. By sliding the pressing body 32 with respect to the pusher base 31 with the flange portion 321 of the pressing body 32 supported by the plate 33, the pressing body 32 can be attached to and removed from the pusher 30 without using any tools.

Abstract: In an exemplary embodiment, a method for a magnetic sensor includes forming a first conductive layer over a substrate containing circuitry, forming a dielectric layer over the first conductive layer, forming a second conductive layer over the dielectric layer such that the first conductive layer, the dielectric layer, and the second conductive layer form a first capacitor, and providing first and second terminals, wherein the first terminal is coupled to the first conductive layer and the second terminal is coupled to the second conductive layer.

Abstract: In an electronic component mounting method of mounting electronic components on a substrate by means of soldering by using an electronic component mounting system having a screen printing apparatus and an electronic component mounting apparatus connected to each other to manufacture a mounting substrate, prior to a screen printing process, the positions of pattern holes provided in a screen mask are measured to calculate mask aperture data, and the coordinates of a mounting position when a component mounting operation is performed by a mounting head are calculated, on the basis of the mask aperture data. In this way, it is possible to calculate the positional deviation of solder, without measuring the position of solder after printing whenever the solder is printed, and to prevent defects in mounting due to the positional deviation of solder, which results in high productivity.

Abstract: A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink jetting so as to cover a part of the first wiring layer and expose an exposed section of the first wiring layer; and forming a second wiring layer by ink jetting partly over the first wiring layer, with the first insulating layer being between the part of the first wiring layer and a part of the second wiring layer. A wider variety of conductive material and insulating material can be used for forming the wiring layers and the insulating layers on the substrate by ink jetting, while the wiring board has a first wiring layer having high density.

Abstract: A component placement device suitable for placing a component on a substrate comprises at least one component feeder, at least one substrate conveyor as well as at least one component pickup and placement device for picking up a component from the component feeder and placing said component on a substrate supported by the substrate conveyor.

Abstract: A method for making a rotor for a permanent magnet motor, the method, in at least certain aspects, including connecting a series of a plurality of guides to a hollow rotor body, the guides spaced-apart and extending longitudinally of the rotor body, the rotor body being generally cylindrical with an interior surface, applying a plurality of magnets to the interior surface of the rotor body, and emplacing a shunt structure over the plurality of magnets to inhibit inter-magnet action during rotor assembly.

Abstract: A laminated structure having an electrode hard to peel off and a method of manufacturing the laminated structure. The laminated structure has: a backing substrate; a lower electrode including an adhesive layer containing a metal oxide and a conductive layer formed on the backing substrate with the adhesive layer therebetween; a dielectric layer disposed on the lower electrode; and an upper electrode disposed on the dielectric layer. Further, the method includes the steps of: (a) disposing a lower electrode by forming a conductive layer on a backing substrate with an adhesive layer containing a metal oxide therebetween; (b) disposing a dielectric layer by spraying powder of a dielectric material to the lower electrode for deposition; (c) heat-treating the dielectric layer; and (d) forming an upper electrode on the dielectric layer before or after step (c).

Abstract: A method for fabricating an IC support for supporting a first IC die connected in series with a second IC die; the IC support comprising a stack of alternating layers of copper features and vias in insulating surround, the first IC die being bondable onto the IC support, and the second IC die being bondable within a cavity inside the IC support, wherein the cavity is formed by etching away a copper base and selectively etching away built up copper.

Abstract: A water stopping apparatus for causing a water stopping material to penetrate exposed core wires of a sheathed wire forming a wire harness includes a pair of dies which can abut against each other in a mutually opposed condition, thereby forming a pressurizing space in which an exposed portion of the core wires of the wire harness can be mounted, a filling portion for filling a water stopping material in the pressurizing space in which the exposed portion of the core wires is mounted, and a pressurizing portion for supplying pressurized gas into the pressurizing space to pressurize the same.

Abstract: An insulator-combining apparatus which can correctly detects whether or not insulators are lined up in a predetermined sequence is provided. The plate-combining apparatus includes a plate-setting jig which includes a frame, holder, combining part and erroneous attaching-preventing part. The holders hold insulating plates and are provided being spaced from each other and supported by the frame capable of approaching and leaving each other. The combining part includes a pair of nipping members which positions the holder therebetween so as to cause the holders to approach each other. The erroneous attaching-preventing part prevents the holders from approaching each other until the insulators combine with each other when an incorrect insulating plate is attached on the holder.

Abstract: Metal parts can be economically fabricated by a metal stamping that comprises preforming a piece of wire to have a shape corresponding to the 2-dimensional configuration of a desired product workpiece, flattening the wire to form a metal blank, and subjecting the metal blank to metal stamping to obtain the desired product workpiece. The process can significantly reduce the amount of scrap material and thereby reduce manufacturing costs.

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.

Abstract: In a manufacturing method of a glass substrate for a magnetic disk including a cleaning process of the glass substrate, the cleaning process includes a process of contacting the glass substrate with a cleaning solution containing a compound, such as thioglycolic acid or a thioglycolic acid derivative, having a thiol group as a functional group.

Abstract: A method for electrically connecting disk drive suspension assembly elements including positioning a first component having a first terminal with an edge adjacent to a second component having a second terminal and applying solder to form a solder joint over the edge of the first terminal and onto the second terminal. Heat to melt the solder is provided from a source that is physically remote from the components.

Abstract: A magnetization apparatus for magnetizing a magnetic material provided inside a yoke housing of a motor, which has a connector portion radially outward of the yoke housing, includes at least one pair of magnetization cores and a plurality of magnetization coils. The at least one pair of magnetization cores are provided to oppose to each other, wherein the at least one pair of magnetization cores have corresponding magnetization surfaces, which oppose to each other. The plurality of magnetization coils generate a magnetic field at the at least one pair of magnetization cores, wherein the plurality of magnetization coils magnetize the magnetic material in a state, where the yoke housing is provided between the magnetization surfaces. The at least one pair of magnetization cores defines a receiving recess therein for receiving the connector portion of the motor in the state, where the yoke housing is provided between the magnetization surfaces.