Abstract: A holder with includes: a holder body formed by molding a resin material, a contact surface on the holder body for receiving an operating object to be held on the holder body, a grip portion on the holder body at a position apart from the contact surface for being gripped by an operator, and an electric conductor extending from the contact surface to the grip portion.

Abstract: For purposes of assembling contact pins (12) disposed in a row onto a circuit board (16), the pins (12) are grasped via a force fit in an insulating body (20) at their ends facing away from the circuit board (16)and are supported to prevent tilting. The body (20) has a suction surface (26) for an automated assembly device. After insertion of the pins (12) into the circuit board (16) and after the soldering process, the body (20) is pulled off the pins (12), so that they sit freely in the circuit board (16).

Abstract: Embodiments of the present invention provide a method of fabricating a magnetic head slider realizing high-recording density at high-yields by preventing formation of a short circuit on the air-bearing surface of a magnetic head slider and preventing formation of an oxidized layer with significant film thickness which increases the effective magnetic spacing, on the air-bearing surface of the magnetic head slider. According to one embodiment, after air-bearing surface mechanical lapping of a row bar or a magnetic head slider, cleaning is performed by ion beam bombardment to remove a conductive smear. Oxygen exposure is performed to recover a damaged region which was formed by ion beam bombardment at the end face of an intermediate layer of a magnetoresistive film 5. Thereafter, air-bearing surface protection films are formed and followed by rail formation. If the processes are performed on the row bar, the row bar is cut into individual separated magnetic head sliders.

Abstract: A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

Abstract: A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

Abstract: A method of manufacturing a surface acoustic wave device having a high electromechanical coefficient and reflection coefficient, and also having an improved frequency-temperature characteristic is achieved by forming a SiO2 film on an IDT so as to prevent cracking from occurring on a surface of the SiO2 film so that desired properties can be reliably obtained. The surface acoustic wave device includes at least one IDT, which is composed of a metal or an alloy having a density higher than that of Al and is formed on a 25° to 55° rotation-Y plate X propagation LiTaO3 substrate, and a SiO2 film disposed on the LiTaO3 substrate so as to cover the at least one IDT for improving the frequency-temperature characteristic.

Abstract: An apparatus for assembling cable to connector includes a jig holder and a cable jig. The jig holder has a basic board defining a mounting space capable of locating a connector in the front thereof. The cable jig located in the rear of the mounting space of the jig holder has an upper jig member and a lower jig member disposed beneath the upper jig member. One of the jig members protrudes to form first spaced-apart barriers. A first receiving passage is defined between each pair of adjacent first spaced-apart barriers. The other jig member defines second receiving passages for receiving the first spaced-apart barriers respectively. A second spaced-apart barrier is defined between every two adjacent second receiving passages to space the two adjacent second receiving passages apart. The second spaced-apart barriers are inserted in the first receiving passages respectively.

Abstract: A method of manufacturing an alloy circuit board including an alloy circuit made of an alloy of first metal particles and second metal particles includes forming a first circuit layer, by printing ink containing first metal particles on a board; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer by heating so as to form the alloy of the first metal particles and the second metal particles.

Abstract: Provided is an assembler for assembling a carrier for supporting printhead integrated circuits. The carrier has upper and lower parts that are operatively fastened together. The assembler includes a support structure configured to support the lower part in a pre-fastened position, and a holding mechanism arranged on the support structure for holding the upper part in a pre-fastened position. The assembler also includes a displacement mechanism arranged on the support structure for displacing the holding mechanisms to bring the parts into operative registration with each other, and a fastening apparatus for fastening the parts together.

Abstract: A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part.

Abstract: The present invention is a process for fabricating a cloth-like heating element with two pairs of electrical conductors and parallel circuits which are formed via a severing process. A pair of electrical conductors, which looks as a twin belt aligned in parallel, is fabricated on both edges of the heating element by the weaving process; Severing predetermined portions of the inner electrical conductor in order to increase the electrical resistance of heating wires, the pertinent heating wires are connected in series circuitry with each side of the outer electrical conductors; and the heating element is completed when the said process of series linkage is continuously carried out in parallel alignment in accordance with predetermined design.

Abstract: A stator bar installation fixture and method for installing stator bars into specific stator core slots within a stator core of rotating electrical equipment. The stator bar installation fixture includes rotating mechanisms, rotatingly fixed at each end of the rotating electrical equipment, for supporting and controlling an angular positioning of a stator bar insertion mechanism relative to the stator core. The stator bar insertion mechanism supports a stator bar within the stator core, angularly locates a stator bar in alignment with the specific stator core slot, and inserts the stator bar into the specific stator core slot.

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Abstract: Apparatuses and methods for preventing disengagement of electrical connectors in the assembly of computers. In one embodiment, a computer system includes a chassis, an electrical component contained within the chassis, an electrical connector engaged with a receptacle on the electrical component, and a retainer to prevent disengagement of the electrical connector from the receptacle. The retainer has a mounting portion that can attach to at least one of the electrical component or the computer chassis, and a connector interface adjacent to the electrical connector to prevent the connector from disengaging from the receptacle on the electrical component. In one aspect of this embodiment, the retainer is a one-piece retainer with a mounting portion that attaches to only one surface of the electrical component. In other embodiments, the retainer can be a two-piece retainer having a bracket and a movable retainer portion.

Abstract: A tool is disclosed for driving a slide under a wedge within a slot of an armature or field of a dynamoelectric machine. The tool comprises a frame including a pair of elongated rail members; a force application block located between the rail members; a drive connected to the frame, substantially intermediate opposite ends of the frame; a lead screw threadably engaged at one end with the force application block and connected at an opposite end to the drive such that the drive rotates the lead screw when actuated. Rotation of the lead screw causes axial movement of the force application block. The armature or field includes a core, and this core may have one or more vent slots for facilitating ventilation of the armature or field. A slot plate for locating the tool relative to the slide is present, and a portion of the slot plate extends into one or more vent slots. The slot plate establishes a reaction point for forces applied by the force application block to the stator slide.

Abstract: A method for manufacturing an equalizer used to compensate a digital signal passed by a transmission line, in which the digital signal can be presented as a frequency-domain function. The method includes measuring a the transmission line scattering-parameter; performing an integration and a differentiation about the transmission line scattering-parameter, the frequency-domain function, the ideal gain, and an equalizer scattering-parameter to get the component impedances of the equalizer; and manufacturing the equalizer circuit with the derived component impedances.

Abstract: A method for linearizing potentiometric sensors is provided, the method can include the steps of: insertion in a measurement and/or processing station of a potentiometric sensor provided with a resistive track; application of a defined voltage and/or of a defined current across the resistive track; placement of a number of sensing elements composed of metallic contacts distributed at uniform intervals over the length of the resistive track; acquisition of the individual measured values of the sensing elements and determination of the curve of the resistance of the resistive track, and linearization of the resistance of the resistive track by means of sequential adjustment of the resistance of the resistive track.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: An apparatus for detecting a location of conductive pins with respect to a circuit board during an assembly process using a press tool to mate the circuit board and the conductive pins includes a detector housing holding a plurality of switches aligned with corresponding conductive pins, wherein the detector housing is configured to be mounted to the press tool used during the assembly process. The switches change state based on the location of the conductive pins with respect to the circuit board. The apparatus further includes a sensor electrically coupled with the plurality of switches, wherein the sensor monitors the change of state of each switch to indicate that the respective conductive pins are properly mated with the circuit board.

Abstract: An apparatus and associated method is provided for precisely positioning a datum surface of a component. The apparatus has a housing defining a tooling datum surface. A collet is supported by the housing that is selectively operable between a retracted mode and an expanded mode. In the retracted mode a clearing disengagement is defined with the component. In the expanded mode a contacting engagement with the component is defined. The contacting engagement and a simultaneous longitudinal force transferred by the contacting engagement to the component pressingly engage the datum surfaces together. The apparatus further has a bias member exerting the longitudinal force and urging the collet to the retracted mode.