Abstract: Disclosed is a method of measuring a free air ball size during a wire bonding process of a wire bonder, which comprises a position sensor and a bonding tool for forming an electrical connection between a semiconductor device and a substrate using a bonding wire. Specifically, the method comprises the steps of: forming a free air ball from a wire tail of the bonding wire; using the position sensor to determine a positional difference between a first and a second position of the bonding tool with respect to a reference position, wherein the first position of the bonding tool is a position of the bonding tool with respect to the reference position when the free air ball contacts a conductive surface; and measuring the free air ball size based on the positional difference of the bonding tool as determined by the position sensor. A wire bonder configured to perform such a method is also disclosed.

Abstract: In a friction stir welding method, a pair of plate materials is arranged opposing one another such that the ends thereof are butted together, after which friction stir welding is performed. A first shoulder is arranged at one surface of the pair of plate materials and a second shoulder is arranged at the other surface of the plate materials to sandwich therebetween a joint to be formed by friction stirring of the end parts of the plate materials, and the first shoulder and the second shoulder are rotated, thereby friction stirring the joint of the pair of plate materials. As the joint is friction stirred, the first shoulder and the second shoulder are moved from the other surface toward the one surface of the plate materials, thereby forming at the joint a protruding part protruding from the one surface of the plate materials as the friction stir welding is performed.

Abstract: In a step (a), a guard ring is disposed on a ceramic substrate (a second member) such that one of openings of a through hole of the guard ring is covered with a joint surface of the ceramic substrate. In a step (b), a brazing material made of a metal, a powder made of a material having a smaller thermal expansion coefficient than the brazing material, and a feeding terminal are inserted into the through hole. In a step (c), the brazing material is fused to impregnate the powder with the brazing material to thereby form a joint layer including the brazing material and the powder. In this manner, the joint surface and the joint surface are joined to each other through the joint layer.

Abstract: A method for joining a first metal part (11) with a second metal part (12), the metal parts (11,12) having a solidus temperature above 1100 QC. The method comprises: applying a melting depressant composition (14) on a surface (15) of the first metal part (11), the melting depressant composition (14) comprising a melting depressant component that comprises at least 25 wt % boron and silicon for decreasing a melting temperature of the first metal part (11); bringing (202) the second metal part (12) into contact with the melting depressant composition (14) at a contact point (16) on said surface (15); heating the first and second metal parts (11,12) to a temperature above 1100 QC; and allowing a melted metal layer (210) of the first metal component (11) to solidify, such that a joint (25) is obtained at the contact point (16). The melting depressant composition and related products are also described.

Abstract: A method for producing a primary material for a machining tool and such a primary material, for example a primary material for a saw blade, a saw band, a cutting line, a punching knife or a blade, wherein a first flat carrier is arranged with one edge thereof along an edge of a second flat carrier, wherein the first and second carriers are welded together along the edges by supplying at least a first particulate cutting edge material, and the first and second carriers are separated again substantially along the welded joint formed as noted above.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: A hybrid additive manufacturing method comprises building an additive structure on a pre-sintered preform base, wherein building the additive structure comprises iteratively fusing together a plurality of layers of additive material with at least a first layer of additive material joined to the pre-sintered preform base, and wherein the pre-sintered preform base comprises an initial shape. The hybrid additive manufacturing method further comprises modifying the initial shape of the pre-sintered preform base comprising the additive structure into a modified shape comprising the additive structure, and, joining the pre-sintered preform base in its modified shape to a component.

Abstract: A Cu—Be alloy according to the present invention is a Co-containing Cu—Be alloy, in which the Co content is 0.005% to 0.12% by mass, and the number of Cu—Co-based compound particles having a particle size of 0.1 ?m or more that can be confirmed on a TEM image at a magnification of 20,000 is five or less in a field of view of 10 ?m×10 ?m. Furthermore, a method for producing a Cu—Be alloy according to the present invention includes a solution annealing treatment step of subjecting a Cu—Be alloy raw material containing 0.005% to 0.12% by mass of Co and 1.60% to 1.95% by mass of Be to solution annealing treatment to obtain a solution-annealed material.

Abstract: A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

Abstract: A rare-earth permanent magnetic powder, a bonded magnet containing thereof and a device using the bonded magnet are provided of the present disclosure. The rare-earth permanent magnetic powder comprises: 70 vol % to 99 vol % of a hard magnetic phase and 1 vol % to 30 vol % of a soft magnetic phase, the hard magnetic phase has a TbCu7 structure, and the grain size of the hard magnetic phase is 5 nm to 100 nm; the soft magnetic phase is a Fe phase having a bcc structure, the average grain size of the soft magnetic phase is 1 nm to 30 nm, and the standard deviation of the grain size is below 0.5?.

Abstract: A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.

Abstract: A manufacturing method of power-module substrate (10), the power-module substrate (10) being obtained by joining a circuit layer (12) made of copper to one surface of a ceramic substrate (11) and joining a heat-radiation layer (13) made of aluminum to the other surface of the ceramic substrate (11), including: a circuit layer bonding step in which the circuit layer (12) is brazed on the ceramic substrate (11), a surface treatment step after the circuit layer bonding step in which a thickness of an oxide film on the other surface of the ceramic substrate (11) is made 3.2 nm or less at least at a peripheral part of an intended bonding area between the ceramic substrate (11) and the heat-radiation layer (13), and a heat-radiation layer bonding step in which the heat-radiation layer (13) is brazed on the other surface of the ceramic substrate (11) after the surface treatment step.

Abstract: A weldment that is embedded in a precast concrete building member that is used to join the concrete building member to other concrete building members. The weldment has a top plate, side plate, and outstanding top and bottom legs. The surface of the top plate and side plate are not embedded in the precast concrete building member. The legs are integrally formed with the top plate and side plate. The top plate and side plate present weldable surfaces to join by welding the precast concrete building member to another building member.

Abstract: Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.

Abstract: Dual alloy bladed rotors are provided, as are methods for manufacturing dual alloy bladed rotors. In one embodiment, the method includes arranging bladed pieces in a ring formation such that contiguous bladed pieces contact along shank-to-shank bonding interfaces. The ring formation is positioned around a hub disk, which is contacted by the bladed pieces along a shank-to-hub bonding interface. A metallic sealing material is deposited between contiguous bladed pieces utilizing, for example, a laser welding process to produce an annular seal around the ring formation. A hermetic cavity is then formed, which is circumferentially bounded by the annular seal and which encloses the shank-to-shank and shank-to-hub bonding interface. Afterwards, a Hot Isostatic Pressing process is performed during which the ring formation and the hub disk are exposed to elevated pressures external to the hermetic cavity sufficient to diffusion bond the shank-to-shank and shank-to-hub bonding interface.

Abstract: A method of bonding a die comprising solder bumps to a substrate comprising bond pads, the method comprising the steps of heating the die from a first temperature to a second temperature, wherein the first temperature is below the melting point of the solder bumps, and the second temperature is above the melting point of the solder bumps; moving the die relative to the substrate to a first height, whereat the solder bumps contact the bond pads; moving the die further away from the substrate to a second height, while maintaining contact between the solder bumps and bond pads; and thereafter cooling the die from the second temperature to a third temperature to allow the solder bumps to solidify so as to bond the die to the substrate.

Abstract: In a preferred embodiment, there is provided a process for forming a reinforced rocker panel assembly, and which includes positioning a reinforcement patch having first and second patch sections in surface-to-surface contact with a blank panel sheet, and welding the first patch section to the blank panel sheet. The process further includes bending both the blank panel sheet and the reinforcement patch along a bend line interposed between the first and second patch sections to form the blank panel sheet into a rocker panel portion having an elongated base section and a longitudinal flange, where the first and second patch sections are in at least partial abutting contact with the base section and the flange. The process also includes welding the second patch section to the flange.

Abstract: A method for manufacturing an electronic device using ultrasonic joining, when the component members of the electronic device includes different structures. The method includes obtaining a joining condition that provides press-down amounts for the materials to be joined at predetermined values. The press-down amount generated by a horn and a supporting member biting into the materials during ultrasonic joining is predetermined for each specific structure of the component member of the electronic device.

Abstract: A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.

Abstract: The present invention provides a ceramic to ceramic joint and methods for making such a joint. Generally, the joint includes a first ceramic part and a second ceramic part, wherein the first and second ceramic parts each include a ceramic-carbide or a ceramic-nitride material. In some cases, an aluminum-initiated joint region joins the first and second ceramic parts. This joint region typically includes chemical species from the first and second ceramic parts that have diffused into the joint region. Additionally, the first and second ceramic parts each typically include a joint diffusion zone that is disposed adjacent to the joint region and which includes aluminum species from the joint region that have diffused into the joint diffusion zone. Other implementations are also described.