Abstract: The invention relates to recovery of tin-lead solder from electronic printed circuit board scrap. The scrap is placed in a liquid-permeable and/or gas-permeable container, which is placed in a liquid or gaseous heat-transfer medium heated to or above the melting temperature of the tin-lead solder. After the tin-lead solder is melted, the heat-transfer medium is removed from the container, then, by means of rotation of the container, the melted tin-lead solder and the remains of the heat-transfer medium are removed from the container. The device comprises a hollow container, which is mounted so as to be capable of rotation and is designed in the form of a body of revolution, and is liquid-permeable and/or gas-permeable in a radial direction from the axis of rotation. The container can be designed in the form of a drum, which can be vertically displaced and has perforated side walls.

Abstract: An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate 16 having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.

Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Abstract: A connecting method of a circuit member, includes: a first process of preparing a connection material that a solder material disperses in the adhesive; a second process of disposing the first circuit member and the second circuit member to cause the first electrode of the first circuit member and the second electrode of the second circuit member to oppose each other via the connection material; and a third process of compressing the first circuit member and the second circuit member while applying heat to the connection material. The third process includes a first pressing process which is performed before a temperature of the connection material reaches a melting point of the solder material, and a second pressing process which follows the first pressing process.

Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.

Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Abstract: A pressure welding method and to a pressure welding device (1) are provided. The pressure welding device (1) includes a plastification device (7), an upsetting device (8) and component mountings (34, 35, 36, 37) for the components (2, 3, 3?, 4) to be welded together and a machine frame (12). The pressure welding device (1) includes a machine head (13) which is arranged so as to move on the machine frame (12). The machine head (13) includes a rotatable spindle (54) and a component mounting element (34, 35) as well as an associated spindle drive (56). The machine head (13, 14) and the spindle drive (56) are separated from each other on the machine frame (12). A controllable mass decoupling (79) including an axially tolerant coupling (80), is arranged in the drive train (57) between the fixed or moveable spindle drive (56) arranged on the machine frame (12).

Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

Abstract: Methods of fabricating reduced weight components for apparatuses include obtaining a component including a relatively lightweight material; placing at least one stabilizing structure on the component; sequentially applying a plurality of applied layers on the component and the stabilizing structure by applying the relatively lightweight material over the component and applying over the relatively lightweight material a plurality of layers having gradually progressively higher proportions of the relatively heavyweight material than preceding ones of the plurality of layers closer to the component, with an outer layer of the plurality of applied layers including the relatively heavyweight material; diffusion bonding the plurality of applied layers by consolidation of the plurality of applied layers; and cutting component features in the plurality of applied layers.

Abstract: A pressure welding method and a pressure welding device are provided. The pressure welding device includes a plastification device (7), an upsetting device (8) and component mountings (34,35,36,37), for the components (2,3,3?,4) to be welded together, and a machine frame (12). The pressure welding device (1) further includes a machine head (13,14) with a component mounting (34, 35) and an associated additional component mounting (36, 37) and the machine head (13) is moveably arranged on the machine frame (12). The pressure welding device includes a machining device (18), for the welding part (5,5?), which is associated with the machine head (13,14) or the additional component mountings (36, 37). An adjusting device (17) generates a relative movement between the machine head (13,14) and the associated additional component mounting (36,37) for machining the welding part (5,5?).

Abstract: System for friction stir welding of two parts which includes a welding unit which includes at least one welding head fitted with a rotating pin and a counter-bearing unit which has a support surface to support the parts against a pressure exerted by the welding head, and wherein each welding head can be moved relative to the support surface in a first direction parallel to an axis of rotation of the rotating pin and in a second direction orthogonal to the axis of rotation, and wherein the support surface can be moved in the second direction and is formed of two coaxial clamp rollers which are set apart from each other.

Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.

Abstract: A dissimilar metal joining method includes moving a tool on a first metal along a first track on an overlapped part where the first metal is overlapped on a second metal while the tool is rotated around an axis of the tool and is pressed along the axis against the first metal such that the tool penetrates the first metal and is inserted into the second metal by a first insertion depth. The tool is moved from the first track to a second track which is on the overlapped part and which is substantially parallel to the first track after the tool has moved along an entirety of the first track. The tool is moved on the first metal along the second track on the overlapped part while the tool is rotated around the axis and is pressed against the first metal along the axis.

Abstract: A method for manufacturing a bottomed cuboid battery container includes: forming a first member by folding one piece of a first flat sheet, the first member being constructed of a quadrilateral bottom surface and first paired side surfaces, the first paired side surfaces continuing from the bottom surface and being oppose each other; and forming the bottomed cuboid battery container by welding each of a second flat sheet and a third flat sheet to the first member such that the second flat sheet and the third flat sheet oppose each other and constitute second paired side surfaces. The second flat sheet and the first member are welded from one direction. The third flat sheet and the first member are welded from one direction.

Abstract: A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn—Sb)-based solder material having high melting point, the (Sn—Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material or (Sn—Ag—Cu—Bi—In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C.

Abstract: The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer.

Abstract: Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a first interconnector-jig coupling by fixing a plurality of first interconnectors to a jig, locating the first interconnector-jig coupling over a working table, fixing the first interconnectors and a first solar cell to each other, separating the jig from the first interconnectors, and attaching the first interconnectors to the first solar cell by applying heat to the first interconnectors and the first solar cell, which are thereby fixed to each other.

Abstract: A joining method includes a butting process configured to butt a first metal member and a second metal member each having a front surface with various heights to form therebetween a butt portion with various heights; and a welding process configured to apply a friction stirring to the butt portion by a stirring pin of a rotation tool while only the stirring pin of the rotation tool contacts with the first metal member and the second metal member of the butt portion. The welding process may be configured to insert the stirring pin of the rotation tool into the butt portion from front surfaces of the first metal member and the second metal member and apply the friction stirring to the butt portion while an insertion depth of only the stirring pin is kept approximately constant.

Abstract: A method for producing a preliminary material for a cutting tool and such a preliminary member, for example a preliminary material for a saw blade, a saw band, a cutting line, a punching knife, or a blade, wherein at least one first particulate cutting-edge material is applied to a planar carrier, the first particulate cutting-edge material is welded to the planar carrier, and the planar carrier is separated substantially along the weld joint thus produced.

Abstract: The invention relates to a device and a method for detecting the mechanical forces at the welding pin tip during friction stir welding, having the following features: a) a strip-shaped sensor (3) at a long side of a tool cup (9) holding a welding pin pen (12) by way of a pin shaft (13) using a tool receiving cone (14), and also holding a welding shoe (11); b) a conical narrowed portion (20) in the further region of the tool-receiving cone (14), which serves to receive a sensor (18) for detecting the axial force, the torque and the bending moment at the welding pin pen (12); c) a further narrowed portion in the front region of the tool-receiving cone (14), having three sensors (24) distributed across the circumferences at a distance of 120 degrees; d) a sensor signal amplifier having a rotor antenna (19) for receiving, amplifying and forwarding all detected measurement values, said measurement values being forwarded by a static antenna (17) to a machine control; and e) an inductive power supply system.