Abstract: A polylactic acid fiber comprises a blend of poly-L-lactic acid and poly-D-lactic acid and is improved by spinning and then drawing.

Abstract: A filler of non-metallic, light transparent material is formed into particles or flakes and coated with opaque material and dispersed in closed cell foam to reduce overall thermal conductivity and, specifically, to reduce radiation heat transfer.

Abstract: An epoxy fluorocarbon coating composition in the presence of a curing agent and, wherein the fluorocarbon polymer is about 5 to about 24 percent of the total weight of the coating composition and has a particle size less than 500 microns which has excellent corrosion resistance.

Abstract: A lignin dispersion of submicron particles with film forming, binding, and adhesive properties in which the median particle diameter of the lignin in dispersion preferably is less than about 300 angstroms. The aqueous dispersion is formed by reacting about 12 to 18% lignin by weight in aqueous solution with from about 2 to 15 moles ammonia, 4 to 12 moles formaldehyde, and 0.25 to 1.25 moles sodium hydroxide or potassium hydroxide at a temperature of at least about 150.degree. F. for a period of time to produce a colloidal dispersion of lignin particles.

Abstract: Thermal adhesive type coating composition including (A) an emulsion of a thermoplastic synthetic resin having a glass transition temperature of not lower than 60.degree. C., (B) an emulsion of an epoxy resin, (C) an amine base curing agent for the epoxy resin which is capable of reacting with the component (B) when heated, and (D) a film forming assistant agent having solubility in water at 20.degree. C. of not higher than 20 g/100 cc and having solubility therein of water at 20.degree. C. of not lower than 0.5 g/100 cc, the weight ratio of the solid resin contents of the component (A) to those of the component (B) being 60/40 to 98/2, is disclosed. The composition protects a substrate coated with the composition as the coating at ambient temperature and, when heated under pressure application, causes the substrates coated with the composition to be bonded to each other with a strong adhesive strength.

Abstract: An epoxy resin composition comprising an epoxy resin which is solid at room temperature and contains on average more than epoxy group per molecule, and a quaternary pyrrolidinium salt as advancement catalyst.When advanced with compounds containing two phenolic hydroxyl groups, these compositions give excellent products of low viscosity which are suitable, for example, for use in powder resin coating.

Abstract: A curable epoxy resin is blended with (a) an alkenyl group-containing epoxidized novolak resin/organopolysiloxane copolymer and (b) a polyimide resin in addition to a curing agent and an inorganic filler. The resulting epoxy resin composition can be cured both under moisture-free conditions and even under moist conditions without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

Abstract: Heat-curable compositions of matter which are stable on storage and which contain(a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3,(b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5,(c) a diphenol, the amount of the diphenol being so chosen that 0.6-1.2 hydroxyl equivalents of the diphenol (c) are employed per epoxide equivalent of the epoxy resins (a) and (b), and(d) 10-150 parts by weight, relative to 100 parts by weight of the components (a) to (c), of a thermoplastic having phenolic end groups and having a glass transition temperature of at least 150.degree. C. which is compatible with the mixture of the components (a) to (c), are particularly suitable for the production of prepregs for fiber-reinforced composite materials or for the production of adhesive films. The cured shaped articles obtained therefrom are distinguished by a high heat distortion point and excellent mechanical strength properties.

Abstract: Linear, carboxyl functional polyesters suitable for powder coating compositions which also include polyepoxide cross-linking agents are described.

Abstract: The invention relates to novel polyarylethers which are essentially ketonic and which are based on the dibenzofuran molecule. Such polymers are, surprisingly, amorphous, have high Tg's eg>200.degree. C., and have surprisingly high solvent resistance.

Abstract: Disclosed is a process for preparing an epoxy resin containing on average from 1.5 to 2.5 epoxy groups and at least one primary hydroxyl group per molecule, the method comprising reacting, in the presence of an etherification catalyst, tris(2-hydroxyethyl)isocyanurate with a diglycidylether having the general formula ##STR1## wherein R is an alkylene group, a cycloalkylene group, or an alkylene group containing a cyclic moiety.

Abstract: The invention relates to water-dilutable binders for cationic electrocoating finishes. For the preparation of the binders, a di-epoxide compound, together with at least one mono-epoxide compound if desired, is converted by a polyaddition, carried out at 100.degree. to 195.degree. C. and initiated by a monofunctionally reacting initiator carrying either an alcoholic OH group, a phenolic OH group or an SH group, to form an epoxy resin which then subsequently is modified with(A) primary and/or secondary amines or their salts and/or the salt of a tertiary amine, a sulfide/acid mixture or a phosphine/acid mixture and with, if desired,(B) a polyfunctional alcohol, a polycarboxylic acid, a polysulfide or a polyphenol.

Abstract: In a first stage, a lactone is polymerized by an ionic route in vinyl chloride with the aid of a catalyst consisting of the product, optionally complexed with tetrahydrofuran, of the reaction of an alkylmetal with ethylenically unsaturated alcohol, optionally in the presence of water and, in a second stage, the said vinyl chloride is polymerized by a radical route in an aqueous suspension and in the presence of the polymerization medium originating from the first stage, to which other unsaturated monomers are optionally added.The invention also relates to new modified vinyl chloride polymers consisting of lactone polymers whose number-average molecular weight is less than 5,000, grafted with vinyl chloride polymers.

Abstract: The present invention provides an additive for heat-hardenable epoxide resin masses, wherein the additive contains or consists of adducts and/or reaction products of (a) imidazoles of the general formula: ##STR1## in which R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which can be the same or different, are hydrogen atoms, alkyl, alkenyl or alkynyl radicals containing up to 3 carbon atoms or phenyl radicals, said radicals being unsubstituted or substituted, and (b) at least one aromatic hydroxy acid.The additives according to the present invention can be used alone as hardeners or, in combination with other latent hardeners, as accelerators.

Abstract: Novel thermosetting resin compositions comprise a mixture of the epoxyalkylether of a 1,6-diazo[4.4]spirodilactam having a hydroxyaryl substituent on each of the spiro ring nitrogen atoms, and at least one amine compound. The cured compositions obtained by heating the resin compositions to an elevated temperature have relatively high glass transition temperatures and good physical properties.

Abstract: The present invention is the reaction product of an aryl sulfonamide, at least one epoxy compounds comprising at least one diepoxy compound and optionally at least one monoepoxy compound. The diepoxy compound comprises two epoxy groups and the monoepoxy compound comprises one epoxy group. Preferably, the monoepoxy compound and the diepoxy compound have no hydroxyl groups or other functional groups. Specific embodiments include a reaction product derived from at least one monoepoxy compound and at least one diepoxy compound. The reaction product of the present invention has a relatively low molecular weight of from 450 to 2000, preferably 450 to 1000, and more preferably 450 to 800.

Abstract: An epoxy resin composition for semiconductor sealing which comprises, as essential components,(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously,(B) a phenolic resin curing agent,(C) a silica filler, and(D) a curing accelerator.

Abstract: Disclosed in an epoxy resin curative exhibiting extended pot life, lower reactivity at ambient temperatures and increased reactivity at moderately elevated temperatures which comprises from 2 to 10 parts by weight of 1-isopropyl-2-methyl imidazole salicylate per 100 parts by weight epoxy resin. The latent reactive properties make the curative potentially useful in a variety of applications.

Abstract: Epoxy adhesives for bonding automotive parts, particularly those made of BMC of SMC, are improved by incorporating in the adhesive a Mannich Base having more than one primary or secondary amino groups.

Abstract: A method for the preparation of a variety of engineering polymers and copolymers, in particular aromatic polymers and copolymers which comprises reacting a stannylated reactant containing a first monomeric or polymeric moiety with an electrophilic reactant, usually a di(acid chloride) containing a second monomeric or polymeric moiety. The intermediate and second compound react by way of a condensation reaction to eliminate the tin and polymerise together the first and second moieties. Some novel polymers and copolymers can be prepared using this method.