Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.

Abstract: An intelligent grinding device for short pulse electrical melt chip removal cooling, includes a diamond grinding wheel, a pulse power supply, a force meter sensor, thermocouple in a hole of work piece for measuring machining temperature, a voltage sensor, a current sensor, a temperature collecting card, a charge amplifier, a force meter, a digital oscilloscope and a discharge parameter feedback adjustment system. The pulse power supply has a positive pole connecting with the grinding wheel, and a negative pole connecting with the work piece. The voltage sensor and the current sensor respectively put collected discharge voltage and current wave of the discharge circuit to be stored in a display terminal through the digital oscilloscope. The thermocouple connects with the display terminal by the temperature collecting card.

Abstract: Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

Abstract: A chop saw, grinding wheel, or like apparatus is disclosed herein also incorporated to an easily portable dust collection system. In a preferred embodiment, a worktable is provided with a center slot for receiving a circular saw blade. A negative pressure and resulting air flow is provided at the center slot to capture particulate matter as a byproduct of cutting the workpiece. Side slots are also disclosed to assist in particulate collection. A unique filter chamber having a cylindrical filter is additionally provided to remove dust from air and discharge the filtered air at a lateral side of the apparatus. A filter cleaning knob is additionally disclosed to assist in cleaning the filter. Of the beneficial aspects of the chop saw with dust collection system is its portability being one integral unit and the dust filter being easily cleaned and maintained.

Abstract: The present disclosure relates to a technical field of manufacturing a display device, and more particular to a method and a device for controlling a grinding of a flexible substrate. The method includes: grinding an etching side of the flexible substrate; irradiating the flexible substrate with infrared rays or near infrared rays, receiving waves reflected by a side opposite to the grinding side and waves reflected by the grinding side of the flexible substrate respectively, and calculating a distance between the two sides based on the reflected waves; comparing the distance with a predetermined thickness of the flexible substrate in real time, and controlling an extent of grinding by a grinding device based on a difference of the distance from the grinding side to the side opposite to the grinding side of the flexible substrate and the predetermined thickness of the flexible substrate.

Abstract: A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

Abstract: A grinding wheel assembly for use in a sharpening system includes a grinding wheel configured to be mounted in the sharpening system to carry out sharpening operations in which the grinding wheel removes material from a blade to be sharpened, such as the blade of an ice skate. The grinding wheel assembly further includes an identification tag attached to the grinding wheel, the identification tag having (1) secure memory including a usage location for persistently and securely storing a usage tracking value, and (2) interface circuitry for engaging in communication with a transceiver of the sharpening system to enable electronic circuitry of the sharpening system to both read from and write to the usage location to track usage of the grinding wheel for sharpening operations. The memory may also store other data including user-specific system parameters usable to customize operation, and fault information usable to diagnose fault conditions.

Abstract: [Problem] To machine a workpiece such as a hard brittle material or difficult-to-cut material innovatively and accurately and to improve the machining rate significantly. [Solution Means] In grinding a workpiece W by a cup grinding wheel 3 while supplying a slurry 5 containing abrasive grains, the grinding wheel 3 is rotated at low peripheral speed. No more than 500 m/min., preferably 30 to 430 m/min., is appropriate for the peripheral speed of the grinding wheel 3. The slurry 5 at a flow rate of no more than 4.0 ml/cm2/h, preferably of 1.0 to 2.0 ml/cm2/h is dropped or sprayed little by little onto a ground surface of the workpiece W.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.

Abstract: A sanding drum assembly in one embodiment includes at least one elastic friction member defining an outer perimeter, a plurality of feet located inwardly of the at least one elastic friction member, each of the plurality of feet including a movable portion movable between a first position whereat the plurality of feet define a first outermost circumference and a second position whereat the plurality of feet define a second outermost circumference, wherein the second outermost circumference is larger than the first outermost circumference, and an actuator, wherein the plurality of feet and the actuator are configured such that as the actuator and the plurality of feet change from a first configuration to a second configuration, the plurality of feet are forced from the first position to the second position.

Abstract: A machine tool switching device, in particular for portable machine tools, includes at least one switching unit that has at least one movably mounted operating element for actuating a mechanical, electrical, and/or electronic switching element. The machine tool switching device further includes at least one blocking device for blocking at least one movement of the operating element. The blocking device includes at least one movably mounted release element provided to lift the blockage of the operating element. The release element is mounted on the operating element so as to be movable in a translatory manner.

Abstract: A saw blade or a cut-off wheel for an oscillating tool machine includes a base body, wherein the base body has a cutting area and the cutting area is coated with a granulated carbide, wherein the base body is formed in one piece and includes martensitic stainless steel and/or martensitic steel.

Abstract: Polishing materials suitable for polishing hard surfaces, media including the polishing material, and methods of forming and using the polishing materials and media are disclosed. Exemplary polishing materials have a relatively high hard segments:soft segments ratio and exhibit relatively high removal rates and/or relatively high process yields.

Abstract: A buffing pad having a front surface portion, a moisture barrier upon which the front surface is disposed, a compressible foam portion disposed below the moisture barrier, and a rear surface. The front surface portion has a plurality of indentations formed by RF welding and the rear surface has an attachment portion capable of attaching the buffing pad to a power tool. Methods of manufacturing and using a buffing pad.

Abstract: Methods of shaping a glass sheet each include a step of removing a first portion of the glass sheet to form a first beveled surface. The methods further include the step of removing a second portion of the glass sheet to form a second beveled surface. The methods still further include the step of removing a third portion of the glass sheet comprising a remainder of an end surface of an edge portion of the glass sheet. In further examples, glass sheets are also provided with a first bevel surface intersecting a first glass-sheet surface and an apex surface, and a second bevel surface intersecting a second glass-sheet surface and the apex surface. The glass sheet exhibits a probability of failure of less than 5% at an edge stress of 135 MPa.

Abstract: A rotary tool containing a core hub with helical groove on its outer surface filled in with continuous abrasive filament formed by folding of a pre-cut abrasive sheet including multiple bristle like straps extending radially from the hub. The method of manufacturing includes the steps of providing a hub, and forming a helical groove with inverted V-shaped cross-section along its cylindrical surface. An abrasive element is wound around the hub so that the folded edge is fed in the V-grove and is buckled inside the groove providing, along with securing it by sufficient pre-tension of the abrasive element, a secure anchoring of the abrasive element through locking of the buckled edge. The abrasive filament is formed from a roll of abrasive cloth as one continuous piece using a cutting operation and is provided with center-line perforations.

Abstract: A machine tool is provided which comprises a machine base (10), a first support (20,100) mounted on a first rotational machine axis on the base, and a second support (22,102) mounted on a second rotational machine axis on the base. The second rotational axis is parallel to and spaced laterally from the first rotational axis and carries a mount (38,112) moveable relative to the second support along a first linear machine axis orthogonal to the second rotational axis. A control arrangement is operable to control the orientation of the first support on the first rotational axis, and the orientation of the mount relative to the second rotational axis and its location along the linear axis, so as to govern the position and orientation of the first support and the mount relative to each other. Existing machine tools often use long linear guide rails and stacked orthogonal axes which introduce alignment and offset errors.

Abstract: An apparatus for mounting one or two handheld type orbital thereto is described to permit a user to sand a floor surface from a standing position while moving the mounted sander(s) to and fro by way of a broom handle extending from the apparatus. Typically, the apparatus includes one fixed mount and one moveable mount. Each mount is configured to facilitate attachment to an orbital sander. The moveable mount can be placed and secured in one of two positions: A first position that centers a single sander in line with the handle and a second position wherein the fixed mount is located to one side of the handle and the moveable mount is secured essentially an equal distance on the other side of the handle.