Abstract: A device and method to aid in lapping a spherical washer to a steam turbine component are provided. The device includes a drive head, the drive head made up of a drive cap and a hollow cylindrical portion projecting from the drive cap. The drive cap abuts a surface of the spherical washer. The cylindrical portion fits within and is concentric to an inner diameter of the spherical washer. The device also includes an expanding gasket including an outer diameter having a contour configured to fit a contour of an inner diameter of the spherical washer and an inner diameter slides onto the cylindrical portion such that the gasket and cylindrical portion are concentric. The drive head attaches to a drive unit which imparts a torque to lap the spherical washer with respect to a steam turbine component. The expanding gasket expands and holds the spherical washer during the lapping.

Abstract: Embodiments herein provide a high stability saw chain comprising a first drive link including a first mating surface; a second drive link including a second mating surface; a first tie strap coupling the first drive link to the second drive link; wherein the first mating surface of the first drive link is configured to contact the second mating surface of the second drive link when the first and second drive links traverse an elongate portion of a guide bar to prevent reverse articulation of the saw chain less than a minimum radius of 20 inches.

Abstract: A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

Abstract: A method for forming track(s) on low temperature co-fired ceramic (LTCC) substrate, the method comprising the steps of, forming a layer of coating material on an operative face of the LTCC substrate, disposing a stencil on the layer of coating material thereby covering a selected portion of the layer of coating material while leaving exposed a portion of the layer of coating material corresponding to the track(s) to be formed and forming an assembly of the LTCC substrate, the layer of coating material and the stencil, eroding the exposed portion of the layer of coating material by propelling an abrasive material using a blasting gun towards the assembly on the face on which the layer of coating material is formed and the stencil is disposed and separating the stencil from the abraded assembly, wherein the abrasive material has a composition that is compatible with that of the LTCC substrate.

Abstract: A blade holder tool is disclosed for a user to hold a skate blade and insert the skate blade into a sharpener unit for a sharpening operation. The blade holder tool includes an upper portion graspable by a user to hold the blade holder tool and place the blade holder tool in an inserted position in the sharpener unit. It further includes a lower blade-engaging portion that grasps the skate blade and locates the skate blade in a sharpening position in the sharpener unit.

Abstract: A machine (12) for cutting slabs, comprises a workpiece support bench (14) adapted to support at least one slab, and cutting means for automated cutting of the slab on the bench. The cutting means comprise two lateral support structures (16, 18). A first beam (20) is adapted to move along said lateral support structures (16, 18). The first beam (20) is adapted to slide on the lateral support structures (16, 18) via its ends (22, 24) and guiding means (25, 26) provided on the lateral support structures (16, 18). The first beam (20) is provided with a first carriage (28) adapted to be moved along the first beam (20). A first sleeve (30) adapted to be moved towards or away from the workpiece support bench (14) is provided on the first carriage (28). A first machining head (32) comprising a first cutting spindle (34) is provided on the first sleeve (30). A second beam (201) is adapted to move along the lateral support structures (16, 18).

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate and a bottom surface, the bottom surface having a plurality of channels extending from an outer surface to the inner surface, and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad, wherein the contact area is about 15-40% of a plan area of the bottom surface.

Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.

Abstract: The present invention is a nozzle assembly having a nozzle main body including an ejection material suction port and an ejection port which ejects the ejection material with the compressed air, and an air nozzle which jets the compressed air into the nozzle main body. The nozzle main body includes a mixing chamber which mixes the ejection material with the compressed air, a first pathway directed from the ejection material suction port toward the mixing chamber, and a second pathway directed from the mixing chamber toward the ejection port. The air nozzle includes a compressed air jet portion and a third pathway directed to the compressed air jet portion, and the third pathway is inserted into the nozzle main body. The compressed air jet portion of the air nozzle is provided with a flow contracting portion having an opening.

Abstract: A roll grinding apparatus may comprise a frame, first and second rolls rotatably mounted on the frame in proximity to each other to grind materials passing between the rolls, and first and second motors to rotate the first and second rolls respectively. A control apparatus controls operation of at least one of the motors. The control apparatus may be configured to control the speed of the second roll by providing power to the second motor or braking the second motor through regeneration of energy from the second motor.

Abstract: A polishing brush (1) includes a brush-shaped grindstone (12) holding grinding element bundles (11) of wire-shaped grinding elements (27) in an annular shape and a grinding element displacement-restricting member (13) for restricting displacement of the grinding element bundles (11) outward. The brush-shaped grindstone (12) has a grinding element holder (15) holding the base end portions (upper end portions) of the grinding element bundles (11). The grinding element displacement-restricting member (13) has an annular part (33) surrounding the wire-shaped grinding elements (27) from the outer peripheral side at a position between the tip ends of the wire-shaped grinding elements (27) and the grinding element holder (15) in the direction of the axis of center of rotation (L) and at a distance away from the tip ends of the wire-shaped grinding elements (27) and the grinding element holder (15).

Abstract: An automated station (1) for the finishing of brake pads (4) comprises at least one rotary finishing tool (2) for finishing a friction layer (22) of the brake pad (4), a workhead (3) to pick, retain and release the brake pad (4), a handling unit (6) to move the workhead (3) along a programmable path comprising a pass over the rotary finishing tool (2) and a guide (5) having a mouth (27) which is passed through by the workhead (3) in order to start the finishing pass along the length of the programmable route, the guide (5) contacting the workhead (3) to define, along at least one direction (A; C), the relative position between the workhead (3) and the brake pad (4) during the finishing carried out by the rotary finishing tool (2).

Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

Abstract: An abrading device includes a funnel and an outlet orifice disposed within the funnel for passage of abrasive material, where a distance between the outlet orifice and a bottom end of the funnel is adjustable. An exhaust tube is coupled to the funnel for withdrawal of spent abrasive material from the funnel.

Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average to molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine or bismuth neodecanoate, all weight percent's based on the total solids weight of the reaction mixture.

Abstract: Apparatuses and systems that enable selective removal of protective coatings from substrates are disclosed. Such a material removal system may use pressurized solid carbon dioxide (CO2) (i.e., dry ice) to remove a selected portion of a protective coating from a substrate. The material removal system may include one or more templates that provide selectivity in removing protective coatings from one or more substrates, fixtures for holding one or more substrates in place while material removal processes occur and apparatuses for positioning one or more substrates at desired locations in material removal systems.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: A method for manufacturing a face seal may generally include positioning a machining device relative to the face seal such that the face seal is compressed between a machining surface of the machining device and a support member on which the face seal is supported. In addition, the method may include removing material from a seal flange of the face seal using the machining device while the face seal remains compressed between the machining device and the support member and monitoring a compressive load applied through the face seal as material is being removed from the seal flange. Moreover, the method may include adjusting the operation of the machining device to prevent further removal of material from the seal flange when the monitored compressive load is equal to a predetermined load setting.

Abstract: The present invention provides an apparatus and method for processing a component surface by abrading the component surface using an abrasive surface. The apparatus comprises an abrasive surface which is rotatable about an axis extending parallel to said component surface. A support is provided for moving the abrasive surface or the component surface along a computer-generated toolpath and for applying a force between the abrasive surface and the component surface. The support increases the force between the abrasive surface and the component surface from a minimum force to a maximum force as the distance along the toolpath increases to maintain constant material removal from the component surface.