Patents Examined by Eileen P. Morgan
-
Patent number: 11826881Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.Type: GrantFiled: May 14, 2021Date of Patent: November 28, 2023Assignee: Seagate Technology LLCInventors: Mihaela Ruxandra Baurceanu, Chea Phann, Kevin Lamber Mayer, Ricky Ray Anderson, Andrew David Habermas
-
Patent number: 11826868Abstract: Apparatuses and associated methods for polishing side surfaces of fibers. The system includes a fiber loading mechanism for securing a fiber to the apparatus, a polishing mechanism, and a linear motion mechanism for linearly translating one of the polishing mechanism and the fiber for polishing a side surface of the fiber using the polishing mechanism.Type: GrantFiled: December 12, 2018Date of Patent: November 28, 2023Assignee: United States of America as represented by the Secretary of the Air ForceInventors: Hyunjun Kim, Randall G. Corns, Randall S. Hay, Augustine M. Urbas
-
Patent number: 11826882Abstract: A shot blasting wheel for use with a shot blasting machine configured to propel abrasive shot against a workpiece. The shot blasting wheel includes a circular body member defining a plurality of slot openings a front surface defines a plurality of slots. Each slot and slot opening has a dovetail configuration. The shot blasting wheel includes a plurality of blade assemblies, each including a paddle positioned in a respective slot via insertion through a respective slot opening. Each blade assembly also includes a locking lever pivotally coupled to the body member and pivotally movable between a locked configuration preventing removal of the paddle from the respective slot and a released configuration allowing removal. Further, each blade assembly includes a dual spring assembly having a lever spring tensioned and biased for movement between extended and released configurations and having a paddle spring configured to resist a paddle lug.Type: GrantFiled: December 27, 2022Date of Patent: November 28, 2023Inventor: Paul Enegren
-
Patent number: 11806798Abstract: A method which is executed in a grinding machine comprising a) rotationally driving a cup grinding wheel around an axis of rotation of a tool spindle at a first speed, b) rotationally driving a dressing tool around an axis of rotation of a dressing spindle at a second speed, c) carrying out a dressing method using the dressing tool, wherein a predetermined, fixed speed ratio is specified between the first speed and the second speed, and after steps (a), (b), and (c): i. eccentrically rotationally driving the cup grinding wheel around the axis of rotation of the tool spindle at a first machining speed using the eccentric drive, ii. carrying out a grinding method, wherein the bevel gear workpiece is machined by grinding using the cup grinding wheel.Type: GrantFiled: January 8, 2018Date of Patent: November 7, 2023Assignee: KLINGELNBERG AGInventor: Rolf Schalaster
-
Patent number: 11787011Abstract: Disclosed is a grinding wheel for online measurement of a grinding force, including a grinding wheel part with a grinding wheel base, CBN abrasive sheets and grinding wheel cover plate, and an acquisition part with tangential, axial, radial strain gauges and a signal unit for signal acquisition and transmission. A concave side end face of the grinding wheel base is provided with a signal unit mounting groove, the grinding wheel cover plate is sealed with the concave side end face, and the CBN block abrasive sheets are bonded on an outer circumferential surface of the grinding wheel base; the tangential, axial and radial strain gauges are respectively arranged on the outer circumferential surface along tangential and axial directions and in the signal unit mounting groove along radial direction; signal output ends of the tangential, axial and radial strain gauges are respectively connected with an input end of the signal unit.Type: GrantFiled: January 16, 2023Date of Patent: October 17, 2023Assignees: Xi'an Jiaotong University, Shanghai United Bearing Co., Ltd.Inventors: Jun Zha, Shidong Ge, Lai Hu, Wenliang Shen, Shubei Wang, Xiaoying Song
-
Patent number: 11780046Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.Type: GrantFiled: August 25, 2022Date of Patent: October 10, 2023Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
-
Patent number: 11780056Abstract: The presented solution discloses conduit arrangements in an intermediate pad (20, 100), a backing pad (10, 200) and an abrading article (300, 400). The conduit arrangements enable controlled conveyance of air onto and extraction of air and debris from the surface of an intermediate pad (20, 100), a backing pad (10, 200) and an abrading article (300, 400). The presented solution is an intermediate pad (20, 100) suitable for use in an abrading system. The presented solution is an abrading system comprising an intermediate pad (20, 100). The presented solution is a backing pad (10, 200) suitable for use in an abrading apparatus (1). The presented solution is an abrading system comprising a backing pad (10, 200). The presented solution is an abrading article (300, 400) suitable for use in an abrading system. The presented solution is an abrading system comprising an abrading article (300, 400). The presented solution further relates to methods of using an abrading system for extracting abrading debris.Type: GrantFiled: February 13, 2017Date of Patent: October 10, 2023Assignee: Mirka LtdInventors: Stig Finnäs, Simon Bäck
-
Patent number: 11780048Abstract: The present disclosure includes barrier devices for use in an apparatus used to form lapping plates. The barrier devices can contain liquid on the surface of the lapping plate platen. The present disclosure also involves related methods.Type: GrantFiled: May 7, 2020Date of Patent: October 10, 2023Assignee: Seagate Technology LLCInventors: Chea Phann, Ricky Ray Anderson, Kevin Lambert Mayer, Mihaela Ruxandra Baurceanu, Andrew David Habermas, Raymond Leroy Moudry, Joel William Hoehn
-
Patent number: 11772233Abstract: A grinding robot for grinding an electrically conducting workpiece. The grinding robot includes a grinding wheel, an actuation device for actuating grinding wheel, and a control system. The grinding wheel including an undulated tool receptacle which defines an axis of rotation about which the grinding wheel can rotate during grinding, and a head which is rotationally symmetrical with respect to the axis of rotation, and which contains abrasive material and has a grinding surface which is in contact with workpiece during grinding. The grinding wheel also includes a measuring and transmission unit and at least one conductor strand pair with two conductor strands which are electrically insulated from one another. The conductor strands are embedded in the rotationally symmetrical head and extend from the grinding surface of the head into the interior of the head and are electrically connected with measuring and transmission unit.Type: GrantFiled: July 23, 2019Date of Patent: October 3, 2023Assignee: Voith Patent GmbHInventors: Martin Rohrer, Florian Weigl, Stefan Karner
-
Patent number: 11759907Abstract: A tire grinding machine includes a frame having a plurality of vertically extending posts. A chuck assembly is associated with the frame and adapted to receive and rotate a tire. A grinding assembly is associated with the frame and is movable with respect to the frame. The grinding assembly has at least one grinding element adapted to contact and remove material from the tire when rotated by the chuck assembly. A counterbalance assembly which has a cable with one end connected to a counterbalance weight and an opposite end connected to the grinding assembly is included. A block assembly may be coupled to the grinding assembly to allow pivotable movement thereof. A calibration adapter may be used to ensure proper positioning of the grinding elements, wherein a level adjuster may be used for this purpose.Type: GrantFiled: September 10, 2019Date of Patent: September 19, 2023Assignee: AKRON SPECIAL MACHINERY, INC.Inventors: Charles A. Lint, Brian D. Mitchell, William P. Laughlin
-
Patent number: 11759077Abstract: The present invention relates to a floor surfacing machine (1) comprising a frame (2) that is carried by a first wheel (3) and a second wheel (4). The floor surfacing machine (1) further comprises a first motor (6), a handle arrangement (7), at least one planetary head (15) that is rotatably mounted to the frame (2) and at least one satellite surfacing head (19, 20, 21) that is rotatably mounted to the planetary head (15), where the first motor (6) is arranged to propel the planetary head (15). The floor surfacing machine (1) comprises a first control unit (10), and a remote control panel (11) which in turn comprises a second control unit (12) that is arranged to communicate with the first control unit (10). The floor surfacing machine (1) also comprises a second motor (22) that is arranged to propel the satellite surfacing heads (19, 20, 21) such that the planetary head (15) and the satellite surfacing heads (19, 20, 21) are independently operable.Type: GrantFiled: June 23, 2020Date of Patent: September 19, 2023Assignee: HUSQVARNA ABInventors: Johan Berg, Magnus Rosén, Lars Freidlitz, Pär Madbro, Joakim Leff-Hallstein
-
Patent number: 11745310Abstract: Disclosed herein are systems and methods for improving the performance of a fluid jet cutting system by testing and adjusting characteristics of the system based on the effect of the characteristics on forces imparted by the system to a workpiece being cut. Also disclosed are systems and methods for monitoring and validating the performance of fluid jet cutting systems, and for diagnosing such systems. In some cases, the technologies described herein can be used to determine whether components of a fluid jet system require maintenance, or that characteristics of the system require adjustment.Type: GrantFiled: August 2, 2022Date of Patent: September 5, 2023Assignee: Flow International CorporationInventors: Charles D. Burnham, Mohamed A. Hashish
-
Patent number: 11724357Abstract: A carrier head includes a base assembly, a substrate mounting surface connected to the base assembly, a plurality of segments disposed circumferentially around the substrate mounting surface to provide a collet retaining ring to surround a substrate mounted on the substrate mounting surface, and an outer ring that is vertically movable relative to the plurality of segments. An inner surface of the collet retaining ring is configured to engage a substrate, and the collect retaining ring and outer ring are configured such that vertical motion of the outer ring controls motion of the collet retaining ring between a clamping and unclamping position.Type: GrantFiled: November 11, 2022Date of Patent: August 15, 2023Assignee: Applied Materials, Inc.Inventors: Steven M. Zuniga, Jay Gurusamy, Andrew J. Nagengast
-
Patent number: 11724353Abstract: Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 ?in.Type: GrantFiled: June 7, 2022Date of Patent: August 15, 2023Assignee: Applied Materials, Inc.Inventors: Jennifer Y. Sun, Vahid Firouzdor, David Koonce, Biraja Prasad Kanungo
-
Patent number: 11717928Abstract: An adjustable sharpener including a body having two sharpening slots, a first arm with a first abrasive element connected to a second arm with a second abrasive element, and a third arm with a third abrasive element connected to a fourth arm with a fourth abrasive element. The first and second abrasive elements are positioned in the first sharpening slot, and the third and fourth abrasive elements are positioned in the second sharpening slot. The adjustable sharpener also includes an adjuster connected to the body and an adjustment assembly connected to the adjuster, the first arm and the third arm. Linear movement of the adjuster causes rotational movement of the first arm and the third arm. In this regard, the adjuster allows the user to manually increase or decrease the sharpening angle between the abrasive elements in the sharpening slots.Type: GrantFiled: January 12, 2022Date of Patent: August 8, 2023Assignee: Smith's Consumer Products, Inc.Inventors: Louis Chalfant, Ricky L. Dukes
-
Patent number: 11712782Abstract: An abrasive head with clean gas infeed for cleaning/removing material surfaces and splitting/cutting materials by a liquid beam enriched with solid abrasive particles to extend the tool lifetime by eliminating damage to the liquid jet's aperture by the abrasive, avoid degrading the abrasive inside the tool and increase the cutting power and flow efficiency.Type: GrantFiled: May 20, 2019Date of Patent: August 1, 2023Inventors: Jiri Mestanek, Zdenek Riha
-
Patent number: 11712776Abstract: A rotor polishing device, including a housing with a space therein for holding rotors in need of polishing, an inlet for pumping a polishing lapper into the housing, and a rotational assembly for rotating the rotors during the polishing process. The rotor polishing device is useful for polishing rotors commonly used by rotary screw compression systems.Type: GrantFiled: February 4, 2019Date of Patent: August 1, 2023Inventors: Terry Sullivan, Casey Sullivan, Stacie Armes
-
Patent number: 11697185Abstract: An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.Type: GrantFiled: June 5, 2020Date of Patent: July 11, 2023Assignee: 3M Innovative Properties CompanyInventors: Duy K. Lehuu, Noah O. Shanti, Junqing Xie, Kathryn R. Bretscher
-
Patent number: 11691243Abstract: A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves, a first material property of the first region varies in a thickness direction of the polishing pad, each of the plurality of first grooves extends through at least two variations in the first material property, and the first material property comprises porosity, specific gravity or absorbance. The method further includes spreading the slurry across a second region of the polishing pad at a second rate different from the first rate, wherein the second region comprises a plurality of second grooves.Type: GrantFiled: November 19, 2020Date of Patent: July 4, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: ChunHung Chen, Jung-Yu Li, Sheng-Chen Wang, Shih-Sian Huang
-
Patent number: 11685013Abstract: A polishing pad includes a pad layer and one or more polishing structures over an upper surface of the pad layer, where each of the one or more polishing structures has a pre-determined shape and is formed at a pre-determined location of the pad layer, where the one or more polishing structures comprise at least one continuous line shaped segment extending along the upper surface of the pad layer, where each of the one or more polishing structures is a homogeneous material.Type: GrantFiled: July 2, 2018Date of Patent: June 27, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih Hung Chen, Kei-Wei Chen, Ying-Lang Wang