Abstract: An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

Abstract: A device for smoothing a working edge of a squeegee tool that is used for application of film substrates to glass surfaces; the device having a main body including a base and opposing first and second panels extending away from the base and diverging away from one another to define an open mouth, and a fabric sheet secured to the main body at opposite end portions, and the fabric sheet including a central portion received within the open mouth and formed in a V-shape transverse configuration, wherein the working edge of the tool is moved longitudinally between the opposing panels and in frictional engagement with a top surface of the fabric sheet at a bottom of the V-shape to effectively remove bumps, nicks and scratches on the working edge of the tool.

Abstract: An improved structure of water mill has a body provided with a handle part, a body part, a working head base and a pressing control switch. The handle part is provided with an intake passage, an exhaust passage, and a water inlet reversing passage. By triggering the pressing control switch, a high-pressure gas is guided into the intake passage and the body to drive the water grinder. A water pump gas outlet is provided with a double sleeve tube connected to a sealed water storage tank. The discharged high-pressure gas is guided into the sealed water storage tank through the outer tube of the double sleeve tube, so that the stored water is pressed back to the double sleeve tube and is simultaneously guided into the water inlet reversing passage. Finally, the water is guided out to the working head base, with simultaneous grinding and water cooling.

Abstract: A chemical mechanical polishing method is provided, including polishing a batch of wafers in sequence on a polishing surface of a polishing pad; conditioning the polishing surface with a pad conditioner, wherein the pad conditioner is operable to apply downward force according to a predetermined downward force stored in a controller to condition the polishing surface; measuring the downward force applied by the pad conditioner with a measurement tool when the pad conditioner is at a home position and after conditioning the polishing surface; comparing the downward force measured by the measurement tool and the predetermined downward force with the controller to determine whether a difference between the downward force measured by the measurement tool and the predetermined downward force exceeds a range of acceptable values; and calibrating the downward force applied by the pad conditioner with the controller when the difference exceeds the range of acceptable values.

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.

Abstract: A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.

Abstract: System for reduction of dimensional end-taper in abrasive blasted tubes has a pressurized chamber maintaining higher air pressure inside the chamber than atmospheric pressure, an air-exit port allowing gases to exit the chamber at a controlled rate, a valve restricting passage of gases from the air-exit port, a pressurized membrane through which the tube passes creating a seal, a gauge port where pressure inside the pressurized chamber is monitored and a media-exit port allowing evacuation of abrasive blast media particles after being expelled from the exit-end of the tube. The system addresses dimensional end-taper as high back pressure at the exit end of the tube reduces velocity of the gases and abrasive particles carried in it, thereby reducing erosion of the inner walls of the tube near its exit end. The system can be employed with a wide range of tube sizes and in combination with several abrasive blasting techniques.

Abstract: A wheel weight-reducing pit cleaning device is provided. The wheel weight-reducing pit cleaning device comprises a lower lifting driving system, a side brush system, a ring brush unit, a ring brush system, a clamping driving system, a pressing system. The weight-reducing pit cleaning device is used for cleaning and removing the edge burrs of the drainage groove and the weight reduction groove at the wheel weight reduction pit.

Abstract: The present invention discloses a grinding cavity body of multiple vibration sources, in which a plurality of ultrasonic vibration sources are disposed, capable of controlling the multi-directional macroscopic medium flow, making benefits to the vibration medium (the abrasive of the slurry) to enter the fine structure of the workpiece to be processed, and to the abrasive to vibrate itself slightly to enhance the performance of abrasive to the workpiece which needs to be ground.

Abstract: A powder chamber, in particular for powder polishing devices, including a casing and two functional sectors, whereby the two functional sectors are arranged to be opposite to each other, and whereby at least one functional sector is designed to provide an opening for a working medium such as air or a mixture of powder and air, and whereby the two functional sectors are designed to allow the powder chamber to be locked. The two functional sectors are preferably arranged along an axis and are rotationally symmetric.

Abstract: Provided is a centrifuge media separator for separating blast particulate from fine particulate carried by air flowing from a blast cabinet and through the media separator. The centrifuge media separator comprises an upper panel, a lower panel, and an outer wall. The upper panel has a central opening formed therein. The outer wall is configured in a truncated logarithmic shape and which extends between the upper and lower panels. The outer wall has at least one particulate escape aperture formed therein. The upper panel, lower panel and outer wall collectively define a curvilinear air passageway having an inlet and an outlet. An air foil extends from the outer wall in to the air passageway. The distance than the air foil extends in to the air passageway is adjustable. The inlet is configured to allow a flow of air to enter the air passageway and circulate therethrough toward the outlet. The escape aperture is configured to exhaust the blast particulate out of the passageway.

Abstract: The present invention discloses a multi-dimensional vibration grinding cavity body. By adjusting amplitudes (power) and frequencies of the multi-dimensional ultrasonic vibration source, such that the multi-directional macroscopic flow is formed in the cavity body while keeping the vibration medium to have the original characteristics to improve the performance of grinding of slurry.

Abstract: A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.

Abstract: An enclosure assembly includes a pan that includes at least one shaft opening. A shroud at least partially surrounds the pan. The shroud extends transversely relative to the pan. A skirt surrounds a perimeter of the shroud and is moveable relative to the shroud.

Abstract: Examples are directed to an approach to specifying design guidelines for fabricating a free-form optical component, and methods of fabricating the free-form optical components. In one example, a family of optical prescriptions is created, and a fabricator may manufacture the free-form optical element to any selected prescription within the family. According to certain examples, the series of prescriptions in the family each describe a very similar optical surface providing the same or similar optical performance, and are layered relative to one another such that the thickness of the optical element at any point is slightly less for each subsequent surface defined by the next prescription in the series.

Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.

Abstract: Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

Abstract: A device for removing wheel burrs with first brushes and second brushes includes a wheel positioning and pressing system configured to position and press of the wheel, a center cap mouth burr removing system configured to remove burrs of the wheel cap mouth with the second brushes, and a wheel spoke back cavity burr removing system configured to remove burrs of the wheel spoke back cavity with the first brushes. The first brushes are mounted on an expandable first capsule and the second brushes are mounted on an expandable second conical capsule, and filling the expandable first capsule and the expandable second conical capsule with air and removing air from the expandable first capsule and the expandable second conical capsule change the shapes of the first brushes and the second brushes to accommodate wheels with different shape and size for deburring.

Abstract: A meshed shell and a sandblasting method are provided. The meshed shell includes a first end portion, a second end portion opposite to the first end portion, a first annular portion, a second annular portion connected to the first annular portion, a first mesh portion between the first end portion and the first annular portion and a second mesh portion between the second end portion and the second annular portion. The weights of the first end portion and the second end portion are the same. A maximum inner diameter of the mesh of the first and second mesh portions is smaller than a penetration size of the component. Both of the sum of the weights of the first and second end portions and the sum of the weights of the first and second annular portions are greater than the sum of the weights of the first and second mesh portions.

Abstract: Provided are a membrane and carrier head using the membrane for polishing apparatus. The membrane comprises a first fixing flap extending inwards from the upper part of a side portion, a second fixing flap extending upwards from the upper part of the side portion, wherein the second fixing flap has a first inclined part, a second inclined part and a third extending part of extending upwards whereby a compensation force generated by the inclined parts realize the constant pressing force to the edge of a substrate during a polishing process.