Abstract: A grinding machine includes a base having a plate and a movable device which is connected to the plate. A driving unit is connected to one end of the base and includes having a first motor which has a hollow shaft. An oval hole is defined in the hollow shaft. A grinding unit is located across the top of the plate and includes a body and a grinding part. The grinding part is slidably connected to a slot of the body and has a shaft unit which is located in the oval hole of the hollow shaft. A transverse moving unit is connected to the grinding part and has a second driving motor. A cam link is connected between the driving motor and the grinding part. The grinding part is moved transversely relative to the plate by the cam link driven by the second driving motor.

Abstract: The present subject matter relates to a method and an apparatus in the form of a machine system (1200) for machining a component (100) with an internal passage (115). In an aspect, the method comprises periodically injecting 5 abrasive slurry back and forth through the internal passage (115) at a pressure ranging from about 25 bar to about 35 bar. The abrasive slurry comprises a mixture of abrasive particles having a size in the range of about 40 ?m to about 60 ?m, and a slurry medium. The volume fraction of the abrasive particles in the slurry medium is about 40% to about 50%. Further, the injection of the abrasive 10 slurry is performed for a predefined number of process cycles at predetermined time versus pressure changes to obtain the component having a final average surface roughness of less than about 3.0 ?m.

Abstract: A blade sharpening system for log saw machines is provided. An example multiphase grinding wheel has a grinding face with one or more abrasive concentric rings for sharpening the cutting blade of the log saw machine, and one or more padded concentric rings consisting of fiber padding. Sharpening with the multiphase grinding wheel improves cut quality, increases blade life, removes glues and varnishes from the cutting blade, reduces blade deformation, and hones the edge of the cutting blade. A pneumatic tensioning system uses air bladders to apply a dynamically cushioned pressure between the grinding wheels and the cutting blade. The fiber-padded grinding wheels and the air bladder tensioner provide improved sharpness of the cutting blade and longer life for the mechanical components. The padded grinding wheels decrease fire risk, and the tensioner can be operated remotely, decreasing human injuries common with conventional setup actions near the sharp cutting blade.

Abstract: An end point detection method is provided for detecting an end point based on a drive current supplied to a drive unit that rotates and drives one of a polishing table and a holding unit. The end point detection method includes: a step (S102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (S103) of adjusting a current control parameter in a drive control unit that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (S105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter.

Abstract: A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

Abstract: A grinding tool for machining an inside surface of a cylinder bore in a workpiece, the grinding tool having an axis of rotation, a grinding region which is cylindrical with respect to the axis of rotation and a conical grinding region axially adjoining the cylindrical grinding region. A diameter of the conical grinding region increases starting from the cylindrical grinding region in an axial direction with respect to a diameter of the cylindrical grinding region.

Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.

Abstract: A compact angle reference apparatus comprises one angle guide; and a base; wherein the one angle guide can be disposed on the base; wherein the base can be disposed on a surface adjacent to a sharpening tool; wherein the one angle guide further comprises a frame having an insert side and a hinge side, a lid having a guide surface, an insert end, and a hinge end opposite to the insert end, a set of hinge pins connecting the hinge side of the frame and the hinge end of the lid in a rotatable manner, an insert having a predetermined height, wherein the insert is movable, wherein the insert is configured to be erected between the insert end of the lid and the insert side of the frame, wherein the lid and the frame can form an angle by the predetermined height of the insert.

Abstract: A wafer polishing method of polishing one surface of a wafer by rotating a rotating platen to which a polishing pad is affixed and a pressurizing head while supplying slurry onto the rotating platen and pressurizing/holding the wafer on the polishing pad with the pressurizing head, the method including: calculating an F/T value by monitoring a load current value F of a motor for rotating the rotating platen and a surface temperature T of the polishing pad during the wafer polishing; and controlling at least one of the rotation speed of the rotating platen and the polishing pressure of the pressurizing head based on the calculated F/T value.

Abstract: The present application discloses a multifunctional wheel burr removing device, comprising a synchronous clamping drive system, a first burr brushing system, an upper burr brushing system and a second burr brushing system. The multifunctional wheel burr removing device in use may remove burrs of four parts. And the four parts are as follows: end faces of upper rims, wheel wells, cutting positions of sides of upper rims and fronts of wheels having different diameters and different heights. So the production efficiency is very high; and simultaneously, the device has the characteristics of high automation degree, advanced process, strong generality, safety and stability.

Abstract: A semiconductor wafer provided with a pseudo chip between a product chip and a pattern prohibiting region is prepared. With the edge portion of the semiconductor wafer left, the bottom surface of the inner semiconductor substrate is ground, and then, the semiconductor wafer is cut in a ring shape to remove the edge portion. Here, in the pseudo chip, a protective film covering the conductive pattern is formed on the top surface of the semiconductor substrate and the end surface of the protective film facing the pattern prohibiting region is positioned on the conductive pattern. Further, in plan view, the inner peripheral end of the edge portion is positioned in the pattern prohibiting region, and the pattern prohibiting region between the inner peripheral end of the edge portion and the pseudo chip is cut in a ring shape.

Abstract: The present invention relates to a floor surfacing machine (1) comprising a frame (2) that is carried by a first wheel (3) and a second wheel (4). The floor surfacing machine (1) further comprises a first motor (6), a handle arrangement (7), at least one planetary head (15) that is rotatably mounted to the frame (2) and at least one satellite surfacing head (19, 20, 21) that is rotatably mounted to the planetary head (15), where the first motor (6) is arranged to propel the planetary head (15). The floor surfacing machine (1) comprises a first control unit (10), and a remote control panel (11) which in turn comprises a second control unit (12) that is arranged to communicate with the first control unit (10). The floor surfacing machine (1) also comprises a second motor (22) that is arranged to propel the satellite surfacing heads (19, 20, 21) such that the planetary head (15) and the satellite surfacing heads (19, 20, 21) are independently operable.

Abstract: A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 ?m.

Abstract: An angle grinder includes a housing formed with a handle, a clamping device for mounting a grinding disk, an output shaft for driving the clamping device to rotate, a brushless motor being provided with a motor shaft, a transmission mechanism for transmitting power between the motor shaft and the output shaft, and a circuit board assembly for providing electricity to the brushless motor. The clamping device is disposed outside of the housing and connected with the output shaft. The output shaft is at least partially disposed inside of the housing and connected with the transmission mechanism. The brushless motor is arranged between the transmission mechanism and the circuit board assembly in a direction substantially parallel to the motor shaft, and the motor shaft is disposed along a direction substantially perpendicular to the output shaft.

Abstract: An abrasive article includes a first abrasive element, a second abrasive element, a resilient element having first and second major surfaces, and a carrier. The first element and the second abrasive element each comprises a first major surface and a second major surface. At least the first major surfaces of the first and second abrasive elements comprise a plurality of precisely shaped features. The abrasive elements comprise substantially inorganic, monolithic structures.

Abstract: A magnetic field manipulated localized polishing system includes a container holding a volume of a magnetic abrasive fluid. The magnetic abrasive fluid contains abrasive particles. A motor is positioned under the container. A magnet is coupled to the motor such that the motor induces rotation of the magnet. A workpiece is suspended in the container.

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract: A polishing or grinding pad with a multilayer reinforcement is provided. In one aspect, a floor polishing or grinding pad assembly employs a flexible pad, at least two reinforcement layers or rings with different characteristics, and multiple floor-contacting tools such as abrasive disks. In another aspect, a workpiece polishing or grinding pad assembly includes a flexible and rotatable pad, a polymeric reinforcement layer coupled to the pad and a metallic reinforcement layer to which are coupled abrasive tools. In yet another aspect, a floor-facing reinforcement is more flexible than a pad-facing reinforcement which is more rigid.

Abstract: To provide an alumina sintered body, abrasive grains, and a grinding wheel having high hardness and excellent wear resistance. An alumina sintered body comprising: an inner layer comprising alumina crystal grains; and an outer layer covering at least a part of the inner layer from outside, having a higher content of an alkaline earth metal than the inner layer, and comprising alumina crystal grains, wherein the content of the alkaline earth metal in the outer layer is 1.0 to 30.0 mass % in terms of oxide, the alumina sintered body being free from silicon except unavoidable impurities.

Abstract: A pool cleaning tool includes a front housing and a rear housing coupled together, an intake, an outlet, a turbine disposed within the front and rear housings, and a three-way diverter valve proximate the intake. The tool includes an abrasive member, rigidly coupled to the turbine, mounted outside the front and rear housings for rotation with the turbine. The three-way diverter valve has an on position in which water drawn into the intake is communicated into the tool, up to the turbine, and then out the outlet, thereby imparting rotation to the turbine and to the abrasive member.