Patents Examined by Eileen P. Morgan
  • Patent number: 11040427
    Abstract: A method of processing a workpiece which includes metal in a work surface by a processing unit including a grindstone or a polishing pad includes a processing step of grinding or polishing the workpiece by the processing unit while supplying a processing fluid to the work surface of the workpiece. The processing fluid contains an organic acid and an oxidizing agent.
    Type: Grant
    Filed: March 11, 2015
    Date of Patent: June 22, 2021
    Assignee: DISCO CORPORATION
    Inventor: Kenji Takenouchi
  • Patent number: 11040430
    Abstract: The present disclosure relates to abrasives surfaces located on an outer diameter of a grinding wheel to provide grinding characteristics of both coarse and fine abrasive textures. The grinding wheel has a coarse abrasive portion located at one disclosure uses a transition band formed at an interface between the abrasive surfaces, that has an abrasive coating with a gradual change in texture from a coarse surface to a fine surface.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: June 22, 2021
    Inventor: Charles Neff
  • Patent number: 11041254
    Abstract: The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. The silicon carbide substrate (100) comprises a main surface (102) and a circumferential end face surface (114) which is essentially perpendicular to the main surface (102), and a chamfered peripheral region (110), wherein a first bevel surface (106) of the chamfered peripheral region (110) includes a first bevel angle (a1) with said main surface (102), and wherein a second bevel surface (108) of the chamfered peripheral region (110) includes a second bevel angle (a2) with said end face surface (114), wherein, in more than 75% of the peripheral region, said first bevel angle (a1) has a value in a range between 20° and 50°, and said second bevel angle (a2) has a value in a range between 45° and 75°.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: June 22, 2021
    Assignee: SICRYSTAL GMBH
    Inventors: Michael Vogel, Bernhard Ecker, Ralf Müller, Arnd-Dietrich Weber, Matthias Stockmeier
  • Patent number: 11020838
    Abstract: The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: June 1, 2021
    Assignee: Seagate Technology LLC
    Inventors: Mihaela Ruxandra Baurceanu, Chea Phann, Kevin Lamber Mayer, Ricky Ray Anderson, Andrew David Habermas
  • Patent number: 11007621
    Abstract: Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: May 18, 2021
    Assignee: EBARA CORPORATION
    Inventors: Hiroshi Sotozaki, Tadakazu Sone
  • Patent number: 11004708
    Abstract: An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad and an electromagnetic induction monitoring system to generate a magnetic field to monitor a substrate being polished by the polishing pad. The electromagnetic induction monitoring system includes a core positioned at least partially in the platen and a coil wound around a portion of the core. The core includes a back portion and a multiplicity of posts extending from the back portion in a first direction normal to the surface of the platen. The core and coil are configured such that the multiplicity of posts include a first plurality of posts to provide a first magnetic polarity and a second plurality of posts to provide an opposite second magnetic polarity, and the first plurality of posts and the second plurality of posts are arranged in an alternating pattern.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: May 11, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Hassan G. Iravani, Boguslaw A. Swedek, Tzu-Yu Liu, Kun Xu, Shih-Haur Shen
  • Patent number: 11000931
    Abstract: A grinding machine for external cylindrical grinding of hollow shafts may include at least one grinding disc, at least one support disc, and at least two centrings for a face-side fixing of a hollow shaft. At least one of the at least two centrings may be configured as a point. A ruler may be arranged to adjust and hold a position of the hollow shaft during a grinding operation. A rotation axis of the at least one grinding disc and of the at least one support disc may be arranged parallel to one another and define a plane. A rotation axis of the hollow shaft to be ground may extend outside of the plane by a distance of a>12 mm.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: May 11, 2021
    Inventors: Michael Hettler, Roland Schacherer
  • Patent number: 11000935
    Abstract: The present invention relates to a polishing pad that minimizes the occurrence of defects and a process for preparing the same, Since the polishing pad comprises fine hollow particles having shells, the glass transition temperature (Tg) of which is adjusted, the hardness of the shells and the shape of micropores on the surface of a polishing layer are controlled. Since the content of Si in the polishing layer is adjusted, it is possible to prevent the surface damage of a semiconductor substrate caused by hard additives. As a result, the polishing pad can provide a high polishing rate while minimizing the occurrence of defects such as scratches on the surface of a semiconductor substrate during the CMP process.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: May 11, 2021
    Assignee: SKC solmics Co., Ltd.
    Inventors: Sunghoon Yun, Hye Young Heo, Jong Wook Yun, Jang Won Seo, Jaein Ahn
  • Patent number: 10994404
    Abstract: An electric tool, such as an angle driver, has a main tool body with a front portion and a rear portion positioned opposite to the front portion. The main tool body houses a motor configured to receive electricity to function as a drive source. A gear head is coupled with the front portion of the main tool body wherein the gear head has a spindle in communication with a motor axis of the motor via mesh-engagement of bevel gears associated with the motor axis. The spindle has with a cutter tool accessory attached thereto such that rotation of the motor axis produces a commensurate rotation of the cutter tool accessory. Battery attachment portions are associated with the rear portion of the main tool body and are configured to receive a corresponding set of batteries that provide electricity to power the motor.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: May 4, 2021
    Assignee: MAKITA CORPORATION
    Inventors: Miyabi Ito, Ryunosuke Kumagai, Shin Sugiura, Akira Mizutani, Takahiro Kawakami
  • Patent number: 10994388
    Abstract: A machine tool for multiple working for material removal from surfaces of bodies including a working station in which a plurality of rotary tools are positioned around a feed trajectory of said bodies; and guide means in which the bodies to be worked are made to translate one after another along said feed trajectory with a predetermined orientation position. At least one pair of rotary tools of said working station, intended to interact with the surfaces to be worked, inside slits in said bodies, in combination with each other and with guide means provided with partitions, help to keep said bodies in position during their related transit through said working station.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: May 4, 2021
    Assignee: R.BIEMME TECH S.R.L.
    Inventor: Massimiliano Rovinelli
  • Patent number: 10994386
    Abstract: An ultrasonic peening-type integrated machining method for cutting and extrusion includes: applying transverse ultrasonic vibration or a vibration component, which is vertical to a cutting speed direction to a cutting tool on a machine tool; setting a cutting parameter and an ultrasonic vibration parameter such that a dynamic negative clearance angle is generated in a cutting procedure and a flank face of the cutting tool conducts ultrasonic peening extrusion on the surface of the workpiece; setting an extrusion overlap ratio; setting a wear standard of flank faces extruded by the cutting tool; controlling a vibration cutting trajectory phase difference of the cutting tool during two adjacent rotations; and turning on the machine tool in order to ensure that cutting and surface extrusion strengthening of the workpiece are completed in one procedure without separate strengthening procedures. The method conducts extrusion strengthening on the surface of the workpiece while cutting the workpiece.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: May 4, 2021
    Assignee: Beihang University
    Inventors: Deyuan Zhang, Zhenghui Lu, Xun Li, Xinggang Jiang, Shenliang Yang, Xiangyu Zhang, Daxi Geng
  • Patent number: 10987779
    Abstract: A hollow spring includes a steel tube in which the average of surface roughness is smaller than 10 ?m across the entire inner surface of the steel tube and/or compressive residual stress is given to the entire inner surface of the steel tube. The hollow spring may be manufactured by a step of polishing the inner surface of the steel tube by flowing a viscoelastic abrasive medium (200) within the tubular member (10), between a first opening (11) and a second opening (12) of the tubular member (10). The abrasive medium (200) may include a viscoelastic base material and a granular abrasive. The inner surface of the steel tube is polished evenly to reduce the surface roughness and/or is given compressive residual stress to increase the fatigue life of the hollow spring.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: April 27, 2021
    Inventor: Hironobu Sayama
  • Patent number: 10987776
    Abstract: A method, which can accurately determine in a short time a relationship between a load of a dresser and a pressure of a gas supplied to an air cylinder, is disclosed. The method includes determining a first contact point where a load measurement device is brought into contact with a polishing table, calculating a relational expression composed to a quadratic function showing a relationship between a measured load and a measured pressure, determining a second contact point where the dresser is brought into contact with a polishing surface of a polishing pad, calculating an amount of correction from the pressure of the gas at the first contact point and the pressure of the gas at the second contact point, and correcting the relational expression based on the calculated amount of correction.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: April 27, 2021
    Assignee: EBARA CORPORATION
    Inventors: Pohan Chen, Tadakazu Sone, Kenichi Suzuki, Hiroshi Sotozaki
  • Patent number: 10967475
    Abstract: A polishing device for optical elements includes: a tool shank (1), and a polishing disc base; wherein the tool shank (1) is connected to the polishing disc base and is mounted on a tool shaft of a numerical-controlled processing device; wherein a polishing film (3) is stuck on the polishing disc base; the polishing disc base is a profiling polishing disc base (7), a cylinder polishing disc base (2), a profiling polishing disc base (12) or a spherical polishing disc base (8); wherein the tool shank (1) is independent and universal, thereby reducing the processing cost of the polishing device. A polishing method for optical elements is based on the shapes mentioned above of the polishing disc base, including steps of: fixing a polishing disc connecting rod (11); sticking a polishing film (3); trimming the polishing film (3); and polishing an unprocessed work piece (6).
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: April 6, 2021
    Assignee: XI'AN JIAOTONG UNIVERSITY et al.
    Inventors: Yaolong Chen, Chuan Zhang, Xiaoyan Chen, Jun Zha
  • Patent number: 10967447
    Abstract: A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 ?m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 ?m.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: April 6, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tomohiro Kanazawa, Naoki Kohyama, Yoshihiro Iguchi, Yuuki Sasagawa, Tetsuji Shibata, Toshiyuki Tani
  • Patent number: 10946492
    Abstract: Various examples are provided for polishing techniques for flexible tubular workpieces. In one example, a method includes supporting a tubular workpiece on a rod that extends axially through it; positioning a turning wheel against an external surface of the tubular workpiece, where it is held by magnetic attraction; and rotating the tubular workpiece by rotating the turning wheel. The external surface of the tubular workpiece is polished by the abrasive particles during rotation of the tubular workpiece. In another example, a polishing system includes a workpiece holder including a rod configured to axially support a tubular workpiece; a turning wheel with abrasive particles distributed about an outer surface; a wheel support assembly configured to position the outer surface of the turning wheel against the an external surface of the tubular workpiece, where it is held by magnetic attraction. The external surface is polished during rotation of the tubular workpiece.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: March 16, 2021
    Assignee: University of Florida Research Foundation, Incorporated
    Inventors: Hitomi Greenslet, Xueyu Du, Valens Nteziyaremye, Timothy Pham
  • Patent number: 10946494
    Abstract: A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: March 16, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Masayuki Hanano, Masaya Nishiyama, Yutaka Goh, Haruaki Sakurai, Tomohiro Iwano
  • Patent number: 10933506
    Abstract: A monopodic sander is provided for an operator to sand a surface. The monopodic sander comprises a rotary sanding head for contacting the surface and an extendable actuator rod having one end pivotally coupled to the rotary sanding head. The monopodic sander further comprises a controller handle operatively coupled to the one end of the extendable actuator rod to allow the operator to select a pressure applied by the rotary sanding head against the surface.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: March 2, 2021
    Assignee: The Boeing Company
    Inventors: Jason A. Kerestes, Kadon A. Kyte, Colton M. Smoot
  • Patent number: 10926373
    Abstract: A honing machine features a stand (1) with at least two feet (3), wherein the stand (1) has an area with two substantially parallel surfaces, and wherein at least one honing spindle (11), another machining spindle (11) or another functional unit is arranged on the two substantially parallel surfaces of the stand (1).
    Type: Grant
    Filed: May 5, 2016
    Date of Patent: February 23, 2021
    Assignee: GEHRING TECHNOLOGIES GMBH
    Inventors: Oliver Bey, Rainer Köneke, Theodor Huettner, Michael Petschi
  • Patent number: 10919124
    Abstract: A grinding machine including an electric drive with a drive wheel, wherein the electric drive is arranged on a base unit of the grinding machine, a grinding spindle unit constructed as a grinding arm arranged removable on the base unit and which includes a grinding tool and a gear element which transmits the rotational movement of the drive wheel to the grinding tool. To facilitate the change of the grinding arm, the gear element includes: a driver which is supported on the grinding spindle unit and which is directly or indirectly in rotary union with the grinding tool, two guide wheels which are supported on the grinding spindle unit and a belt which is guided around the driver and the guide wheels, wherein in the mounted state of the grinding spindle unit at the base unit the drive wheel contacts the belt between the two guide wheels and hereby drives the same.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: February 16, 2021
    Assignees: KAPP WERKZEUGMASCHINEN GMBH, NILES WERKZEUGMASCHINEN GMBH
    Inventors: Holger Armborst, Stefan Kramer