Patents Examined by Eileen P. Morgan
  • Patent number: 11148175
    Abstract: A system includes an abrasion component containing an abrasion pad configured to clean a faying surface of a nutplate and a shaft attached to the abrasion pad and configured to rotate the shaft and the abrasion pad during cleaning of the nutplate, which includes abrading the faying surface with the abrasion pad. The system further includes a base configured to attach to a pressure applicator, and the pressure applicator, which is configured to attach to the base, hold the nutplate such that the faying surface is capable of contacting the abrasion pad during the cleaning of the nutplate, and apply pressure to the nutplate such that the nutplate contacts the abrasion pad during the cleaning of the nutplate. Furthermore, the abrasion component is configured to rotate the abrasion pad within at least one of the base and the pressure applicator during the cleaning of the nutplate.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: October 19, 2021
    Assignee: Lockheed Martin Corporation
    Inventors: Kevin Aaron Coffey, David Haynes Coleman, Stuart C. Street, Steven E. Twaddle
  • Patent number: 11141833
    Abstract: An omnidirectional blast media dispensing apparatus mounted to an excavator and designed to dispense abrasive media from a blast pot is provided. The apparatus adjusts directional flow of the abrasive media exiting the apparatus to contact a desired target. The apparatus includes a housing coupled to the boom of the excavator, a hydraulic motor assembly coupled to the housing and operably connected to hydraulic lines of the excavator, and a main tubular member rotatably mounted to the housing and operably connected to the hydraulic motor assembly. The first end of the main tubular member is coupled to the blast pot and a nozzle is coupled to the second end of the main tubular member. Fluid flows from the hydraulic lines of the excavator to the hydraulic motor assembly to enable the hydraulic motor assembly to rotatably adjust the main tubular member to direct the nozzle toward the target.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: October 12, 2021
    Inventor: Richard Allen Kingsbury
  • Patent number: 11141831
    Abstract: A grinding machine for grinding non-horizontal grinding surfaces comprises a deformation device which is disposed between a grinding power source and a grinding pad driven by the grinding power source. The deformation device includes a set of an offset unit and the deformation members disposed near one end of the grinding pad, wherein the offset units, the first deformation member and the second deformation member define deformation angles. Therefore, one end of the grinding pad is correspondingly fitted to various non-horizontal grinding surfaces independently through the variable angles of the deformation angle, especially for continuous irregular non-horizontal grinding surfaces. Thus, the present invention has excellent grinding effectiveness.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: October 12, 2021
    Assignee: X'POLE PRECISION TOOLS INC.
    Inventor: Bach Pangho Chen
  • Patent number: 11130211
    Abstract: A polishing tool with a carrier comprising a polishing surface on which a polishing paste is applied at least in some areas, wherein the polishing surface consists of a nonwoven fabric, the polishing paste is in a solid state at room temperature and is applied on the polishing surface to be covered in an amount of 0.08 g/cm2 to 0.30 g/cm2.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: September 28, 2021
    Assignee: GERD EISENBLAETTER GMBH
    Inventor: Gerd Eisenblaetter
  • Patent number: 11133231
    Abstract: A method for estimating film thickness in CMP includes the following operations. A substrate with a film formed thereon is disposed over a polishing pad with a slurry dispensed between the film and the polishing pad. A CMP operation is performed to reduce a thickness of the film. An in-situ electrochemical impedance spectroscopy (EIS) measurement is performed during the CMP operation by an EIS device to estimate the thickness of the film real-time. The CMP operation is ended when the estimated thickness of the film obtained from the fit parameters of the first equivalent electrical circuit model reaches a target thickness.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: September 28, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Min Chen, Chin-Wei Liang, Sheng-Chau Chen, Hsun-Chung Kuang
  • Patent number: 11123838
    Abstract: A hand-held electric power tool for grinding sheetrock particularly adapted to making butt joints have a tapered or recessed juncture for filing with tape embedded with mud such that the joints are ready for painting or covering with wallpaper without being noticeable. The tool includes a grinding cylinder with barbs protruding therefrom which cut or grind the sheetrock edges without penetrating the full depth of the sheetrock or otherwise weakening or damaging the butt joint.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: September 21, 2021
    Inventor: Jack Huffman Scarborough
  • Patent number: 11123839
    Abstract: An angle grinder dust collection shroud includes mounting brackets which are attached to a shroud body via slots which allow the mounting brackets to move to different circumferential locations around the output shaft of the angle grinder as well and inwardly towards and outwardly away from the output shaft of the angle grinder. The mounting brackets are adjustable in their position around the angle grinder output shaft to allow them to engage the angle grinder while avoiding any mounting features for the angle grinder's stock blade guard.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: September 21, 2021
    Assignee: DUSTLESS DEPOT LLC
    Inventors: Spencer Loveless, Kendall Hansen
  • Patent number: 11110565
    Abstract: A polishing apparatus includes an acoustic sensor, a sound collector, an analyzer, a feature quantity calculator, and an end point calculator. The acoustic sensor detects the polishing sound of an object. The sound collector collects a polishing sound detected by the acoustic sensor. The analyzer performs frequency analysis on the power spectrum of the polishing sound with a predetermined time resolution. The feature quantity calculator calculates an arithmetic value of the power spectra having a preset time difference of the power spectra as a polishing feature quantity by using the analysis data provided by the analysis performed by the analyzer. The end point calculator determines a polishing end point of the object based on the change in the feature quantity.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: September 7, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Syunichi Ono, Tsutomu Miki
  • Patent number: 11103974
    Abstract: An automated apparatus for grinding an ice blade on an ice skate comprises a processor, an input device in communication with said processor, a skate holder, a non-contact measuring device in communication with said processor, and a grinding device in communication with said processor. The input device permits a user to select an ice blade grinding option. The skate holder releasably holds at least one said ice skate to said apparatus. The non-contact measuring device is configured to measure a three-dimensional (3D) shape of said ice blade. The grinding device is configured to perform a grinding action on said ice blade in said holder based on said selected ice blade grinding option to change said 3D shape of said ice blade to a desired 3D shape.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: August 31, 2021
    Assignee: Skatescribe Corporation
    Inventors: Nathan Chan, Steve Martin, Jamie A. Gonzalez, Emidio Di Pietro, Tony Di Pietro
  • Patent number: 11103970
    Abstract: An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: August 31, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co, , Ltd.
    Inventors: Chun-Hsi Huang, Huang-Chu Ko
  • Patent number: 11084140
    Abstract: A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: August 10, 2021
    Assignee: HUSQVARNA AB
    Inventor: Tchavdar V. Tchakarov
  • Patent number: 11084141
    Abstract: Wheel back cavity groove processing equipment is disclosed in the present application, which includes a lower lifting system, a central brush system, groove brush systems, a synchronous clamping and rotating system, a left brush system, a right brush system, an upper lifting system and the like. The wheel back cavity groove processing equipment not only may be used for removing burrs from wheel back cavity grooves, but also may be used for removing burrs from bolt holes, a center hole, spoke edges and transverse corners, and simultaneously has the characteristics of high automation degree, high removal efficiency, advanced process, strong generality, and high safety and stability.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: August 10, 2021
    Assignee: CITIC DICASTAL CO., LTD
    Inventors: Zuo Xu, Bowen Xue, Guorui Wu, Xuesong Wang, Jiandong Guo
  • Patent number: 11077535
    Abstract: A process system of performing a fabrication process on a wafer includes a wafer storage cassette, one or more process chambers, a transfer chamber having a body and a lid that detachably covers the body, and a locking pin. The transfer chamber also includes a robot hub, a robot arm attached to the robot hub, and a blade attached to the robot arm. The body of the transfer chamber is connected to the wafer storage cassette and the process chambers, and the robot arm is configured to transfer a wafer from the wafer storage cassette through the body of the transfer chamber to one or more of the process chambers. The locking pin is configured to detachably attach to the robot arm to constrain the blade at a predetermined position within the transfer chamber.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: August 3, 2021
    Inventors: Hector Lopez, Juan Moncada
  • Patent number: 11065733
    Abstract: A method is disclosed for treating or maintaining a hard surface comprising a stone or stone-like material, the method comprising treatment of the surface with a flexible pad, in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad and the hard surface, wherein the abrasive particles comprise diamond particles, and the treatment is performed in the absence of an effective amount of crystallization agent on the contact surface. The treatment is performed on a substantially regular basis, such as daily, weekly or monthly, and the treatment is performed using a pad comprising an open, lofty, three dimensional non-woven webs of fibers. A tool for use in the method is also provided, as well as a floor-surfacing machine comprising such a tool and a method for manufacturing such a tool. Furthermore, methods for treating or maintaining hard, smooth surfaces such as wood, polymer material, lacquer, linoleum, gelcoat, glass and automotive enamel are disclosed.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: July 20, 2021
    Assignee: TWISTER CLEANING TECHNOLOGY AB
    Inventor: Hakan Thysell
  • Patent number: 11065735
    Abstract: A manufacturing method of a carrier for a double-side polishing apparatus, including: preparing a carrier base material and insert thicker than the carrier base material, inserting the insert into a holding hole so as to protrude the insert from both sides of the front surface and back surface of the carrier base material, measuring each of a front protruding amount of the insert protruded from front surface of the carrier base material and a back protruding amount of the insert protruded from back surface of the carrier base material, setting each rotational speed of the upper turn table and lower turn table in starting-up polishing of the carrier so as to decrease the difference between the front protruding amount and back protruding amount, and a starting-up polishing step to subject the carrier to starting-up polishing at each set rotational speed of the upper turn table and the lower turn table.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: July 20, 2021
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Daichi Kitazume, Yuki Tanaka
  • Patent number: 11052424
    Abstract: A paint trencher includes a main body, an abrasive body, and a handle. The main body includes a top panel, a bottom panel, and a support. The abrasive body, preferably a beveled-elongated body, is adjacently mounted to the support in order to cut into the wall. The handle is mounted to the top panel so that applied pressure of the main body can be transferred into the abrasive body thus cutting a trench into the wall. A felt pad is perimetrically attached around the bottom panel so that the surrounding wall area of the trench can be protected from unnecessary scratches.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: July 6, 2021
    Inventors: Lynette Weisbarth, Randal Weisbarth
  • Patent number: 11052508
    Abstract: When a work W rotates counterclockwise about an axis Ow and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O1 and a grinding wheel (2) which rotates clockwise about an axis O2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S1 and a second stress sensor S2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 6, 2021
    Assignee: Micron Machinery Co., Ltd.
    Inventors: Mohee Sagae, Satoshi Kobayashi, Katsuyuki Takeda
  • Patent number: 11052509
    Abstract: A method for manufacturing a face seal may generally include positioning a machining device relative to the face seal such that the face seal is compressed between a machining surface of the machining device and a support member on which the face seal is supported. In addition, the method may include removing material from a seal flange of the face seal using the machining device while the face seal remains compressed between the machining device and the support member and monitoring a compressive load applied through the face seal as material is being removed from the seal flange. Moreover, the method may include adjusting the operation of the machining device to prevent further removal of material from the seal flange when the monitored compressive load is equal to a predetermined load setting.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: July 6, 2021
    Assignee: CNH Industrial America LLC
    Inventor: Brian Vik
  • Patent number: 11052506
    Abstract: A double-head grinding machine includes a disc-shaped carrier ring having a support hole for supporting a silicon wafer, a rotation mechanism rotating the carrier ring around a center of the carrier ring, and a grinding wheel including a grinding stone for grinding the silicon wafer. The support hole is circular and has a center eccentric to the center of the carrier ring.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: July 6, 2021
    Assignee: SUMCO CORPORATION
    Inventor: Yoshinobu Nishimura
  • Patent number: 11045920
    Abstract: A machining apparatus machines an end face of a tapered roller with a grinding wheel. The machining apparatus includes a support mechanism configured to support the tapered roller, a wheel unit on which the grinding wheel is mounted, and a base configured to support the wheel unit so that the wheel unit is swivelable about a center line in a vertical direction. A machining point where the grinding wheel is brought into contact with the end face of the tapered roller supported by the support mechanism is located on an extension of the center line serving as a swivel center of the wheel unit.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: June 29, 2021
    Assignee: JTEKT CORPORATION
    Inventors: Hirokazu Okubo, Atsushi Kuno, Kenichiro Kitamura