Patents Examined by Erin B Saad
  • Patent number: 11654507
    Abstract: A method for manufacturing a liquid-cooling jacket (1) where heat transfer fluid flows in a hollow part (14) defined by a jacket body (2) and a sealing body (3) includes: an overlapping process in which the sealing body (3) is placed on an end surface (11a) of a peripheral wall part (11) in such a way that the end surface (11a) and a back surface of the sealing body (3) are overlapped each other to form a first overlapped part (H1); and a primary joining process in which primary joining is performed by friction stirring in such a way that a rotary tool (FD) is moved once around a recessed part (13) along the first overlapped part (H1).
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: May 23, 2023
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Hisashi Hori, Nobushiro Seo, Kosuke Yamanaka
  • Patent number: 11654505
    Abstract: A method of manufacturing a terminal-equipped electric wire, includes: connecting a terminal fitting to one end of an electric wire in which a conductor is covered with a jacket; clamping a range of a predetermined length in a length direction at an intermediate portion of the electric wire with a pair of plate bodies; and performing an ultrasonic joining processing by applying an ultrasonic vibration to the conductor exposed at the other end of the electric wire.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: May 23, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Yasusada Oishi, Naotaka Torimoto
  • Patent number: 11648631
    Abstract: Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: May 16, 2023
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yoko Kurasawa, Motohiro Onitsuka, Hisashi Tokutomi, Hiroyoshi Kawasaki
  • Patent number: 11643149
    Abstract: A welded steel part obtained by welding a first sheet with a second sheet, at least one with a coating of aluminum alloy. The welding uses a welding wire which, after melting and cooling, constitutes a weld bead connecting the first sheet to the second sheet and being part of said welded steel part. The respective peripheral edge of the first and second sheets are in a joggled edge type configuration in which the peripheral edge of the first sheet is arranged above, and on or near the upper face of an end portion of the peripheral edge of the second sheet which is extended by an inclined junction portion, at least one part of the upper face of the inclined junction portion delimits at least laterally with the edge of the peripheral edge of the first sheet a groove receiving the weld bead, the inclined joining portion extending by a welding portion in longitudinal continuity with the peripheral edge of the first sheet.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: May 9, 2023
    Assignee: ArcelorMittal
    Inventor: Jessy Haouas
  • Patent number: 11633802
    Abstract: A method for operating a double-action friction stir welding device including a welding tool having a pin member and a shoulder member, a projection/retraction mechanism for causing the pin member to project/retract relative to the shoulder member, a rotation mechanism for rotating a welding tool, and an advancing/retracting mechanism for advancing/retracting the welding tool, the method including cleaning at least one of the outer circumferential surface of the pin member and the inner circumferential surface of a through hole of the shoulder member on the basis of the level of an adhesion parameter correlated with the degree of adhesion of the material of a welding object, caused by friction stir welding, on the outer circumferential surface of the pin member and the inner circumferential surface of the through hole of the shoulder member.
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: April 25, 2023
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Hideki Okada, Syuhei Yoshikawa, Masahiro Miyake, Masahiro Takagi
  • Patent number: 11637082
    Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: April 25, 2023
    Assignee: eLux, Inc.
    Inventors: Wei-Yuan Ma, Jong-Jan Lee
  • Patent number: 11633797
    Abstract: A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: April 25, 2023
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Shan Liu, Daniel J. Dorriety, Paul A. Cook, Brian Leslie Henderson, Ryan T. Smith
  • Patent number: 11633799
    Abstract: Systems and methods to control fabrication of an assembly involve a first end sheet having an interior surface and an exterior surface, opposite the interior surface. A system includes interior sheets, the interior sheets including a first interior sheet at one end of a stack of the interior sheets and including a last interior sheet at an opposite end of the stack of the two or more interior sheets, the first interior sheet being adjacent to the interior surface of the first end sheet, and a second end sheet having an interior surface and an exterior surface, opposite the interior surface. The last interior sheet is adjacent to the interior surface of the last end sheet, and the interior surface of the first end sheet or the second end sheet includes venting features, the venting features including holes or slots to channel heat, gas, or vapor during a brazing process.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: April 25, 2023
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Mark A. Zaffetti, Benjamin Abraham, Timothy Sauerhoefer
  • Patent number: 11633803
    Abstract: A programmable exothermic reaction controller includes input/output control circuitry for inputting and outputting information to/from the controller, processing circuitry including user programmable parameters, wherein the parameters are programmable using the input/output control circuitry and an output connector connectable to an ignitor cable.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: April 25, 2023
    Assignee: HUBBELL INCORPORATED
    Inventors: Mamoon Tawfig Abedraboh, Todd Carlton Lehmann
  • Patent number: 11627667
    Abstract: A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 11, 2023
    Assignee: Orbotech Ltd.
    Inventors: Zvi Kotler, Ofer Fogel
  • Patent number: 11612947
    Abstract: A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: March 28, 2023
    Assignee: ROLLS-ROYCE CORPORATION
    Inventors: Joseph P. Henderkott, Timothy Fuesting
  • Patent number: 11610859
    Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: March 21, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung
  • Patent number: 11607742
    Abstract: The present disclosure provides a reflow oven, which comprises: a soldering section configured to treat a circuit board to be soldered and provided with N soldering sub-zones; a purification section comprising M purification sub-zones, wherein each of the M purification sub-zones is in communication with one of the N soldering sub-zones, and M is less than or equal to N; a controllable discharge pipeline and K discharge branch pipes, each of the K discharge branch pipes communicating one of the M purification sub-zones with the controllable discharge pipeline; and a valve device configured to, at the inlet thereof, connect with the outlet of the controllable discharge pipeline to control open/close of the communication between the controllable discharge pipeline and the external environment. The reflow oven provided by the present disclosure can work in an air mode and in an inert gas mode.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: March 21, 2023
    Assignee: Illinois Tool Works Inc.
    Inventor: Yuwei Wang
  • Patent number: 11602807
    Abstract: The invention relates to a device (2) for welding hard material elements (4) onto teeth (6) of a saw blade (8), comprising a saw blade feed device (12) for moving the saw blade (8) in a feed direction (14), such that a tooth (6a) of the saw blade (8) can be brought into a target position (16) in a working region (10) of the device (2), comprising a first centering device (30) for centering the saw blade (8) transversely to the feed direction (14), comprising a second centering device (32) for centering a respective hard material element (4) transversely to the feed direction (14), comprising a resistance welding device (24) having a welding electrode (26) that can be deployed into and withdrawn from the working region (10), comprising a supply device (28) for supplying and transferring a respective hard material element (4) to the welding electrode (26), and it being possible for the welding electrode (26) to be deployed in such a way that the hard material element (4) can be brought toward the tooth (6a) to
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: March 14, 2023
    Assignee: CREDE VERMOGENSVERWALTUNGS-GMBYH + CO. KG
    Inventor: Marcel Credé
  • Patent number: 11602802
    Abstract: A system for securing first and second metal workpieces to a central metal workpiece located therebetween. The system includes clamps to secure the first and second metal workpieces in coaxial alignment with the central metal workpiece, which is rotatable about its axis. Heating elements heat opposed ends of the first metal workpiece and the central metal workpiece, and opposed ends of the second metal workpiece and the central metal workpiece, to a hot working temperature. While the opposed ends are at the hot working temperature, the heating elements are removed. The opposed end of the first metal workpiece is urged against the end opposed thereto of the rotating central metal workpiece, while the central metal workpiece rotates. At the same time, the rotating central metal workpiece is pulled against the second metal workpiece to engage the opposed ends thereof with each other. The workpieces are then allowed to cool.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: March 14, 2023
    Inventor: Paul Po Cheng
  • Patent number: 11597041
    Abstract: Exothermic welding molds, weld-metal containing cartridges for such molds, and methods of use are provided. The mold, cartridges, and methods can provide interaction between the cartridge's disk member with the mold, which allows the housing member to be withdrawn from the mold while leaving the disk member and weld-metal in place. The interaction can be a rotational restraint alone, a vertical restraint alone, or combinations thereof. Alternately, the interaction can be an outward pressure on the housing member and/or disk member, a shear force on the housing member and/or disk member, or combinations thereof. The outward pressure on the housing member and/or disk member can alternately be provided without interaction between the disk member and the mold, but rather by the simple application of an internal pressure to the cartridge. The internal pressure can be applied by squeezing the walls of the cartridge and/or by depressing a pusher member.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: March 7, 2023
    Assignee: Hubbell Incorporated
    Inventors: Timothy Charles Hoagland, Todd Carlton Lehmann, Mamoon Tawfiq Abedraboh, Xiaochen Wu
  • Patent number: 11597032
    Abstract: A method of at least partially filling an opening in a workpiece made of metal, the opening being at least partially defined by one or more opening walls having one or more opening wall surfaces. The method includes providing an insert bondable with the workpiece, the insert having one or more insert engagement surfaces formed for engagement with the opening wall surface. The opening wall surface and the insert engagement surface are heated to a hot working temperature. The insert is subjected to an engagement motion, to move the insert engagement surface relative to the opening wall surface. While the insert is subjected to the engagement motion, the insert is also subjected to a translocation motion to move the insert at least partially into the opening, for engaging the insert engagement surface with the opening wall surface, for at least partially creating a metallic bond between the insert and the workpiece.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: March 7, 2023
    Inventor: Paul Po Cheng
  • Patent number: 11590605
    Abstract: Provided is a joining method that can prevent a plastic flowing material from flowing out from a butt section and that can reduce the thickness and weight of metal members. The joining method is for joining a first metal member and a second metal member by using a rotary tool comprising a stirring pin, and is characterized in that: the stirring pin comprises a flat surface perpendicular to the rotation axis of the rotary tool and comprises a protruding section protruding from the flat face; and in a friction stirring step, the flat surface is brought into contact with the first metal member and the second metal member, and a front end face of the protruding section is inserted deeper than an upper overlapping section to join an upper front butt section and the upper overlapping section.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: February 28, 2023
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Nobushiro Seo, Hisashi Hori
  • Patent number: 11584978
    Abstract: Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: February 21, 2023
    Assignee: IOWA STATE UNIVERSITY RESEARCH FOUNDATION
    Inventors: Martin Thuo, Ian Tevis
  • Patent number: 11571762
    Abstract: A printing method for selectively depositing braze powders on a surface comprises extruding a filament from a nozzle moving relative to a surface, where the filament comprises a flowable carrier mixed with a braze powder. As the nozzle moves, the filament is deposited on the surface in a predetermined pattern defined by the motion of the nozzle relative to the surface; thus, the braze powders are deposited at one or more predetermined locations on the surface.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: February 7, 2023
    Assignees: Rolls-Royce North American Technologies Inc., ROLLS-ROYCE CORPORATION
    Inventors: Matthew Gold, Greg Lopshire, Raymond Xu, Carl Russo