Abstract: According to one embodiment, a variable resistance element includes first and conductive layers and first and second layers. The first conductive layer includes a first element including at least one selected from the group consisting of silver, copper, aluminum, nickel, and titanium. The second conductive layer includes at least one selected from the group consisting of platinum, gold, iridium, tungsten, palladium, rhodium, titanium nitride, and silicon. A first layer contacts the first conductive layer, and is provided between the first and second conductive layers. The first layer includes a first material. The first material is insulative. The second layer includes a second element and a second material and is provided between the first layer and the second conductive layer. The second element includes at least one selected from the group consisting of silver, copper, aluminum, nickel, and titanium. The second material is different from the first material.

Abstract: A storage control device includes a determination unit configured to determine whether each area in a nonvolatile storage is set to be in a partition corresponding to a Multi Level Cell (MLC) mode or to be in a partition corresponding to a Single Level Cell (SLC) mode and a control unit configured to perform data refreshing at a higher frequency on an area determined to be set to be in the partition corresponding to the MLC mode than on an area determined to be set to be in the partition corresponding to the SLC mode.

Abstract: A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell.

Abstract: In two inverters included in a latch in a memory cell, the source or drain of a PMOS load transistor connected to a memory node is cut off, and the source or drain of an NMOS drive transistor connected to another memory node is cut off, whereby internal data is fixed or permanently stored in the memory cell while ensuring a resistance to damage to the gate of the transistor and without impairing the regularity of the layout.

Abstract: Circuits for generating refresh period signals and semiconductor integrated circuits using the same are presented. The refresh period signal generation circuit can include an oscillator, a pulse generation unit, and a signal controller. The oscillator is configured to generate an oscillation signal in response to a refresh duration correction signal. The pulse generation unit is configured to generate a refresh period signal in response to the oscillation signal. The signal controller configured to generate the refresh duration correction signal, which corrects an active time of a refresh duration signal, in response to the oscillation signal.

Abstract: In one embodiment, the invention is a hybrid superconducting-magnetic memory cell and array. One embodiment of a memory cell includes a magnetoresistive element and at least one superconducting element wired in parallel with the magnetoresistive element. In a further embodiment, memory cells of the disclosed configuration are arranged to form a memory array.

Abstract: Semiconductor devices include a plurality of fuses and a plurality of program circuits, respective ones of which are configured to program respective ones of the plurality of fuses. The devices further include a shift register configured to activate at least two of the program circuits. In some embodiments, the shift register includes a first shift register configured to generate first select signals and a second shift register configured to generate second select signals corresponding to data to be programmed to the plurality of fuses. Respective ones of the program circuits may be configured to program respective ones of the fuses responsive to respective pairs of the first select signals and the second select signals.

Abstract: A nonvolatile memory device and a method of operating the same. The nonvolatile memory device includes a memory cell array including memory cells for storing data, a temperature sensor and a controller. The temperature sensor outputs a temperature detection signal according to ambient temperatures while changing one or more pieces of reference voltage information, which are previously stored, when data is programmed into the memory cell array. The controller performs a verify operation of the program using a fast verify method and decides the number of steps which are comprised in step-shaped verify voltage pulse of the fast verify method according to the temperature detection signal.

Abstract: A non-volatile semiconductor memory device includes a non-volatile memory having a plurality of blocks each including a plurality of memory cells, a bit line electrically connected to one end of a current path of the memory cell, a source line electrically connected to the other end of the current path of the memory cell, a word line electrically connected to the gate electrode, a sense amplifier circuit electrically connected to the bit line and configured to read data from the memory cell, a row decoder electrically connected to the word line and configured to apply a read voltage at which the memory cell is set to an ON state to the word line, and a controller configured to measure a cell current flowing through the memory cell in the ON state to judge whether the memory cell has been degraded.

Abstract: The MONOS vertical memory cell of the present invention allow miniaturization of the memory cell area. The two embodiments of split gate and single gate provide for efficient program and erase modes as well as preventing read disturb in the read mode.

Abstract: A non-volatile tri-state random access memory device, including a permanent magnetic bit; a write module in functional communication with the permanent magnetic bit and configured to selectably alter the permanent magnetic bit between three magnetic states, a write module including a write coil disposed about the permanent magnetic bit and in communication with a source of electrical power; and a read module in functional communication with the permanent magnetic bit and configured to observe and communicate each of three magnetic states of the permanent magnetic bit, the read module including a read sensor coupled to a read return line.

Abstract: A circuit comprises an array of memory cells (10). A plurality of sensing circuits (20), are coupled to the output (14) of respective memory cells (10), for comparing the output signal of the respective one of the memory cells (10) with a reference signal to form a data signal from the output signal from the respective one of the memory cells (10). A reference generator circuit (24, 26) forms the reference signal from a sum wherein each respective one of the memory cells (10) of the addressed group contributes a contribution that is a function of the output signal of the respective one of the memory cells (10). The contributions are equalized for output signal values at more than a saturating distance above the reference signal, and the contributions are equalized for output signal values at more than the saturating distance below the reference signal.

Abstract: A semiconductor memory device is provided between a refresh request circuit and a command decoder, and includes a refresh synchronous circuit for deactivating a refresh request if an external access request is output from the command decoder. The semiconductor memory device further includes a clock phase adjusting unit that generates a delay to a clock, where the delay is same or longer than the time taken from when the external access request is issued until when a critical path is passed, and the delay is also shorter than one cycle. Then a flip-flop retrieves the request from the command decoder at the clock timing from the clock phase adjusting unit to supply it to the memory cell array.

Abstract: Method and apparatus for operating a memory device with a status register. In some embodiments, the memory device has a plurality of individually programmable non-volatile memory cells comprised of at least a resistive sense memory. The memory device engages an interface and maintains a status register in some embodiments by logging at least an error or busy signal during data transfer operations.

Abstract: A memory circuit for holding a single binary value. A first bit cell holds one of a logical high value and a logical low value, and a second bit cell also holds one of a logical high value and a logical low value. Circuitry is provided for placing a logical high value in the first bit cell when the binary value in the memory circuit is to be a logical high value, and circuitry is provided for placing a logical high value in the second bit cell when the binary value in the memory circuit is to be a logical low value. In this manner, a logical high value exists within the memory circuit, whether the single binary value within the memory circuit is a logical high value or a logical low value. The difference between the two values of the binary value is which of the two bit cells holds the logical high value. Thus, this memory circuit can be sensed without the use of a sense amplifier.

Abstract: A memory capable of suppressing increase of a chip area thereof while preventing nonselected subarrays from disturbance is obtained. This memory comprises a first transistor for connecting respective sub bit lines with each other, and connects the sub bit lines of the nonselected subarrays with each other through the first transistor and connects the same to fixed potentials arranged on both ends of a memory cell array at least in a read operation.

Abstract: In a non-volatile memory, a selected page on a word line is successively programmed by a series of voltage pulses of a staircase waveform with verifications in between the pulses until the page is verified to a designated pattern. The programming voltage at the time the page is programmed verified will be used to estimate the initial value of a starting programming voltage for the page. The estimation is further refined by using the estimate from a first pass in a second pass. Also, when the test is over multiple blocks, sampling of word lines based on similar geometrical locations of the blocks can yield a starting programming voltage optimized for faster programming pages.

Abstract: Example embodiments for verifying an erase operation for a flash memory device may comprise, for one or more embodiments, utilizing program operation verification circuitry to verify, at least in part, the erase operation.

Abstract: This storage apparatus includes an access history storage unit for storing, when there is a write request for writing data into the data storage unit or a read request for reading data stored in the data storage unit, history of the write request or read request as access history, an operational information storage unit for storing operational information showing whether the data storage unit is operating, an access prediction unit for predicting whether the data storage unit will be accessed based on the access history, and an operational control unit for performing operational control of pre-starting the data storage unit when the data storage unit is shut off and the access prediction unit predicts that the data storage unit will be accessed, or stopping the data storage unit when the data storage unit is operating and the access prediction unit predicts that the data storage unit will not be accessed.

Abstract: Cell power supply lines are arranged for memory cell columns, and adjust impedances or voltage levels of the cell power supply lines according to the voltage levels of bit lines in the corresponding columns, respectively. In the data write operation, the cell power supply line is forced into a floating state according to the bit line potential on a selected column and has the voltage level changed, and a latching capability of a selected memory cell is reduced to write data fast. Even with a low power supply voltage, a static semiconductor memory device that can stably perform write and read of data is implemented.