Patents Examined by G P Tolin
  • Patent number: 6687125
    Abstract: In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: February 3, 2004
    Assignee: LG Electronics Inc.
    Inventors: Jung-Sik Park, Eon-Pyo Hong, Yong-Dol Park, Dong-Koo Shin, Jin-Young Jung, Hyeong-Kook Lee
  • Patent number: 6678160
    Abstract: A heat sink assembly includes a clip (10), a heat sink (50), and a retention module (60). The clip has two main bodies (20) and a beam portion (40). The beam portion includes a top plate (42), a side plate (44), and a connecting plate (48). Two through slots (49) are defined in opposite ends of the connecting plate (48). Two mounting slots (43) are defined in opposite ends of the top plate. Each main body includes a first leg (26), a central pressing portion (22), and a connecting portion (28). The connecting portion passes through a corresponding through slot, and is snappingly received in a corresponding mounting slot. Two recessed portions (56) are defined at opposite sides of the heat sink. The pressing portions are for pressing on the recessed portions. The retention module engagingly receives the first legs, and second legs of the beam portion.
    Type: Grant
    Filed: November 22, 2002
    Date of Patent: January 13, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: HenBen Liu
  • Patent number: 6563705
    Abstract: A desktop computer comprises a base, a front housing, a display panel, a computer motherboard, and a rear housing. The front housing has a front end facing a user, a rear end, an upper end, a lower end, and further has a recess with an opening facing the rear end. The bottom side of the recess is positioned on the back of the front end of the front housing. The display panel is vertically mounted in the front end of the front housing, and the computer motherboard is vertically mounted on the bottom side of the front housing recess and electrically connected with display panel. The rear housing is mounted on the rear end of the front housing for covering the recess on the rear end of the front housing.
    Type: Grant
    Filed: March 17, 2002
    Date of Patent: May 13, 2003
    Assignee: Wistron Corporation
    Inventor: Yan-Lin Kuo
  • Patent number: 6437984
    Abstract: A heat sink is mounted on an integrated circuit die within a Chip Scale Package, without a substrate supporting the heat sink. The heat sink may be mounted on a central portion of the active surface of the integrated circuit die without impeding wire bond connection of bond pads around peripheral region of the active surface. Alternatively, the heat sink may be mounted on the backside of one integrated circuit die within a stacked configuration of integrated circuits having facing active surfaces. The required form factor for Chip Scale Packages is maintained while providing heat dissipation for high input/output devices. The heat sink may be wire bonded to a ground connection to provide the packaged integrated circuit with shielding from electrical or electromagnetic interference.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: August 20, 2002
    Assignee: STMicroelectronics, Inc.
    Inventors: Anthony M. Chiu, Tom Quoc Lao
  • Patent number: 6341066
    Abstract: In an electronic control unit, a drive element liable to generate heat and a control processing element liable to be affected by heat are respectively mounted on a drive circuit board and a control circuit board different from each other, and the two boards are connected to each other by a flexible printed circuit board. The bonding portion of the flexible printed circuit board to the control circuit board is a back side portion of a connector mounted on the control circuit board at the same side as the control processing element. Therefore, heat generated by the drive element is suppressed from being transferred to the control processing element without causing layout hindrances.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: January 22, 2002
    Assignee: Denso Corporation
    Inventors: Toru Murowaki, Toshiaki Yagura, Yoshitaka Nakano, Taku Iida
  • Patent number: 6252763
    Abstract: A gas-insulated electrical apparatus includes tanks into each of which insulation gas is sealed, including bus-bars, bus-bar disconnectors connected to the bus-bars, circuit breakers connected to the bus-bar disconnectors, and line disconnectors connected to the circuit breakers, each line disconnector being further connected to a transmission or a transformer; wherein each bus-bar disconnector and each line disconnector include a respective pair of a fixed-contact and a moving-contact, the fixed-contact and the moving-contact being concave and convex, respectively, and each of the moving-contacts in the bus-bar disconnector and the line disconnector is located at the side of a corresponding circuit breaker between the bus-bar disconnector and the line disconnector, a contact-parting speed in the line connector being lower than that in the bus-bar disconnector.
    Type: Grant
    Filed: November 5, 1999
    Date of Patent: June 26, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Yoshikatsu Enokida, Tokio Yamagiwa, Kenji Annou, Manabu Takamoto, Hirohiko Yatsuzuka, Masahiro Shimokawa
  • Patent number: 6160706
    Abstract: A module retention system including a pair of retention assemblies (32) at ends of a board-mounted receptacle connector (36) for securing a processor module (10) thereto, where the module includes a massive heat sink (12) mounted along one side thereof. Each retention assembly (32) includes a resilient member (50) secured along the base of a rigid retention member (38) and against the circuit board (20) that has portions (62,66) engageable by the module leading end (22) and by the heat sink distal end (16) to stabilize the module and to absorb looseness in the arrangement.
    Type: Grant
    Filed: January 6, 1999
    Date of Patent: December 12, 2000
    Assignee: The Whitaker Corporation
    Inventors: Wayne Samuel Davis, Robert Neil Whiteman, Jr.
  • Patent number: 4845323
    Abstract: A conformal electrical sensor switch for determining the presence or absence of weight, such as a person in a bed, comprises flexible, parallel sensing strips positioned to make contact when pressure is applied. Sensing strip circuits are held apart by a separator strip until pressure is applied and thus closing a latch which provides signal output through snap connectors which are affixed to the sensing strips and which extend beyond the sealed flexible cover of the sensor switch. The flexible cover serves to secure the sensing strips and connectors in a facing relationship. The connectors are designed to permit easy attachment to a variety of signal processing/monitoring devices.
    Type: Grant
    Filed: August 28, 1987
    Date of Patent: July 4, 1989
    Assignee: Tactilitics, Inc.
    Inventor: George R. Beggs
  • Patent number: 4833567
    Abstract: An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser cap facing the component is a condenser surface and is provided with a number of parallel fluted sections. Each fluted section has parallel vertical sidewalls and a semi-circular top section. A multi-layered fiberous, porous, wick is located between the condenser surface flutes and the top of the electrical component. The top of the component may be provided with a number of parallel grooves exposed to the wick. The pipe chamber is filled with a two-phase working fluid. The heat generated by the electrical component causes the liquid fraction of the working fluid adjacent the component to evaporate. The vapor travels to the fluted condensing surface.
    Type: Grant
    Filed: October 9, 1987
    Date of Patent: May 23, 1989
    Assignee: Digital Equipment Corporation
    Inventors: Elric Saaski, Robert J. Hannemann, Leslie R. Fox
  • Patent number: 4811169
    Abstract: A single sided telephone frame particularly suited for DSX use utilizing a standard relay rack. In-plant equipment cables are interconnected to equipment blocks at an upper end of the frame. Below the equipment blocks are a group of jack panels located between groups of cross-connect block elements to maintain cable connections therebetween as short as possible. Connections between groups of cross-connect blocks to the jack panel elements, and from the jack panel elements to the equipment block elements are principally through a single vertical trough along one side of the frame, thereby permitting maximum space utilization. Each of the elements includes a metallic enclosure having members forming segments of the trough which are aligned to vertical congruency upon assembly upon the frame.
    Type: Grant
    Filed: December 8, 1986
    Date of Patent: March 7, 1989
    Assignee: Porta Systems Corp.
    Inventors: Paul V. De Luca, Michael Shatzkin, Albert Atun
  • Patent number: 4811166
    Abstract: A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon.
    Type: Grant
    Filed: July 2, 1986
    Date of Patent: March 7, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Juan M. Alvarez, Henry F. Breit, Steven E. Levy, Premkumar R. Hingorany
  • Patent number: 4811168
    Abstract: An apparatus for housing an electronic circuit mounted on a printed circuit board which provides means for connecting electrical cables to the electronic circuit. The apparatus provides environmental protection to the electronic circuit and cable terminals. Additionally, the electronic circuit may be easily disconnected and removed without disturbing the cable connections.
    Type: Grant
    Filed: November 23, 1987
    Date of Patent: March 7, 1989
    Inventors: Milton L. Chesnut, Alfred A. Schroeder, Richard O. Norman
  • Patent number: 4797782
    Abstract: A portable, low-weighted outer unit defines substantially asceptic space in which inner units are disposed. Each respective inner unit encloses electronic components which are placed on assembly boards stacked upright in the inner units. A fan is provided to effect the circulation of the air in the space and past the inner units. Another fan is provided for drawing the outside air through the heat exchanger and through the outer unit. The heat transported from the electronic components by the flow of the inner air is transferred to the outer air whereby the temperature of the inner air inside the outer unit is kept reduced.
    Type: Grant
    Filed: May 20, 1987
    Date of Patent: January 10, 1989
    Assignee: Aktiebolaget Bofors
    Inventor: Roger Wistling
  • Patent number: 4797772
    Abstract: An immersion detector circuit interrupter having a sensor located around the electrical components of an appliance and a relay for interrupting the delivery of alternating current to the appliance whenever the sensor conducts a current at a predetermined voltage. The sensor is connected in series with a zener diode, a regular diode, the coil of the relay and to another two diodes which are connected to two alternating current conductors which provide electrical current to the appliance. The sensor is generally always at an electrical potential opposite or substantially different than the electrical potential of the electrical components at any particular point in time.
    Type: Grant
    Filed: March 3, 1987
    Date of Patent: January 10, 1989
    Assignee: Patton Electric Company, Inc.
    Inventor: Kostas Kaplanis
  • Patent number: 4796156
    Abstract: A method of self packaging an integrated circuit chip (10) on a printed circuit board (14) where conductive leads (16) form an electrical connection with interconnect leads (12) on the printed circuit board (14). A centering frame (22) placed on the printed circuit board serves to align the leads (12 and 16). A cooling cap (34) which dissipates heat from the integrated circuit chip (10) is placed over the centering frame (22) and integrated circuit chip (10). In one embodiment, the leads (12 and 16) form a pressure fit and the cooling cap (34) forces the pressure-fit electrical connections. In another embodiment, the leads (12 and 16) make rubbing contact with each other.
    Type: Grant
    Filed: December 4, 1987
    Date of Patent: January 3, 1989
    Assignee: General Electric Company
    Inventor: Harold F. Webster
  • Patent number: 4796159
    Abstract: An explosion-protected modular housing (3) for electrical and/or electronic components (29) includes at least one sand-filled chamber (28), in which the components are housed. The components (29) are protected in this manner in the safety mode known as "sand filling". Also provided on the housing (3) are connection devices (6, 7) for supply lines to the housing. To enable insertion or removal of a selected housing from a holder (2) at any time without shutting off the entire system of which the selected housing (3) is a part, the connection devices (5, 7) are part of a complementary two-part plug-and-receptacle arrangement (4), which is flame-proof. One part (6) of the arrangement is connected electrically with the components (29) in the housing (3), the other part (5) to a power distribution bus. The "not intrinsically safe" circuits are connected via this plug-and-receptacle arrangement (4).
    Type: Grant
    Filed: September 10, 1987
    Date of Patent: January 3, 1989
    Assignee: R. Stahl Schalterate GmbH
    Inventor: Detlev Miksche
  • Patent number: 4794356
    Abstract: An integrated protection unit is a circuit breaker which includes basic overcurrent protection facility along with selective electrical accessories. A molded plastic accessory access cover secured to the integrated protection unit cover protects the accessory components contained within the circuit breaker cover from the environment. An auxiliary switch unit is one such accessory component which can be field-installed without affecting the integrity of the circuit breaker overcurrent protection components.
    Type: Grant
    Filed: December 16, 1987
    Date of Patent: December 27, 1988
    Assignee: General Electric Company
    Inventors: Yuet-Ying Yu, Robert A. Morris, Paul T. Rajotte, Lee A. Wambolt
  • Patent number: 4794212
    Abstract: A protective device for a feed unit, especially for a spindle sleeve of a measuring machine, whereby the feed unit is surrounded by a jacket constituted of a multiplicity of springs, which touch the feed unit in the event of a collision and thereby produce electrical contacts, and in which the lower or bottom part of the feed unit is enclosed by a protective shield. The protective shield is constituted of individual screen parts which are displaceable or swingable out of their inoperative position, and which collectively enclose the lower part, wherein the screen parts are maintained in their inoperative position by means of magnets, and in which the screen parts in their tilted position touch at least one spring and thereby become electrically contactive.
    Type: Grant
    Filed: December 24, 1987
    Date of Patent: December 27, 1988
    Assignee: Mauser-Werke Oberndorf GmbH
    Inventors: Gerhard Band, Bernd Muller
  • Patent number: 4794214
    Abstract: A fluid pressure switch is shown including first and second discs each having convex-concave surface configurations on opposite sides thereof adapted to invert its configuration upon being subjected to selected pressure levels. A slidably disposed plural stage pressure converter having a flexible membrane on one side thereof is operatively coupled to the discs to transfer force from fluid pressure received by the membrane. A motion transfer member extends from the second disc to an electric switch. At a first range of pressures the first disc prevents actuation of the switch, at a second range of pressures the curvature of the first disc has inverted allowing actuation of the switch while at a third range of pressures the curvature of the second disc has inverted resulting in deacuation of the switch.
    Type: Grant
    Filed: October 28, 1987
    Date of Patent: December 27, 1988
    Assignee: Texas Instruments Incorporated
    Inventor: Carlton E. Sanford
  • Patent number: 4794487
    Abstract: To improve the heat protection of an electronic device (7) in the case of heat radiation coming from the outside, for example solar rays, lateral radiation reflectors (12, 13; 16, 17) of 1 mm-thick aluminium plate polished on both sides and degreased are arranged between the electronic device and the walk (20, 21) of a heat protection casing (1) which laterally surrounds the electronic device. In addition, upper radiation reflectors (14, 15) are provided between the coverplate of the electronic device (7) and a coverplate (4) of the heat protection casing (1), a ventilation opening (18) remaining to the lateral radiation reflectors. In the sidewall of the heat protection casing (1), lower and upper ventilation slots (5,6) are arranged by means of which a chimney effect is achieved in the interior of the heat protection casing. In addition, a bottom plate (2) of the heat protection casing (1) can exhibit cooling openings (3).
    Type: Grant
    Filed: September 25, 1987
    Date of Patent: December 27, 1988
    Assignee: BBC Brown Boveri AG
    Inventors: Martin Maschek, Georg Mastner