Abstract: The present disclosure relates to an electronic device and a method of operating a memory device having a reduced program operation time including pre-charging a select line connected to the select transistor to a first select voltage during a first time period, discharging the select line during a second time period subsequent to the first time period, and discharging the select line while word lines connected to the plurality of memory cells are pre-charged to an operation voltage in a third time period subsequent to the second time period to change a level of the first select voltage pre-charged to the select line to a second select voltage.

Abstract: A nonvolatile memory device includes a command decoder that receives and decodes a first command and a second command, a first control circuit that generates first control information under control of the command decoder decoding the first command, a second control circuit that generates second control information under control of the command decoder decoding the second command, a first bank that includes a first memory cell which operates based on the first control information, and a second bank that includes a second memory cell which operates based on the second control information. A first time to output data from the first bank in response to the first command is different from a second time to output data from the second bank in response to the second command.

Abstract: A driving method of a nonvolatile memory device including multiple memory planes includes following operations: precharging at least one word line and at least one bit line of a first memory plane; if the at least one word line and the at least one bit line of the first memory plane have been precharged for a first time length or to respective voltage thresholds, precharging at least one word line and at least one bit line of a second memory plane; conducting a first data operation to at least one memory cell of the first memory plane disposed at intersections of the at least one word line and the at least one bit line thereof; conducting a second data operation to at least one memory cell of the second memory plane disposed at intersections of the at least one word line and the at least one bit line thereof.

Abstract: An operation method of a nonvolatile memory device includes receiving a first DQ signal representing a first data bit from an external device through a first DQ line and receiving a second DQ signal representing a second data bit from the external device through a second DQ line, and programming a first memory cell corresponding to the first DQ line and a second memory cell corresponding to the second DQ line such that the first memory cell has any one of an erase state and a first program state based on the first DQ signal and the second memory cell has any one of the erase state and a second program state based on the second DQ signal. A lower limit value of a threshold voltage distribution corresponding to the second program state is higher than a lower limit value of a threshold voltage distribution corresponding to the first program state.

Abstract: The present disclosure relates to a memory device includes a memory cell array, a peripheral circuit and a program operation controller. The memory cell array including a plurality of memory cells each having a target programmed state among a plurality of programmed states. The peripheral circuit performs at least one program loop including applying a program voltage to a word line coupled in common to the plurality of memory cells, and selectively performing a verify operation of determining whether a threshold voltage of each of the plurality of memory cells exceeds a verify voltage. The program operation controller controls the peripheral circuit to perform the at least one program loop corresponding to at least one of remaining programmed states other than a most significant programmed state among the plurality of programmed states, and apply a program pulse corresponding to the most significant programmed state to the word line.

Abstract: In one aspect of programmed state verification in accordance with the present description, the voltage levels on bitlines of non-target storage cells are each boosted by applying a non-zero offset or delta value, ?V, to the bitlines of non-target storage cells during a precharge subinterval. A bitline verification voltage applied to a bitline of a target storage cell causes the voltage of the bitline to ramp up from the boosted ?V value. As a result, starting from an initial value which is the higher or boosted ?V value, the bitline voltage ramps up more quickly during the precharge subinterval to the bitline verification voltage level to improve system performance. In addition, the bitline verification voltage applied to bitlines of target storage cells during the precharge subinterval, can be at a relatively high value to maintain the accuracy of program state verification.

Abstract: Each of memory blocks of a nonvolatile memory device includes first memory cells of a first portion of pillar and second memory cells of a second portion of the pillar. When performing program operations based on consecutive addresses at a memory block selected from the memory blocks, the nonvolatile memory device sequentially completes first program operations of non-adjacent memory cells not adjacent to a boundary of the first portion and the second portion from among the first and second memory cells and then completes a second program operation of an adjacent memory cell adjacent to the boundary.

Abstract: A memory system includes a non-volatile memory block, a random bit block, and a sense amplifier. The non-volatile memory block includes a plurality of non-volatile memory cells for storing a plurality of bits of data. Each of the non-volatile memory cells includes a first storage transistor. The random bit block includes a plurality of random bit cells for providing a plurality of random bits. Each of the random bit cells includes a second storage transistor and a third storage transistor. The sense amplifier senses a first read current of a non-volatile memory cell during a read operation of the non-volatile memory cell and senses a second read current of a random bit cell during a read operation of the random bit cell. The first storage transistor, the second storage transistor, and the third storage transistor are storage transistors of the same type.

Abstract: Some embodiments include an integrated assembly having a primary access transistor. The primary access transistor has a first source/drain region and a second source/drain region. The first and second source/drain regions are coupled to one another when the primary access transistor is in an ON mode, and are not coupled to one another when the primary access transistor is in an OFF mode. A charge-storage device is coupled with the first source/drain region. A digit line is coupled with the second source/drain region through a secondary access device. The secondary access device has an ON mode and an OFF mode. The digit line is coupled with the charge-storage device only when both the primary access transistor and the secondary access device are in their respective ON modes.

Abstract: A memory circuit includes: memory cells each including a storage transistor having a first configuration; and a tracking circuit including: a tracking bit line having first and second intermediary nodes; a tracking word line; a first finger circuit (coupled between the first intermediary node and a reference voltage node) including: a first set of first tracking cells, each including a first shadow transistor having the first configuration; and a second finger circuit (coupled between the second intermediary node and the reference voltage node) including: a second set of second tracking cells, each including a second shadow transistor having the first configuration; gate terminals of the first and second shadow transistors being coupled with the tracking word line; and a switch configured to selectively couple the first intermediary node with the second intermediary node and thereby selectively couple the first and second finger circuits in parallel.

Abstract: An apparatus, system, and method for controlling data transfer to an output port of a serial data link interface in a semiconductor memory is disclosed. In one example, a flash memory device may have multiple serial data links, multiple memory banks and control input ports that enable the memory device to transfer the serial data to a serial data output port of the memory device. In another example, a flash memory device may have a single serial data link, a single memory bank, a serial data input port, a control input port for receiving output enable signals. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices.

Abstract: A non-volatile semiconductor memory device includes a memory cell array and a control circuit. A control circuit performs an erase operation providing a memory cell with a first threshold voltage level for erasing data of a memory cell, and then perform a plurality of first write operations providing a memory cell with a second threshold voltage level, the second threshold voltage level being higher than the first threshold voltage level and being positive level. When the control circuit receives a first execution instruction from outside during the first write operations, the first execution instruction being for performing first function operation except for the erase operation and the first write operations, the circuit performs the first function operation during the first write operations.

Abstract: An One-Time Programmable (OTP) memory is built in at least one of nano-wire structures. The OTP memory has a plurality of OTP cells. At least one of the OTP cells can have at least one resistive element and at least one nano-wires. The at least one resistive element can be built by an extended source/drain or a MOS gate. The at least one nano-wires can be built on an isolated structure that has at least one MOS gate dividing nano-wires into at least one first active region and a second active region. The first active region can be doped with a first type of dopant and the second active region can be doped with a first or second type of dopant. The OTP element can be coupled to the first active region with the other end coupled to a first supply voltage line. The second active region can be coupled to a second voltage supply line and the MOS gate is coupled to a third voltage supply line.

Abstract: Disclosed are methods, systems and devices for operation of memory device. In one aspect, volatile memory bitcells and non-volatile memory bitcells may be integrated to facilitate copying of memory states between the volatile and non-volatile memory bitcells.

Abstract: Methods, systems, and devices for differential amplifier schemes for non-switching state compensation are described. During a read operation, a first node of a memory cell may be coupled with an input of differential amplifier while a second node of the memory cell may be biased with a first voltage (e.g., to apply a first read voltage across the memory cell). The second node of the memory cell may subsequently be biased with a second voltage (e.g., to apply a second read voltage across the memory cell), which may support the differential amplifier operating in a manner that compensates for a non-switching state of the memory cell. By compensating for a non-switching state of a memory cell during read operations, read margins may be increased.

Abstract: A memory system includes: a plurality of memory dies, and a controller selects a second read request, including at least a portion of a plurality of first read requests, so that the memory dies interleave and output data corresponding to the first read requests, and performs a correlation operation for the selected second read request, when the second read request is selected, the controller determines whether the correlation operation is performed or not before a time at which the second read request is selected, determines whether the correlation operation is successful or not, determines a pending credit in response to an operation state of the memory dies at the time at which the second read request is selected, and determines whether to perform the correlation operation or not for the second read request that is selected at the time at which the second read request is selected based on the pending credit.

Abstract: A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value.

Abstract: Discussed herein are systems and methods for protecting against transistor degradation in a high-voltage (HV) shifter to transfer an input voltage to an access line, such as a global wordline. An embodiment of a memory device comprises memory cells and a HV shifter circuit that includes a signal transfer circuit, and first and second HV control circuits. The signal transfer circuit includes a P-channel transistor to transfer a high-voltage input to an access line. The first HV control circuit couples a bias voltage to the P-channel transistor for a first time period, and the second HV control circuit couples a stress-relief signal to the P-channel transistor for a second time period, after the first time period, to reduce degradation of the P-channel transistor. The transferred high voltage can be used to charge the access line to selectively read, program, or erase memory cells.

Abstract: Disclosed in some examples are methods, systems, memory devices, machine readable mediums configured to intentionally degrade NAND performance when a value of a NAND health metric indicates a potential for failure to encourage users to replace or backup their devices before data loss occurs. For example, the system may track a NAND health metric and when that metric reaches a predetermined threshold or state, the system may intentionally degrade performance. This performance degradation may be more effective than a warning to effect device backup or replacement.

Abstract: A memory device having non-volatile memory cells and a controller. In response to a first command for erasing and programming a first group of the memory cells, the controller determines the first group can be programmed within substantially 10 seconds of their erasure, erases the first group, and programs the first group within substantially 10 seconds of their erasure. In response to a second command for erasing and programming a second group of the memory cells, the controller determines that the second group cannot be programmed within substantially 10 seconds of their erasure, divides the second group into subgroups of the memory cells each of which can be programmed within substantially 10 seconds of their erasure, and for each of the subgroups, erase the subgroup and program the subgroup within substantially 10 seconds of their erasure.