Abstract: The present invention is a centrifugal projector (1) for projecting projection material (2) toward a processing target, comprising a side plate (11), a plurality of blades (3) attached to the side plate, a rotary shaft (14) for rotating the side plate and the blades, and an introducing part (32) for introducing the projection material between the blades; wherein the blades (3) includes a projection surface (3a) for projecting the projection material, and the projection surface (3a) has a first part (3b) being a radial inner part of the blade and a second part (3c) being a radial outer part of the blade; the first part (3b) is formed to be pitched so that a radial outer side (3e) of the first part is positioned to a rear in the rotational direction (R1) compared to a radial inner side (3f) of the first part, and the second part (3c) of the blade is formed to be positioned to a front in the rotational direction (R1) of an imaginary line (L1) which extends the first part (3b) of the blade toward a radial outer s

Abstract: An adapter for a fixture for sharpening dental instruments has an engagement arm for connecting to the fixture and for creating a holding space for different width sharpening stones, a bearing shelf for supporting different width sharpening stones, and a base member for supporting the adapter when connected to the fixture.

Abstract: The present disclosure involves a method of making a lapping plate by electrostatically coating a platen with solid resin powder and abrasive particles followed by curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Abstract: A portable booth assembly for receiving a work piece to facilitate working on a work area of the work piece including a housing and an inner core disposed within an interior area of the housing is provided. The portable booth assembly includes an aperture that is formed in the housing and the inner core. The aperture is configured to receive the work piece. The inner core defining the aperture is configured to be supported by the work piece if the work piece is large, or support the work piece if the work piece is small, and isolate the work area within the portable booth assembly. The portable booth assembly further includes a cut out formed in the housing. The cut out is configured to enable access to the work area for working on the work area.

Abstract: A truer includes: a core formed into a truncated cone; and an abrasive grain layer fixed onto an outer peripheral surface of the core. The core includes: a base that is a small-diameter portion of the truncated cone and has a disc shape; and a tubular member extending from an outer peripheral edge of the base in the direction in which a rotation axis of the truncated cone extends. The tubular member has a hollow tubular shape. The tubular member includes an outer peripheral surface tapered so that a portion of the tubular member opposite to the base and adjacent to an extremity of the tubular member is a large-diameter portion of the truncated cone. A recess opening toward the extremity is defined inward of the tubular member.

Abstract: This invention provides a method for growing monocrystalline silicon by applying Czochralski method comprising forming a melt of silicon-containing materials in a crucible and pulling the melt for monocrystalline silicon growth, which is characterized by, introducing a gas containing argon during formation of the melt, and, applying a magnetic field during the pulling step. This invention also provides a method for producing a wafer based on the above monocrystalline silicon.

Abstract: Embodiments of a multi-purpose utility clamp may include a component engagement member having a clamp head and a handle. A guide arm is operatively connected to the component engagement member at a first end of the guide arm. A first post is operatively connected to a second end of the guide arm to move linearly relative to the guide arm. A second post at an end of the support post is disposed generally perpendicular to the first post and has a first end connected to the first post and a second end, distal the first end, and the second end is disposed opposite the clamping head. The second post has a generally trapezoidal cross-sectional shape along a length thereof between the first end and the second end, and the second post is configured to be inserted into a channel having a corresponding trapezoidal shape and formed in an auxiliary component to be clamped to another component.

Abstract: A polymeric material suitable for use in lapping processes, media including the polymeric material, systems including the media, and methods of forming and using the polymeric material are disclosed. The polymeric material can be used to lap hard surfaces, such as sapphire surfaces. The lapping process can be performed after a grinding process and before a polishing process.

Abstract: A method of grinding the tooth slots of a workpiece with a freshly dressed grinding wheel wherein dual-machining of tooth slots is eliminated. The method comprises grinding the first few slots of a gear at a corrected depth amount which accounts for the rapid wear and other conditions of the freshly dressed grinding wheel wherein for a first number of tooth slots (e.g. 1, 2, 3 or more), the grinding wheel is fed-in relative to the workpiece by the corrected depth amount.

Abstract: A semiconductor wafer has a base material. The semiconductor wafer may have an edge support ring. A grinding phase of a surface of the semiconductor wafer removes a portion of the base material. The grinder is removed from or lifted off the surface of the semiconductor wafer during a separation phase. The surface of the semiconductor wafer and under the grinder is rinsed during the grinding phase and separation phase to remove particles. A rinsing solution is dispensed from a rinsing solution source to rinse the surface of the semiconductor wafer. The rinsing solution source can move in position while dispensing the rinsing solution to rinse the surface of the semiconductor wafer. The grinding phase and separation phase are repeated during the entire grinding operation, when grinding conductive TSVs, or during the final grinding stages, until the final thickness of the semiconductor wafer is achieved.

Abstract: The invention relates to an edging pad for releasably connecting a material blank that is to be edged to a holder, wherein the edging pad has a polymeric carrier layer and adhesive coatings which are applied to both sides of the polymeric carrier layer, wherein one side of the polymeric carrier layer, which is to be connected to the holder, has an adhesive coating formed of a first adhesive, and the other side of the polymeric carrier layer, which is to be connected to the material blank, has an adhesive coating formed of a second and a third adhesive which are different from one another, such that the second adhesive provides adhesiveness to the material blank and the third adhesive is an adhesive which limits twisting and slippage of the polymeric carrier layer relative to the material blank, wherein the second adhesive and the third adhesive are applied to the other side of the polymeric carrier layer in separate regions.

Abstract: This process for manufacturing a closed loop of cutting wire comprises manufacturing a cutting wire comprising a central core extending continuously between two free ends. The central core having a tensile strength higher than 1400 MPa. The process includes welding the two free ends together to form the closed loop of cutting wire, in which: the manufacture of the cutting wire comprises making the central core from a material that is solid-state weldable. The welding is a solid-state welding operation comprising crushing, at a temperature below the melting point of the material of the central core, one of the free ends against the other of its free ends until the two ends have interpenetrated and formed a single uniform body of material.

Abstract: A surface treatment method for metal parts includes a polishing step of supplying and discharging a cleaning liquid into and from a barrel tub while mass including a metal part and a medium is caused to flow in the barrel tub, so that a surface of the metal part is polished. The polishing step is carried out at least once. The polishing step includes a final finish polishing process in which a final finish medium which is free from abrasive grain or which consists of a synthetic resin base material and is free from abrasive grain or which is made by binding abrasive grain of not more than 10 wt % and a synthetic resin binding material together and is free from alumina is used as the medium.

Abstract: An abrasive article includes a body having an annular surface including abrasive segments coupled to the annular surface, and the abrasive segments define an abrasive annular region and a percent abrasive surface area of not greater than 24% for the total surface area of the abrasive annular region.

Abstract: A safety cover used in a sand grinder is disclosed to include a cover body rotatably mounted at the base of the sand grinder around the sand wheel and having equiangularly spaced oval locating holes, a positioning device selectively engaged into one of the oval locating holes, and a switching lever mounted at the base and biasable between a locking position where an abutment portion of the switching lever is abutted against the positioning device to lock the positioning device in one oval locating hole and an unlocking position where a bearing portion of the switching lever faces toward the positioning device for enabling the positioning device to be disengaged from the respective oval locating hole.

Abstract: A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit, which may be arranged in the listed order. Each of the units may be configured to utilize hot liquid or water to clean the part being processed. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency.

Abstract: An attachment is configured to be used with a hand-held rotary power tool. The attachment includes a housing, a sanding disk, and a cap. The housing has a first portion hingedly connected to a second portion so as to be rotatable into a closed configuration. The housing receives the sanding disk when the housing is positioned in the closed configuration. The cap is coupled to the first and second portions of the attachment housing when the housing is positioned in the closed configuration. The cap includes an end that is closed by an access portion and a guiding portion. The access portion includes an opening configured to provide access through the cap to the abrasive surface of the sanding disk when the cap is coupled to the housing.

Abstract: The present disclosure relates to polishing pads which include a polishing layer, wherein the polishing layer includes a working surface and a second surface opposite the working surface. The working surface includes a plurality of precisely shaped pores, a plurality of precisely shaped asperities and a land region. The present disclosure further relates to a polishing system, the polishing system includes the preceding polishing pad and a polishing solution. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

Abstract: There is provided a substrate processing method which includes polishing a rear surface of a substrate before a pattern exposure such that the rear surface is subjected to a roughening treatment; and bypassing a roughness alleviating treatment with respect to the polished rear surface of the substrate.

Abstract: The invention relates to a combined type wheel burr brush, consisting of a lower bottom plate, lantern rings, nylon brush units, an upper bottom plate, steel-wire brush units and the like, wherein the steel-wire brush units in II and IV areas are floating, and under a natural state, the height of the steel-wire brush units is 10 mm higher than that of the nylon brush units; when in work, the steel-wire brush units firstly contact a spoke of a back cavity of a wheel, burrs of the back cavity of the wheel can be removed powerfully when the steel-wire brush units rotate, the steel-wire brush units are continuously compressed, and when the nylon brush units also contact the spoke of the back cavity, burrs at corners can be smoothened; and when a small-size wheel is encountered, by removing the lower bottom plate, the fast locks and the lantern rings, a small-size burr brush can be formed.