Abstract: A nozzle device produces a more convergent water jet to improve the quality of a cut surface. The nozzle device includes a liquid supply channel for supplying a liquid, an orifice for discharging the liquid supplied from the liquid supply channel to produce a water jet, a straightening unit arranged downstream of the water jet from the orifice and having a through-hole to surround the water jet, a first air supply channel for supplying a gas toward a location upstream of the water jet from the through-hole and toward the orifice, and a second air supply channel arranged downstream of the water jet from the first air supply channel for supplying the gas toward a location inside the through-hole or a location downstream of the water jet from the through-hole.

Abstract: A brush-like grinding stone (3) in a polishing brush (1) includes a brush holder (6) and a linear member aggregate (7) detachably held in the brush holder (6). The linear member aggregate (7) includes a large number of bundles (51) of the linear members (50) obtained by hardening aggregated yarn of inorganic filaments impregnated with a resin, and a brush holder (70) holding ends of the bundles (51). A linear member holder (70) in the linear member aggregate (7) is detachably attached to each of a plurality of holding holes (68) that is open in one side in an axial line direction L. In a case where any of the linear member aggregates has a failure, such as breakage, only the failed linear member aggregate needs to be replaced. Thus, it is not necessary to discard the entire brush-like grinding stone. Consequently, the polishing cost can be reduced.

Abstract: A polishing method capable of obtaining a stable film thickness without being affected by a difference in measurement position is disclosed. The polishing method includes: rotating a polishing table that supports a polishing pad; pressing the surface of the wafer against the polishing pad; obtaining a plurality of film-thickness signals from a film thickness sensor during a latest predetermined number of revolutions of the polishing pad, the film thickness sensor being installed in the polishing table; determining a plurality of measured film thicknesses from the plurality of film-thickness signals; determining an estimated film thickness at a topmost portion of the raised portion based on the plurality of measured film thicknesses; and monitoring polishing of the wafer based on the estimated film thickness at the topmost portion of the raised portion.

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad for polishing a substrate, and to rotate the polishing pad. The apparatus further includes a dressing module configured to hold a dresser for dressing the polishing pad, and to dress a surface of the polishing pad by sweeping the polishing pad with the dresser while rotating the dresser. The apparatus further includes a controller configured to control a number of revolutions of the polishing table based on a position of the dresser to the polishing table, while the polishing pad is dressed.

Abstract: The present disclosure relates to grinding apparatus for grinding the hard metal inserts of rock drill bits, said grinding apparatus having said grinding machine equipped with a grinding cup driven by a motor to rotate about its longitudinal axis wherein the support system comprises an arm or lever system to control vertical movement of the grinding machine and means to provide grinding pressure, wherein the means to provide grinding pressure may be a linear actuator and load cell assembly pivotally connected to the arm or lever system.

Abstract: A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as abrasive disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape. A further aspect includes an inner ring edge having radially extending slots between pairs of radially enlarged tool mounting peaks. Still another aspect includes an insulator or spacer between a head of an abrasive tool and a reinforcement ring.

Abstract: An improved handle arrangement is provided for a power tool, such as a sander. The sander may include: a housing; a primary handle extending in a rearward direction away from an upper rear portion of the housing; a secondary handle positioned at an upper front portion of the housing, where the secondary handle is formed as a knob protruding in a forward direction which is opposite the rearward direction; a platen coupled to a lower portion of the housing; and a motor assembly disposed within the housing. A groove may be formed into an exterior surface of the housing along an intermediate portion of the housing, such that the intermediate portion extends between the primary handle and the secondary handle and the groove extends from a top surface of the housing towards a lower portion portion of the housing along opposing side surfaces of the housing.

Abstract: A sanding and smoothing apparatus for pool cue shafts comprises an elongate resilient main body having generally concentrically disposed resilient radially-inner and radially-outer C-shaped members. The apparatus is sized for mating engagement with the tapered shaft of a pool cue received in close fitting conforming relation with the inner surface of the radially-inner C-shaped member. The inner surface of the radially-inner C-shaped member is provided with a suitable abrasive sanding material, which may comprise a sanding sheet or an abrasive coating.

Abstract: A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.

Abstract: In order to provide a handheld abrading machine which is of robust construction and is easy and comfortable to handle, it is proposed that the handheld abrading machine comprise a holding device for holding the abrading machine, a drive motor and a tool head, wherein the tool head is arranged on the holding device such as to be moveable by means of a moving device, wherein the tool head is pivotal relative to the holding device about one or more pivotal axes by means of the moving device and wherein a distance of the tool head from the holding device is variable by means of the moving device.

Abstract: A method of machining an object, the method comprising: receiving a signal from an ultrasonic transducer; determining at least a first external surface of the object and a second internal surface of the object in the received signal; determining a thickness between the first external surface and the second internal surface of the object, the object comprising a first material between the first external surface and the second internal surface, and a second material between the second internal surface and a third surface, the determination of the thickness using a database including a plurality of materials and a plurality of associated acoustic wave velocities; and controlling machining of the first external surface using the determined thickness.

Abstract: A method of shaping a laminated glass structure includes providing the laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive layer. The flexible glass structure and adhesive layer are ground using a first tool to remove glass material. The non-glass substrate is cut with a second tool different from the first tool through a kerf formed through the flexible glass structure thereby forming a shaped laminated glass structure. A glass edge strength of a cut edge of the shaped laminated glass structure is at least about 20 MPa.

Abstract: A polishing apparatus according to one embodiment includes: a turn table on which a polishing pad for polishing a substrate is provided; a turn table rotation mechanism configured to rotate the turn table; a dresser configured to dress the polishing pad by cutting a surface of the polishing pad; a pressing mechanism configured to press the dresser onto the polishing pad; a dresser rotation mechanism configured to rotate the dresser; a swinging mechanism configured to swing the dresser on the polishing pad; and a controller configured to control the pressing mechanism, the turn table rotation mechanism or the dresser rotation mechanism based on a position and a swinging direction of the dresser.

Abstract: The present invention relates to a wheel brush, which is composed of a base plate, springs, chucks, iron sleeves and bristles. When a bristle unit is to be mounted, the iron sleeve of the bristle unit is placed on the upper side of the base plate, two anti-rotating lugs are made to correspond to two lug slots in the base plate, and the chuck is inserted from the lower side of the base plate; after a gasket is fixed in a counter bore in the lower side of the base plate, a wing nut is continuously pressed upwards, so that the spring is tensioned, and two guiding lugs of a fixing pin come into contact with the bottom ends of guiding slots in the iron sleeve; and after the wing nut is rotated by 90 degrees, the bristle unit can be locked.

Abstract: The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

Abstract: A deep hole drill head support pad whose edge chamfers are formed in a continuous grinding operation so that there are no discontinuities in the angled side surface leading up to the outer surface thereof. A method of manufacturing the support pad includes generating a virtual guide metric including a curved travel path for a grinding surface around a support pad blank, and a plurality of control surfaces intersecting with the curved path at separate locations along its length, each control surface defining an angle of orientation of the grinding surface. A CNC grinding machine can interpret the virtual guide metric to change the angle of orientation of a grinding surface relative to a support pad blank as it moves between adjacent control surfaces in a continuous manner.

Abstract: [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

Abstract: A grinding machine includes a support and a board which is connected to the connection portion of the support. The board has a first opening and a second opening. A transportation device is connected across over the first and second openings. A grinding device has a driving portion and a grinding portion which is connected to the driving portion. The driving portion is connected to the support so that the grinding portion is located above the transportation device. An angle adjustment device is connected between the board and the transportation device so as to adjust inclination of the transportation device so as to grind a larger area of an object.

Abstract: A dressing apparatus for dressing a urethane foam pad, for use in polishing, by bringing diamond abrasive grains into sliding contact with the urethane foam pad, includes a support for holding the grains. The grains have multiple grit sizes, and include a high-grit diamond abrasive grain with a grit size of #170 or more and a low-grit diamond abrasive grain with a grit size of #140 or less. The grains are held by the support such that height positions of dressing surfaces of the grains are on the same plane. The dressing surfaces come into contact with the urethane foam pad. As a result, a dressing apparatus is capable of sufficiently roughening the surface of the urethane foam pad by one-time dressing without closing holes of the foaming part of the urethane foam pad, enabling short dressing time, long dressing interval, and inhibition of lowering of productivity.

Abstract: A grinding tool for a grinding device with an oscillatory drive, in particular a rotary oscillatory drive is disclosed, the drive shaft of which can be driven about its longitudinal axis, wherein the grinding tool includes a holder having a support for securing to the drive shaft of the oscillatory drive, and whereon a form profile with a grinding mechanism is provided, wherein the holder includes a profile support for releasable securement of the form profile, and wherein the profile support includes a clamping region, into which the form profile can be inserted with a holding section and can be fixed thereto, and which can be elastically enlarged for releasing the form profile.