Abstract: A cleaning system includes a blade handling assembly configured to transport and clean a substrate. The blade handling assembly for handling a substrate in the cleaning system includes a gripping assembly including a pair of gripping blades, the blades operable with a gripping actuator to hold a substrate at its edges. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation utilizing a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and substrate 180 degrees utilizing a second axis, thereby causing the substrate to face an opposite direction.

Abstract: A gripper gripping a plurality of types of probe cards includes a frame, a driving unit connected to the frame, and a plurality of gripper portions connected to the driving unit and including an inner gripper portion and an outer gripper portion. The gripper portions include a moving block moving in a radial direction as the driving unit is driven, and the inner gripper portion and the outer gripper portion connected to the moving block. The outer gripper portion is rotatably connected to the moving block, and is configured such that the outer gripper portion rotates downward with respect to the moving block as the moving block moves in a radial outward direction.

Abstract: A handling system includes a tube lifter with a lifting tube having a tube interior, and an end effector mounted on the lifting tube and rotatable about an end effector axis of rotation, a manipulator for displacing the end effector, and a coupling device for coupling the tube lifter to the manipulator. The coupling device has a first tube lifter coupling portion and a second manipulator coupling portion, the coupling portions can be connected to one another by a connecting device. The manipulator has a driven rotary element rotatable about a manipulator axis of rotation. The coupling device includes a gearbox configured to translate a rotary movement of the rotary element about the manipulator axis of rotation into a rotary movement of the end effector about the end effector axis of rotation in the connected state of the first and second coupling portions.

Abstract: Apparatus and methods for handling semiconductor part carriers are disclosed. In one example, an apparatus for handling semiconductor part carriers is disclosed. The apparatus includes a mechanical arm and an imaging system coupled to the mechanical arm. The mechanical arm is configured for holding a semiconductor part carrier. The imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.

Abstract: A stocking device includes a case including a central portion therein, extending a first direction, a longitudinal direction, and provided with a first storage portion and a second storage portion on both sides of the central portion in a second direction, a width direction, a shelf portion provided in the first storage portion and the second storage portion and having a plurality of shelves with an electronic component loaded thereon, a first port located in the first storage portion, and having a first open surface in which at least a portion of a side of the case is open in the second direction to communicate externally.

Abstract: A pick and place method includes providing at least one semiconductor element disposed on a source storage location, picking up the at least one semiconductor element from the source storage location, transferring the at least one semiconductor element to a temporary storage device according to a signal, positioning the at least one semiconductor element via the temporary storage device, and picking up the positioned semiconductor element from the temporary storage device and placing the positioned semiconductor element on a destination storage location.

Abstract: A hand includes a first holding unit, and a second holding unit. The first holding unit includes a plurality of first holding portions capable of holding an article. A plurality of the first holding units is provided in a second direction and is movable independently of each other in a first direction crossing the second direction. The second holding unit is movable in a third direction crossing a plane parallel to the first direction and the second direction. The second holding unit includes a plurality of second holding portions capable of holding the article.

Abstract: A substrate pickup tool is used to pick up a substrate provided with a through hole. The substrate pickup tool includes a gripper frame and a flexible gripper. The flexible gripper includes an annular mount portion and a plurality of claw portions. The annular mount portion is mounted on the gripper frame, the claw portions are connected to the annular mount portion and each has an outer contact surface. The flexible gripper is used to correspond to the through hole of the substrate, and the claw portions are driven to move relative to the annular mount portion for pressing against an inner wall surface of the through hole via the outer contact surface of each of the claw portions.

Abstract: A shock-absorbing element (1) for buckets (2) with door (4) of cable excavator shovels, comprising push cables (6) connected to the bucket (2) to controls its inclination, to cushion impacts of the bucket (2) on a boom (3) of the excavator shovel, improving the protection of the boom (3) and the push cables (6), wherein the shock-absorbing element (1) comprising: an elongated metal base (9), hollow inside, comprising joining surfaces (10) at each end configured to join to the upper part of the door (4) of the bucket (2) and a central longitudinal recess (12) defining an intermediate space (7); and two rubber pieces (8) fixed to the metal base (9), being separated by the intermediate space (7), wherein the intermediate space (7) is configured to receive the push cables (6) of the bucket (2), allowing said push cables (6) to remain between the two rubber pieces (8).

Abstract: Equipment is used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a substrate cleaning unit may include a pre-clean chamber that performs a pre-clean process on a substrate with the substrate in a horizontal orientation. The unit may also include a first cleaning chamber that performs a first cleaning process on the substrate with the substrate in a vertical orientation. The unit may also include a second cleaning chamber. The unit may also include an integrated cleaning and drying chamber that performs a cleaning and drying process on the substrate in the horizontal orientation. A substrate handler may transfer the substrate between the chambers. The first and second cleaning chambers may be positioned below the pre-clean chamber.

Abstract: Gripping device for crates having a first abutment and a second abutment in contact with two panels of a crate that are adjacent and perpendicular to one another. A first presser, in the active position, is able to press on the free edge of the first panel, exerting an operating thrust along at least the main direction, and a second presser, in the active position, is able to press on the free edge of the second panel, exerting an operating thrust along at least the main direction. A first cursor, in the operating position, is able to engage with the first panel, to prevent a movement of the first panel along the main direction, and a second cursor, in the operating position, is able to engage with the second panel, to prevent a movement of the second panel along the main direction.

Abstract: The semiconductor carrier storage system includes storage ports each of which accommodates a semiconductor carrier, a shuttle rail that extends in a horizontal direction on a side of the storage ports, an internal carrier shuttle that moves along the shuttle rail and transfers a semiconductor carrier to each of the storage ports, and an upper transfer port that receives the semiconductor carrier from an overhead hoist transport (OHT). The internal carrier shuttle includes a shuttle body coupled to the shuttle rail, a transfer wheel that connects the shuttle body to the shuttle rail, a gripper that holds the semiconductor carrier, and a hoist that vertically extends between the shuttle body and the gripper and drives the gripper to vertically move.

Abstract: An apparatus for manufacturing a semiconductor device includes a substrate transfer unit configured to transfer a substrate, a rail unit including a driving rail extending in a first direction that the substrate transfer unit moves and a stopper on a side of the driving rail in a second direction crossing the first direction, and a lifting unit configured to move in the first direction and a third direction perpendicular to the first and second directions to remove the substrate transfer unit from the rail unit, wherein the lifting unit is configured to contact the stopper to move the stopper from a closed state to an open state.

Abstract: Systems and methods for end of arm tools having belt-driven engagement members and related item manipulation devices are provided. In one embodiment, an example item manipulation device may include a housing, a suction cup assembly having a first suction cup, where the suction cup assembly is positioned at a distal end of the housing, a first engagement member having a first arm portion configured to rotate with respect to the housing, a first belt coupled to the first arm portion, and a first actuator configured to actuate the first belt to cause the first arm portion to rotate with respect to the housing.

Abstract: A management device is for use in a component mounting system including a component mounting machine having a supply target attachment section and a buffer target attachment section. In a case where a target feeder to be used in a target job to be executed from the next time are pre-served on the component mounting machine, the management device is configured to determine a serving destination among empty slots in a supply target attachment section and empty slots in a buffer target attachment section by giving priority to the empty slots in the buffer target attachment section, and cause a work device to pre-serves the target feeder in the determined serving destination.

Abstract: A system for a semiconductor fabrication facility comprises a transporting tool configured to move a carrier, a first manufacturing tool configured to accept the carrier facing in a first direction, a second manufacturing tool configured to accept the carrier facing in the second direction, and an orientation tool. The carrier is moved to the orientation tool by the transporting tool prior to being moved to the first manufacturing tool or the second manufacturing tool by the transporting tool. The orientation tool rotates the carrier so that the carrier is accepted by the first manufacturing tool or the second manufacturing tool. The transporting tool, the first manufacturing tool, the second manufacturing tool and the orientation tool are physically separated from each other.

Abstract: A method for operating a substrate transferring device that includes a substrate container holding at least two substrates stacked vertically, a hand having two fingers, a manipulator, and a controller. A mapping device detects a vertical position of a higher substrate, and a substrate detector measures a distance to a principal surface of the substrate. The controller moves the hand to a position below the detected vertical position and then advances the hand to pick up the higher substrate. During forward movement, the substrate detector acquires at least three consecutive, linearly aligned distance measurements along a front-and-rear direction. Based on a relationship among the measurements, the controller determines whether the principal surface of the higher substrate is warped. If warpage is detected, the controller predicts a possibility of collision between the hand and the substrate and withdraws the hand to avoid collision.

Abstract: In order to improve transport efficiency of an object transport system, an object transport system includes, a ceiling carrier configured to travel on at least travel rail and transport an object; and a transfer device including a hanging part configured to hang the object and configured to be capable of being raised and lowered, the transfer device being disposed so as to be separated from the ceiling carrier.

Abstract: An articulated work robot device includes a lower body, a bridgehead coupled to a common axis at a first position of the lower body to be rotatable, first and second articulated arms configured to be overlapped with each other up and down and having first ends respectively disposed at second and third positions opposite to each other with respect to the common axis on the bridgehead to be rotatable together through the common axis, first and second plurality of hands respectively coupled at second ends of the first and second articulated arms through scissor links, and first and second composite drive modules disposed in an internal space of the bridgehead and driving the first and second articulated arms and the first and second plurality of hands, respectively.

Abstract: A substrate treating apparatus includes a substrate holder that holds a treatment substrate group, a second transport mechanism configured to pull out and transport a divided substrate group from the treatment substrate group held by the substrate holder, and an underwater posture turning unit to turn the orientation of the divided substrate group from vertical to horizontal. A center robot takes and transports one substrate from the divided substrate group to the one substrate to a single-wafer processing unit. A lifting and lowering unit moves the substrate holder and the second transport mechanism upward/downward relatively. An alignment direction relative moving unit moves the substrate holder and the second transport mechanism horizontally in an alignment direction where the treatment substrate group is aligned. The second transport mechanism includes paired chucks having holding grooves and passing grooves arranged alternately.