Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

Abstract: A load port apparatus connects a main opening of a wafer transportation container to a frame opening. The apparatus includes an installation unit, a frame unit, a flange clamp unit, and a detection unit. The installation unit includes an installation table configured to install the container and relatively move to the frame opening. The frame unit is upright upward from the installation unit and includes the frame opening. The flange clamp unit includes an engagement section and a drive section. The engagement section is engageable with a flange surrounding an outer circumference of the main opening. The drive section drives the engagement section to carry out an engagement operation and a separation operation. The detection unit detects the engagement operation by the flange clamp unit with classification into a normal engagement operation and an abnormal engagement operation.

Abstract: An apparatus including at least one drive; a first robot arm having a first upper arm, a first forearm and a first end effector. The first upper arm is connected to the at least one drive at a first axis of rotation. A second robot arm has a second upper arm, a second forearm and a second end effector. The second upper arm is connected to the at least one drive at a second axis of rotation which is spaced from the first axis of rotation. The first and second robot arms are configured to locate the end effectors in first retracted positions for stacking substrates located on the end effectors at least partially one above the another. The first and second robot arms are configured to extend the end effectors from the first retracted positions in a first direction along parallel first paths located at least partially directly one above the other.

Abstract: A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.

Abstract: A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

Abstract: A compressible lip for a suction cup has in its engagement area one or more sectional areas, each of which comprises a flow passage capable of forming a flow restriction together with a surface of an object to be engaged by the lip. The flow restriction formed restricts airflow from the sectional area, thus allowing a suction cup provided with such lip to maintain an overall high vacuum level despite of pressure loss in one, or some, of its sectional areas. A suction cup having such compressible lip is also disclosed.

Abstract: A system configured to couple an implement to a work vehicle includes a first lock assembly coupled to an arm of the work vehicle, and the first lock assembly includes a first lock, a second lock, and a first actuator configured to drive the first lock and the second lock laterally outwardly to engage respective first openings formed in the implement. The system also includes a second lock assembly coupled to a frame of the work vehicle, and the second lock assembly includes a third lock, a fourth lock, and a second actuator configured to drive the third lock and the fourth lock laterally outwardly to engage respective second openings formed in the implement.

Abstract: A system includes an equipment front end module chamber, alignment pedestals housed within the equipment front end module chamber, and a load/unload robot at least partially housed within the equipment front end module chamber. The alignment pedestals include a first alignment pedestal having a first support surface and a second alignment pedestal having a second support surface, and the first support surface has a vertical offset and an overlap region having at least a partial overlap relative to the second support surface. The load/unload robot includes an arm, and vertically arranged blades attached to the arm. The vertically arranged blades include an upper blade configured to transfer a first substrate to the first alignment pedestal and a lower blade configured to transfer a second substrate to the second alignment pedestal.

Abstract: A wafer stocker is capable of further improving an environment around wafers. The wafer stocker includes a housing, a loading device provided on a front surface of the housing, a wafer cassette shelf arranged in the housing, a wafer transfer robot configured to move the wafers from a transfer container mounted on the loading device to a wafer cassette in the wafer cassette shelf, a wafer cassette delivery device configured to move the wafer cassette in the wafer cassette shelf to a stage having a different height, and a fan filter unit configured to generate a laminar flow in a wafer transfer space and in a wafer cassette transfer space.

Abstract: An example robot includes inks comprising a first link and a second link, together with joints among the links. A joint between the first link and the second link is configured to enable relative movement between the first link and the second link. An end effector is connected in series with one of the joints. A hose assembly is connected to the end effector. The hose assembly includes a hose having a first end for making connection to a vacuum source and a second end for making connection to the end effector. An elasticity of the hose assembly is greater along the length of the hose assembly than along the cross-section of the hose assembly.

Abstract: A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.

Abstract: A substrate treating apparatus and a substrate transporting method wherein a platform is disposed on a first ID block, and a platform is placed on a second ID block. A currently-used carrier platform is provided only on the first ID block. Accordingly, a substrate is transported in both a forward path and a return path between the first ID block and a second treating block. The substrate is returned not to the first ID block but to the second ID block disposed between the two treating blocks in the return path.

Abstract: A robotic system includes a hub assembly rotatable about a vertical axis. A robotic arm has a first end connected to the hub assembly and an opposite second end connected to an end effector, which is configured for holding an item. The system is configured to support an agent on or above the hub assembly for working on the item held by the end effector. The operation of the robotic arm and end effector to move the item does not obstruct operation of the agent.

Abstract: Exemplary substrate processing systems may include a transfer region housing defining a transfer region fluidly coupled with a plurality of processing regions. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a transfer apparatus having a central hub including a shaft extending at a distal end through the transfer region housing into the transfer region. The transfer apparatus may include a lateral translation apparatus coupled with an exterior surface of the transfer region housing, and configured to provide at least one direction of lateral movement of the shaft. The systems may also include an end effector coupled with the shaft within the transfer region. The end effector may include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports in the transfer region.

Abstract: A substrate transport arm including a first link; a second link rotatably connected to the first link; a third link rotatably connected to the second link at a wrist joint; and a mechanical transmission having a pulley. The third link includes an end effector configured to support a substrate thereon. The mechanical transmission is connected to the third link to control rotation of the third link on the second link. The mechanical transmission is configured to control rotation of the third link as a function of an angle between the first and second links such that, as the first and second links are rotated relative to each other, the wrist joint follows a wrist path which includes a curved portion, and where a center of the substrate supported on the end effector is moved along a substantially straight substrate path as the wrist joint follows the curved portion.

Abstract: A processing apparatus includes a chuck table that holds a workpiece, a cutting unit that processes the workpiece held by the chuck table, a cassette placing region where a cassette is placed, a carrying unit that carries the workpiece between the cassette placed in the cassette placing region and the chuck table, and a surrounding wall that partitions a route for lifting the cassette upward and downward from an external space, in a space directly above the cassette placing region. A height of the surrounding wall is equal to or more than a height of a ceiling wall of the processing apparatus and is so as not to interfere with the cassette held by a carrier that travels.

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.

Abstract: Systems and techniques for determining and correcting inter-wafer misalignments in a stack of wafers transported by a wafer handling robot. An enhanced automatic wafer centering system is provided that may be used to determine a smallest circle associated with the stack of wafers, which may then be used to determine whether or not the stack of wafer meets various process requirements and/or if a centering correction can be made to better align the wafers with a receiving station coordinate frame.

Abstract: An apparatus including a drive having motors and at least two coaxial drive shafts; an arm connected to the drive, where the arm is configured to support at least one substrate thereon; and a transmission connected between the drive and the arm, where the transmission includes an eccentric bearing and a linkage, where the linkage is connected between a first one of the coaxial drive shafts and the arm, where the eccentric bearing is connected to a second one of the coaxial drive shafts, where the arm comprises an aperture, where the eccentric bearing is located in the aperture, and where the eccentric bearing is configured to contact the arm in the aperture.

Abstract: A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.