Abstract: A transfer robot includes a movable mechanism, a support base moved by the movable mechanism, a horizontal arm pivotable relative to the support base around a first vertical axis, a motor in the horizontal arm to pivot the arm, and a hand disposed above the arm and rotatable relative to the arm around a second axis parallel to the first axis. The hand holds a planar workpiece placed thereon. The arm includes a rotation stage for holding the planar workpiece placed thereon. The rotation stage is rotatable around a third axis parallel to the first axis and movable vertically along the third axis. The hand has a holding center corresponding to the center of the planar workpiece, where the holding center is moved along a rotational trajectory extending across the third axis in plan view. The rotation stage is rotated by the motor provided in the horizontal arm.

Abstract: A workpiece delivery device includes a base, a turning center part, a turning arm, a workpiece hand, a track turning mechanism, and a rotation control mechanism, in which the track turning mechanism has a turning drive part, a track turning transmission part, and a track guide part, the rotation control mechanism has a rotation restriction transmission part, a rotation control part, and a rotation restriction receiving part, the turning center part, the turning drive part, the track turning transmission part, the rotation restriction transmission part, and the rotation restriction receiving part are provided on the turning arm, the track guide part and the rotation control part are provided on the base, the rotation restriction receiving part is provided on a workpiece hand support shaft, and the rotation restriction transmission part and the rotation restriction receiving part are connected to each other by a connection part.

Abstract: A substrate transfer robot for transferring a substrate in a vacuum chamber, includes: a transfer arm platform having coupling holes, each compartmentalized into a lower and an upper space, wherein link connecting members with blades are engaged at front and rear areas of the transfer arm platform and a support shaft of a lower support is inserted into the lower space of one of the coupling holes, and a first and a second transfer arm part each including an end effector for supporting the substrate, multiple transfer link arms, multiple subordinate link arms and a common link arm that are connected to each other or to the transfer arm platform, wherein, for each transfer arm part, drive shafts, interlocked with transfer driving motors or speed reducers installed on one of the transfer link arms, and output shafts interlocked with the drive shafts are installed on the transfer link arms.

Abstract: An object of the invention is to realize a high transfer throughput in a wafer transfer apparatus in which a wafer transfer robot transfers a wafer via an aligner. A wafer transfer apparatus includes a wafer transfer robot, and a separation dimension between a pair of wafer holding rods forming a finger of the wafer transfer robot is set to be larger than a dimension of a body portion of an aligner in a width direction provided in the wafer transfer apparatus. In addition, an elevating mechanism provided in the wafer transfer apparatus is configured to be able to move the finger to below the body portion of the aligner, thereby achieving the object of the invention.

Abstract: A working machine (1) includes a mobile chassis (2) that can move on a surface of the ground, a lifting arm (3) mounted on the chassis (2) to pivot about a horizontal axis (4) for a raising and lowering movement of the arm (3), and an accessory coupler (5) that can be secured to the free end of the arm (3) by a pivot link (6) with axis parallel to the axis (4) for pivoting the arm (3) with respect to the chassis (2). The coupler (5) has a plate (7) having a rear face (8) facing the arm (3) equipped with said pivot link (6) of the coupler (5) to the arm (3) and an opposite front face (9). The plate (7) is provided with a through-opening (10) and at least one part (61) of the pivot link (6) connecting the coupler (5) to the arm (3) is arranged facing the opening (10).

Abstract: A system comprises an equipment front end module (EFEM), a vacuum transfer module (VTM), a plurality off quad station process modules (QSMs). The EFEM is configured to receive a plurality of wafers. The EFEM comprises an EFEM transfer robot. The vacuum transfer module (VTM) is configured to receive the plurality of wafers from the EFEM. The VTM comprises a VTM transfer robot. The plurality of quad station process modules (QSMs) is coupled to the VTM. The VTM transfer robot is configured Oto transfer wafers between the VTM and the plurality of QSMs. The EFEM transfer robot is configured to transfer wafers between the EFEM and the VTM.

Abstract: An end-effector for a programmable motion device includes a body that includes a first portion having a vacuum opening through which a vacuum from a vacuum source is applied to an object, and a second portion that is adapted to engage the object. The first portion also includes ridges on a surface of the first portion to distribute the vacuum over a contact surface of the object. The first portion is generally orthogonal to the second portion.

Abstract: A lift arm including an attachment assembly and an electrical supply line having a first end and a second end. The first end is fixed in relation to the lift arm and the second end has a connector coupled to a mounting plate. The lift arm includes a first bracket affixed to the lift arm and a second bracket affixed to the attachment assembly. The mounting plate is moveable between and removably securable to the first bracket and the second bracket.

Abstract: A wafer cleaning apparatus and a wafer transfer device. The wafer transfer device includes a machine bracket, a drive mechanism, a retractable bracket, and a plurality of wafer support brackets. The drive mechanism and the retractable bracket are arranged at the machine bracket. An end of the retractable bracket is fixedly connected to the machine bracket. The second end of the retractable bracket is movably arranged at the machine bracket and arranged along the movement direction of the second end. The drive mechanism is connected to the retractable bracket and is configured to drive the second end to move to cause the retractable bracket to retract. The plurality of wafer support brackets are arranged at the retractable bracket. The distance between any two neighboring wafer support brackets changes as the retractable bracket extends and retracts.

Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.

Abstract: A transport system is a transport system in which an autonomous mobile robot transports an object. The autonomous mobile robot includes a mounting portion on which the object is mounted. The mounting portion includes a guide that engages with the object and regulates a moving direction of the object on a surface of the mounting portion to a predetermined direction.

Abstract: A module of a processing system for flipping a substrate in vacuum includes a clamp assembly for securing the substrate, a first motor assembly coupled to the clamp assembly for rotating the clamp assembly, and a second motor assembly coupled to the first motor assembly for raising and lowering the first motor assembly and the clamp assembly.

Abstract: An advanced tool drive system (ATDS) is capable of grasping a variety of tools through a common interface and provides multiple modes of operation for these tools for these tools. The ATDS is a combination of both a tool actuator and tool change-out mechanism and provides three nested drive actuators-two rotary and one linear. In addition to the tool drive, the ATDS includes four brushless direct current (BLDC) motors which provide the actuation torque to accomplish the multiple modes of ATDS operation, and a camera positioning mechanism (CPM) capable of viewing features on a client satellite or asteroid. By consolidating the drive actuation motors within the ATDS, the design of mating tools becomes less complex and reduces risk and cost of multiple drive actuators having to be installed in multiple tools.

Abstract: A substrate transfer apparatus transfers a substrate in a vacuum chamber. The substrate transfer apparatus includes an elevating robot, a travel robot and a transfer robot. The elevating robot includes an elevating plate through which through-holes are formed, and hollow elevating shafts, wherein each central axis of the hollow elevating shafts corresponds to each center of the through-holes, wherein the elevating robot is sealably coupled with a vacuum chamber through-hole. The travel robot includes a travel arm platform through which coupling holes are formed, wherein each of the hollow elevating shafts is inserted into each lower space of each of the coupling holes, a first travel arm part including a (1_1)-st and a (1_2)-nd travel link arms, second travel arm parts including a (2_1)-st and a (2_2)-nd travel link arms, and a transfer robot coupling part coupled with the (1_2)-nd and the (2_2)-nd travel link arms.

Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

Abstract: An apparatus includes a drive; a movable arm having a base pivotally connected to the drive, first and second linkages, the first linkage having a first link rotatable on the base at a first rotary joint, a second link connected to the first link at a second rotary joint, and a third link connected to the second link at a third rotary joint, the third link having an end-effector, and the second linkage having a fourth link rotatable on the base at a fourth rotary joint, a fifth link connected to the fourth link at a fifth rotary joint, and a sixth link connected to the fifth link at a sixth rotary joint, the sixth link having another end-effector. The apparatus also includes a master controller coupled to the drive, the master controller being configured to control movements of the movable arm and the base relative to the drive.

Abstract: A substrate conveying robot includes a cable guide that is arranged inside a housing, in which a robot cable extending from an arm is arranged, and that deforms to follow the robot cable moved as the arm is moved up and down.

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

Abstract: A substrate holding hand includes a supporting plate where a circular reference capture range is defined, a plurality of pads disposed within the reference capture range, at least one stationary stopper that is disposed along an outer circumferential circle of the reference capture range, at least one movable stopper having a part at the same height from the supporting plate as the stationary stopper, and a stopper actuator that moves the movable stopper from a retracted position outside the reference capture range to a deployed position closer to the stationary stopper than the retracted position. A circular reduced capture range is defined by the movable stopper at the deployed position, and the front stopper, and a diameter of the reduced capture range is larger than a diameter of the substrate and smaller than a diameter of the reference capture range.