Patents Examined by Gerald McClain
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Patent number: 12195288Abstract: Equipment for the logistics of slab-shaped articles comprises supply line(s) of slab-shaped article(s) and outlet line(s) of the slab-shaped article(s); robotic gripping assembly(s) of the slab-shaped article(s) provided with at least three degrees of freedom and positioned between the supply line(s) and the outlet line(s); first movement device/unit/component/etc. of the gripping assembly(s) along a direction(s) of movement; where the supply line(s) and said outlet line(s) are substantially aligned to each other along the direction(s) of movement.Type: GrantFiled: June 18, 2020Date of Patent: January 14, 2025Assignee: LK LAB S.R.L.Inventors: Luca Iacaruso, Michele Iacaruso
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Patent number: 12198956Abstract: An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.Type: GrantFiled: July 31, 2020Date of Patent: January 14, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Tsung-Sheng Kuo, Chih-Chun Chiu, Chih-Chieh Fu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
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Patent number: 12180672Abstract: A power machine can include a frame, a lift arm, and one or more electrical devices for control of one or more work elements. An electrical tilt actuator can be secured to the lift arm to change an attitude of an implement carrier, an electrical lift actuator can be secured to the frame to raise and lower a lift arm, an electrical drive motor can be mounted to a track frame to move a track, or a battery assembly and electrical control module can be secured to the frame, including rearward of an operator station.Type: GrantFiled: March 2, 2021Date of Patent: December 31, 2024Assignee: Doosan Bobcat North America, Inc.Inventors: Brent Durkin, John Pfaff, Dennis Agnew, Matthew Sagaser
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Patent number: 12162698Abstract: A substrate transport apparatus comprising a frame, a drive section connected to the frame, and an articulated arm having at least one articulated arm link operably connected to the drive section so that the articulated arm rotates about a pivot axis relative to the frame and extends and retracts relative to the pivot axis. The articulated arm has an end effector pivotally mounted to at least one articulated arm link forming a joint between the end effector and the articulated arm link, with an arm joint pivot axis disposed so that the end effector rotates relative to at least one articulated arm link about the arm joint pivot axis. The articulated arm has a drive band transmission with drive and driven pulleys where the driven pulley is connected to the articulated wrist.Type: GrantFiled: February 1, 2022Date of Patent: December 10, 2024Assignee: Brooks Automation US, LLCInventors: Daniel Babbs, Vincent W. Tsang, Robert C. May
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Patent number: 12165906Abstract: An apparatus for handling semiconductor part carriers includes: a mechanical arm and an imaging system coupled to the mechanical arm, wherein the mechanical arm is configured for holding a semiconductor part carrier, and the imaging system is configured for automatically locating a goal position on a surface onto which the semiconductor part carrier is to be placed.Type: GrantFiled: October 10, 2019Date of Patent: December 10, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Ren-Hau Wu, Yan-Han Chen, Cheng-Kang Hu, Feng-Kuang Wu, Hsu-Shui Liu, Jiun-Rong Pai
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Patent number: 12157987Abstract: A rotary working vehicle includes a lower traveling body, an upper rotating body, a rotating frame constituting the bottom of the upper rotating body, a boom bracket supported by the rotating frame so as to be capable pivoting horizontally, a first vertical plate and a second vertical plate, which are raised from the bottom plate of the rotating frame, a swing cylinder provided on the opposite side of the second vertical plate from the first vertical plate and connecting the rotating frame and the boom bracket, a protrusion piece protruding toward the swing cylinder from a side wall of the second vertical plate above the swing cylinder, a hose guide provided to the protrusion piece, and first and second hydraulic hoses which pass above the first vertical plate and the second vertical plate, extend downward from above through the hose guide, and reach the swing cylinder.Type: GrantFiled: December 28, 2021Date of Patent: December 3, 2024Assignee: YANMAR POWER TECHNOLOGY CO., LTD.Inventors: Mitsuyuki Hatanaka, Takahiro Ikeda
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Patent number: 12159796Abstract: Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.Type: GrantFiled: February 9, 2023Date of Patent: December 3, 2024Assignee: Applied Materials, Inc.Inventors: Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
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Patent number: 12142505Abstract: A vacuum substrate transport apparatus including a frame, a drive section having a drive axis, at least one arm, having an end effector for holding a substrate, having at least one degree of freedom axis effecting extension and retraction, and a bearing defining a guideway that defines the axis, the bearing including at least one rolling load bearing element disposed in a bearing case, interfacing between a bearing raceway and bearing rail to support arm loads, and effecting sliding of the case along the rail, and at least one rolling, substantially non-load bearing, spacer element disposed in the case, intervening between each of the load bearing elements, wherein the spacer element is a sacrificial buffer material compatible with sustained substantially unrestricted service commensurate with a predetermined service duty of the apparatus in a vacuum environment at temperatures over 260° C. for a specified predetermined service period.Type: GrantFiled: December 22, 2022Date of Patent: November 12, 2024Assignee: Brooks Automation US, LLCInventors: Daniel Babbs, Robert Chris May, Robert T. Caveney
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Patent number: 12136560Abstract: A workpiece transfer apparatus includes a loader for loading a tray with uninspected workpieces placed thereon, a first-transferer for guiding the workpieces toward a first-inspection region by transferring the loaded tray in a first direction, a second-transferer for guiding the workpieces toward a second-inspection region by transferring the tray in a second-direction perpendicular to the first-direction, a third-transferer for transferring the tray with the inspected workpieces placed thereon in a third direction perpendicular to the second-direction, and an unloader for unloading the tray.Type: GrantFiled: April 29, 2024Date of Patent: November 5, 2024Assignee: TAKAOKA TOKO CO., LTDInventors: Taichi Aranami, Shohei Suzuki
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Patent number: 12131922Abstract: A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.Type: GrantFiled: November 4, 2020Date of Patent: October 29, 2024Assignee: Apple Inc.Inventors: Andreas Bibl, John A. Higginson, Patrick J. Czarnota, Paul A. Parks, Nile A. Light
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Patent number: 12119251Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.Type: GrantFiled: January 7, 2022Date of Patent: October 15, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
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Patent number: 12119256Abstract: A method of replacing an end effector for wafer handling in a semiconductor processing system includes fixing a first end effector jig to a first stage and a second end effector jig to a second stage of the load lock module; positioning a first end effector at the first end effector jig and a second end effector at the second end effector jig, the second end effector fixed relative to the first end effector; and fixing the second end effector to the second end effector jig. The first end effector is replaced with a replacement end effector and the semiconductor processing system returned to production without re-teaching placement of the replacement end effector in a processing module connected to a wafer handling module mounting the end effectors. Semiconductor processing systems and end effector jigs for replacing end effectors in semiconductor processing systems are also described.Type: GrantFiled: September 5, 2021Date of Patent: October 15, 2024Assignee: ASM IP Holding B.V.Inventor: Dongyang Chen
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Patent number: 12119252Abstract: A ceiling traveling vehicle includes a traveler to travel along a grid-shaped track, a main body coupled to the traveler and below the track, and a detector on a rear side of a center of the main body in a traveling direction of the traveler and below the main body to apply detection light forward in the traveling direction and downward and receive reflected light of the detection light to detect an obstacle.Type: GrantFiled: September 13, 2019Date of Patent: October 15, 2024Assignee: MURATA MACHINERY, LTD.Inventors: Haruki Ogo, Yasuhisa Ito
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Patent number: 12100606Abstract: The wafer transfer device includes a first supporting mechanism, a second supporting mechanism, a first picking-conveying mechanism and a second picking-conveying mechanism, wherein the first picking-conveying mechanism and the second picking-conveying mechanism include tail end execution parts facing opposite directions. The wafer transfer device further includes a rotating mechanism and a rotating driving part, wherein the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, and the rotating driving part drives the rotating mechanism to rotate and then drives the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity.Type: GrantFiled: September 24, 2021Date of Patent: September 24, 2024Assignee: SHENYANG KINGSEMI Co., Ltd.Inventors: Tianyao Wu, Hao Wang, Xinglong Chen, Tao Miao
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Patent number: 12090641Abstract: An intelligent garbage sorting robot includes a robot body and a walking base. The robot body is installed on the walking base, and a tool end of the robot body is installed with an executing mechanism. The executing mechanism includes a housing. An electromagnet is slidably disposed in the housing, the electromagnet is connected to a first driving assembly, the first driving assembly is configured to drive the electromagnet to slide, and an end of the housing is fixedly connected to multiple steel needles. Two mechanical claws symmetrically disposed on the walking base, and the two mechanical claws are spaced apart on the walking base. The two mechanical claws are respectively connected to second driving assemblies, and the second driving assemblies are configured to drive the two mechanical claws to move relatively.Type: GrantFiled: February 8, 2024Date of Patent: September 17, 2024Assignee: Guangdong Ocean UniversityInventors: Limei Shi, Peng Luo, Lei Guo, Wenjing Liu, Yanzhao Zhu, Jian Liu
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Patent number: 12080586Abstract: A substrate transfer robot for transferring a substrate in a vacuum chamber, includes: a transfer arm platform having coupling holes, each compartmentalized into a lower and an upper space, wherein a link connecting member with blades is engaged at a front area of the transfer arm platform and a support shaft of a lower support is inserted into the lower space of one of the coupling holes; and a first and a second transfer arm part each including an end effector for supporting the substrate, multiple transfer link arms and subordinate link arms, and a common link arm that are connected to each other or to the transfer arm platform, wherein, for each transfer arm part, drive shafts, interlocked with transfer driving motors or speed reducers installed on one of the transfer link arms, and output shafts interlocked with the drive shafts are installed on the transfer link arms.Type: GrantFiled: April 18, 2022Date of Patent: September 3, 2024Assignee: T-Robotics Co., Ltd.Inventors: Soo Jong Lee, Myung Jin Kim, Chang Seong Lee, Seung Young Baek, Chang Hyun Jee, Sang Hwi Ham, Moon Gi Hur, Jae Hyun Park, Tae Han Lee
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Patent number: 12070854Abstract: A repositionable riser is provided. The repositionable riser may be used in connection with a robotic arm deployed in a workspace. The repositionable riser includes a riser having one or more mounting locations at or near an upper end of the riser configured to fixedly mount an equipment on the riser, a lateral translation subsystem comprising a carriage on which the riser is mounted and a set of one or more elongated structures that define a constrained lateral path along which the carriage is movable, the path including a first end associated with active use of the equipment and a second end not associated with active use of the equipment, and an anchor structure to which one or both of the carriage and the riser are configured to be coupled to secure the riser at the first end.Type: GrantFiled: April 8, 2022Date of Patent: August 27, 2024Assignee: Dexterity, Inc.Inventors: Jordan Cedarleaf-Pavy, Austen Poteet, Timothy Ryan, Adam Kell, Robert Holmberg, Salvador Perez, Devon Weinberger
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Patent number: 12062562Abstract: Air curtain devices can reduce defects on semiconductor wafers when implemented on a track equipped with robotic wafer transport. The air curtain devices can be added to one or more processing devices arranged along the track to prevent defects from landing on wafer surfaces. For example, the air curtain devices can prevent volatile organic solvent mist from drifting towards processing devices on the track and preventing contamination via a wafer transport system.Type: GrantFiled: November 1, 2021Date of Patent: August 13, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wei-Chih Liao, Shih-Yu Tseng
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Patent number: 12046501Abstract: A substrate handling apparatus according to one or more embodiments may include: a base, an elevating unit that is connected to the base to freely elevate and lower, an arm that is rotatably connected to the elevating unit, a disk that is provided on the arm, and a hand that is rotatably connected to the arm, wherein in case that the hand is provided on a position to overlap the arm, the disk is provided under the substrate extracted by the hand.Type: GrantFiled: October 6, 2022Date of Patent: July 23, 2024Assignees: KAWASAKI JUKOGYO KABUSHIKI KAISHAInventors: Haruhiko Tan, Simon Jeyapalan, Avish Ashok Bharwani, Mu-Kai Lin
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Patent number: 12033878Abstract: A substrate transfer apparatus includes a planar motor provided in a transfer chamber and having coils arranged therein, a transfer unit movable on the planar motor, and a control unit configured to control an energization of the coils. The transfer unit includes two bases having magnets arranged thereon and configured to be movable on the planar motor, a substrate support member configured to support a substrate, and a link mechanism configured to connect the two bases and the substrate support member to each other.Type: GrantFiled: August 7, 2023Date of Patent: July 9, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Tatsuo Hatano, Tetsuya Miyashita, Naoki Watanabe, Naoyuki Suzuki