Abstract: A transport system for transporting a plurality of objects between a storage container configured to store the plurality of objects and a processing apparatus configured to collectively process the plurality of objects held on a tray, including a mounting part on which the storage container is mounted, a stage on which the plurality of objects are mounted, a tray support part configured to support the tray, a first transport device configured to transport the plurality of objects between the storage container mounted on the mounting part and the stage, and a second transport device configured to transport the plurality of objects between the stage and the tray supported by the tray support part.

Abstract: A substrate transfer mechanism for transferring a substrate to each of a plurality of stacked processing modules that process the substrate includes an arm base provided with a first driver, a lift configured to move up and down the arm base, a first arm extending transversely from a lower side of the arm base, and having a tip end that pivots around a vertical axis with respect to the arm base by the first driver, a second arm extending transversely from an upper side of the tip end of the first arm, and having a tip end that pivots around a vertical axis with respect to the first arm along with the pivoting of the first arm, and a substrate holder provided on an upper side of the tip end of the second arm, and configured to rotate around a vertical axis with respect to the second arm.

Abstract: A substrate transfer system includes a load lock module, an atmospheric transfer module having a first sidewall adjacent to the load lock module and a second sidewall remote from the load lock module, the atmospheric transfer module being connected to the load lock module, and a substrate transfer robot disposed in the atmospheric transfer module. The substrate transfer robot includes a base configured to reciprocate along the first sidewall, a substrate transfer arm disposed on the base, and a flow rectifier surrounding the base, the flow rectifier being configured, upon movement of the base, to create an obliquely downward air flow in a direction opposite to a moving direction of the base.

Abstract: A transport device in a transport chamber having a reduced pressure atmosphere and including a sidewall extending along an arrangement direction. The transport device includes a first robot fixed at a first robot position in the transport chamber and configured to transfer a substrate to and from a first chamber provided outside the transport chamber, and a second robot fixed at a second robot position in the transport chamber and configured to transfer the substrate to and from a second chamber provided outside the transport chamber on the sidewall. Additionally, the transport device includes a mobile buffer configured to hold the substrate and move along a movement locus extending along the arrangement direction and located between the sidewall and each of the first robot position and the second robot position. The movement locus includes a first position for transferring the substrate to and from the first robot and a second position for transferring the substrate to and from the second robot.

Abstract: A method including gripping a first surface of a grip target object mounted on a mounting surface by the first grip portion; gripping a second surface crossing the first surface of the grip target object by the second grip portion; lifting the arm together with the first and second grip portions, to lift the grip target object; turning the first and second grip portions, to tilt the grip target object with respect to the mounting surface and bring the grip target object into contact with the mounting surface; maintaining the grip target object in a state of being tilted with respect to the mounting surface; and moving the arm together with the first and second grip portions, to drag the grip target object on the mounting surface.

Abstract: A rotational indexer rotatable to move semiconductor wafers or other items between various stations arranged in a circular array. The items being moved may be supported by arms of the indexer during such movement. The rotational indexer may be further configured to also cause the items being moved to rotate about other rotational axes to cause rotation of the items relative to the arms supporting them.

Abstract: An apparatus having a drive unit having a first drive axis rotatable about a first axis of rotation and a second drive axis rotatable about a second axis of rotation, the second drive axis being coaxial with and partially within the first drive axis and axially rotatable within the first drive axis. A robot arm has an upper arm connected to the drive unit at the first drive axis, a forearm coupled to the upper arm, the forearm being coupled to the upper arm at a first rotary joint and rotatable about the first rotary joint, the first rotary joint being actuatable by a first band arrangement coupled to the second drive axis, and an end effector coupled to the forearm, the end effector being coupled to the forearm at a second rotary joint and rotatable about the second rotary joint, the second rotary joint being actuatable by a second band arrangement coupled to the first rotary joint. The second band arrangement is configured to provide a variable transmission ratio.

Abstract: A skid-steer implement allows for the rotation of a tool attachment relative to the body of the skid-steer by coupling an attaching element and a rotation attachment device with a shaft and force generating devices. The slim construction of the device allows for bucket rotation while limiting the tipping load change caused by the extension of the implement.

Abstract: A retainer apparatus configured to releasably retain an article, comprising a face plate member each having a front face, a plurality of vacuum cups and a plurality of support pins each extending distally relative to the front face, respectively, wherein the vacuum cups and the support pins are laterally spaced from one another, wherein the plurality of vacuum cups retain the article to the retainer apparatus in a presence of vacuum, wherein the plurality of support pins are extendable/retractable relative to the face plate member, wherein each of the support pins have a longitudinal axis, respectively, and are configured to contact the article to support the article against movement along the longitudinal axis and support the article against movement transverse to the longitudinal axis, and a locking mechanism configured to inhibit the support pins from being retractable and extendable when the locking mechanism is engaged.

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

Abstract: A multiple transport carrier docking device may be capable of storing and/or staging a plurality of transport carriers in a chamber of the multiple transport carrier docking device, and may be capable of forming an air-tight seal around a transport carrier in the chamber. Semiconductor wafers in the transport carrier may be accessed by a wafer transport tool while the air-tight seal around the transport carrier prevents and/or reduces the likelihood that contaminants in the semiconductor fabrication facility will reach the semiconductor wafers. The air-tight seal around the transport carrier may reduce defects of the semiconductor wafers that might otherwise be caused by the contaminants, may increase manufacturing yield and quality in the semiconductor fabrication facility, and/or may permit the continued reduction in device and/or feature sizes of integrated circuits and/or semiconductor devices that are to be formed on semiconductor wafers.

Abstract: A load port apparatus connects a main opening of a wafer transportation container to a frame opening. The apparatus includes an installation unit, a frame unit, a flange clamp unit, and a detection unit. The installation unit includes an installation table configured to install the container and relatively move to the frame opening. The frame unit is upright upward from the installation unit and includes the frame opening. The flange clamp unit includes an engagement section and a drive section. The engagement section is engageable with a flange surrounding an outer circumference of the main opening. The drive section drives the engagement section to carry out an engagement operation and a separation operation. The detection unit detects the engagement operation by the flange clamp unit with classification into a normal engagement operation and an abnormal engagement operation.

Abstract: An apparatus including at least one drive; a first robot arm having a first upper arm, a first forearm and a first end effector. The first upper arm is connected to the at least one drive at a first axis of rotation. A second robot arm has a second upper arm, a second forearm and a second end effector. The second upper arm is connected to the at least one drive at a second axis of rotation which is spaced from the first axis of rotation. The first and second robot arms are configured to locate the end effectors in first retracted positions for stacking substrates located on the end effectors at least partially one above the another. The first and second robot arms are configured to extend the end effectors from the first retracted positions in a first direction along parallel first paths located at least partially directly one above the other.

Abstract: A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.

Abstract: A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

Abstract: A compressible lip for a suction cup has in its engagement area one or more sectional areas, each of which comprises a flow passage capable of forming a flow restriction together with a surface of an object to be engaged by the lip. The flow restriction formed restricts airflow from the sectional area, thus allowing a suction cup provided with such lip to maintain an overall high vacuum level despite of pressure loss in one, or some, of its sectional areas. A suction cup having such compressible lip is also disclosed.

Abstract: A system configured to couple an implement to a work vehicle includes a first lock assembly coupled to an arm of the work vehicle, and the first lock assembly includes a first lock, a second lock, and a first actuator configured to drive the first lock and the second lock laterally outwardly to engage respective first openings formed in the implement. The system also includes a second lock assembly coupled to a frame of the work vehicle, and the second lock assembly includes a third lock, a fourth lock, and a second actuator configured to drive the third lock and the fourth lock laterally outwardly to engage respective second openings formed in the implement.

Abstract: A wafer stocker is capable of further improving an environment around wafers. The wafer stocker includes a housing, a loading device provided on a front surface of the housing, a wafer cassette shelf arranged in the housing, a wafer transfer robot configured to move the wafers from a transfer container mounted on the loading device to a wafer cassette in the wafer cassette shelf, a wafer cassette delivery device configured to move the wafer cassette in the wafer cassette shelf to a stage having a different height, and a fan filter unit configured to generate a laminar flow in a wafer transfer space and in a wafer cassette transfer space.

Abstract: A system includes an equipment front end module chamber, alignment pedestals housed within the equipment front end module chamber, and a load/unload robot at least partially housed within the equipment front end module chamber. The alignment pedestals include a first alignment pedestal having a first support surface and a second alignment pedestal having a second support surface, and the first support surface has a vertical offset and an overlap region having at least a partial overlap relative to the second support surface. The load/unload robot includes an arm, and vertically arranged blades attached to the arm. The vertically arranged blades include an upper blade configured to transfer a first substrate to the first alignment pedestal and a lower blade configured to transfer a second substrate to the second alignment pedestal.

Abstract: An example robot includes inks comprising a first link and a second link, together with joints among the links. A joint between the first link and the second link is configured to enable relative movement between the first link and the second link. An end effector is connected in series with one of the joints. A hose assembly is connected to the end effector. The hose assembly includes a hose having a first end for making connection to a vacuum source and a second end for making connection to the end effector. An elasticity of the hose assembly is greater along the length of the hose assembly than along the cross-section of the hose assembly.