Abstract: A CPU and heat sink mounting arrangement, which includes a locating plate having downward hooks inserted through respective through holes at a CPU connector and a heat sink, and two retainer strips attached to respective transverse grooves at the heat sink and having retaining holes fastened to the downward hooks of the locating plate to secure the CPU connector and the heat sink together, wherein the retainer plates each have a finger strip for operation by hand to disengage the respective retaining holes from the downward hooks, and the locating plate has two transverse spring leaves at two opposite ends, which push the locating plate away from the CPU connector after disengagement of the retainer plates from the downward hooks of the locating plate.

Abstract: A flexible power assembly (FPA) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is mounted directly on a heatsink, which supports a circuit board that is mounted above and spaced from the top side of the IMS. There are provided devices that are mounted on the circuit board which are electrically connected to the power semiconductor devices. There may be a cavity in the circuit board allowing the top of the IMS to be exposed, and optionally providing access for bonding wires to the top of the circuit. Bonding pads may be provided on the circuit board for electrical connection with the bonding wires. A cover may be optionally provided to enclose a space over the cavity. Potting compound may be contained in the space created by the cavity.

Abstract: The invention relates to a control device for a vehicular occupant restraint system comprising a housing with a metallic baseplate and an electronic module including an acceleration sensor and being mounted on a circuit board. The electronic module is insertable into the housing that is formed as a composite of an injection-molded plastic body and the metallic baseplate part of which is embedded in an injection molded wall of plastic.

Abstract: A mounting assembly for a plurality of panel board electrical buses which are disposed within a panel board housing, said mounting assembly which includes a mounting plate and a bus insulator assembly. The mounting plate has a front side, a back side and a plurality of bus insulator assembly pin openings therethrough. The mounting plate is sized to fit within said panel board housing. The mounting assembly further includes bus insulator assembly pin openings located within conical depressions on said mounting plate. The bus insulator assembly has mounting pins. When assembled, the bus insulator assembly mounting pins pass through the bus insulator assembly pin openings.

Abstract: A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

Abstract: A power diode and heat sink arrangement includes two power diodes fastened to a heat sink, a copper plate soldered to the power diodes at the top to hold a terminal holder, and a ceramic pad connected between the heat sink and the copper plate and spaced between the chips and adapted to support the copper plate against deformation and to transmit heat from the copper plate to the heat sink for quick dissipation.

Abstract: A vault system for batteries that supply a battery power signal to an electronic device. The vault system comprises an enclosure assembly, a control enclosure, at least one terminal set, and one or more lead pairs. The enclosure assembly contains the batteries. The control enclosure assembly is arranged within the enclosure assembly. The at least one terminal set is arranged within the control enclosure. At least one lead pair is associated with each battery and each lead pair is connected at one end across terminals of the battery associated therewith and at another end to the terminal set. Power cables extend from the control enclosure to the electronic device. The terminal set interconnects the lead pairs and the power cables such that the battery power signal is generated by the batteries connected to the at least one lead pair and present across the power cables.

Abstract: A method for transferring thermal energy from an electronic card in a card shelf includes providing a divider configured for high absorption of thermal energy adjacent to an electronic card in the card shelf. Thermal energy generated by the electronic card is absorbed in the divider and transferred away from the electronic card via the divider. The divider may include a roughened surface texture, surface coating, or other dull surface exhibiting high thermal energy absorption properties. The divider may convectively transfer the thermal energy away from the electronic card. The divider may also be thermally coupled to a heatsink to conductively transfer the thermal energy away from the electronic card.

Abstract: A glare reducing hood for a laptop computer monitor made of a fabric closure structure attached to and supported by an endless frame member. The closure structure has a mounting end that defines a mounting end opening and a viewing end that defines a viewing end opening. The hood is mounted on the laptop computer by placing the mounting end about edges of the monitor and the computer user views the monitor through the viewing end opening. The frame member is resiliently collapsible allowing the frame member to be folded into a flat shape for storage and allowing it to spring into a useable shape forming the glare reducing hood that conforms with a particular laptop computer monitor.

Abstract: A computer having a control panel for directly controlling software and hardware of the computer, eliminating the necessity of navigating software to control such functions. These direct controls can include audio CD controls, telephone answering machine controls, instructional software controls, power setting controls, and volume controls.

Abstract: A heat dissipation system and method for extracting heat from an integrated circuit die includes attaching an integrated circuit die to a heat extraction substrate capable of extracting heat from the integrated circuit die. Further, a heat transport medium is attached to the heat extraction substrate, to transport the extracted heat from the heat extraction substrate to ambient. In some embodiments, the heat dissipation device can further include a heat sink, attached to the heat transport medium, to further facilitate the transporting of the heat from the heat transport medium to ambient.

Abstract: An integrated circuit heat dissipator is comprised of a unitary piece of metallic material for dissipating thermal energy generated by semiconductor devices encapsulated in a DIP integrated circuit package. The heat dissipator is adapted to accept heat conducting pins of the integrated circuit. Soldering secures the heat dissipator and the integrated circuit heat conducting pins to each other and to the printed circuit board. A bulk mass of heat conducting solder is retained at the connection of the heat dissipator and the heat conducting pins for enhancing the heat sinking of the pins by the heat dissipator.

Abstract: A heat dissipating apparatus for use on a heat generating electric component inside a computer comprises an interposer mounted on the heat generating electric component and a heat absorbing member including a heat absorber, a bracing member, and a spring biasing said heat absorber toward the bracing member. The heat absorbing member is moveable between a first position in which the interposer is compressed between the heat absorber and the bracing member and a second position in which the interposer is not compressed between the heat absorber and the bracing member.

Abstract: The assembly has a metal sole plate forming a heat sink carrying a printed circuit card. The sole plate includes bearing surfaces which project slightly beyond the rest of the sole plate. The printed circuit is supported on these bearing surfaces and they include fixing means which interact with supplementary means of the printed circuit card to fix the printed circuit card onto the sole plate. A thermally conducting and electrically insulating material is interposed between the said card and the sole plate. The printed circuit card and the sole plate exert compression stress on the thermally conducting and electrically insulating material.

Abstract: A screwless wind conduit positioning device serves to position a wind conduit to a rear plate of a computer mainframe. The wind conduit is a curved tube having a heat dissipating fan at its lateral side. A front surface the wind conduit are formed with a plurality of tenons and hooks which are arranged at opposite sides. The rear plate of the computer mainframe has a thin plate on the surface thereof. The thin plate has a section with a plurality of wind vents arranged like the net. The periphery of the wind vents are installed with a plurality of engaging holes for being engaged with the tenons of the wind conduit. The hooks on the front surface of the wind conduit slide in a bank of wind vents on the section of the thin plate for being retained therein. Therefore, the wind conduit can be fixed to the rear plate of a computer mainframe without using any tool. Then a lateral plate with a folding plate is hooked to the rear plate, and then screws serve to fix the lateral plate to the rear plate.

Abstract: A heat sink clip (10) includes a body (12), and first and second arms (13, 19) depending from opposite ends of the body. The body includes a curved portion (11), first and second spring portions (15, 17) extending from opposite ends of the curved portion, and a connecting portion (16) between the second spring portion and the second arm. Each arm defines aperture (14). A fin (24) with a hole (25) defined therein is stamped outwardly from the second arm above the aperture, for engaging with a tool. Two flanges (27) extend upwardly from respective opposite longitudinal edges of the curved portion, thereby reinforcing the curved portion. Two longitudinal ribs (29) are formed at respective opposite sides of the curved portion, thereby reinforcing the body.

Abstract: A heat sink assembly for use with an electronic IC chip (4) includes a socket (30), a heat sink (2), a pair of mounting clips (32) and a pair of retention modules (31). The heat sink abuts against the chip and has a plurality of cooling fins (21) extending upwardly from a base (20) and a pair of securing flanges (22) extending outwardly from the base. Each retention module defines a protrusion (313) on a first sidewall (311) and a latch (314) on a second sidewall (312). Each mounting clip forms a base member (320) defining two apertures (327) for receiving the protrusions. An arm (321) with a notch (325) defined on a free end thereof is formed at either lateral end of the base member for engaging with the latches. A retaining clip (322) extends downwardly and inwardly from the mounting clip for pressing against the securing flange.

Abstract: A CPU cooling arrangement includes a heat sink adapted to receive heat from the CPU of a computer, and a plurality of fans arranged in a stack on the heat sink and adapted to draw outside cold air toward the heat sink for quick dissipation of heat from the heat, the fans being connected in series and spaced from one another by spacer means thereof.

Abstract: An inwardly directed wall projection that comprises a supporting edge proceeding parallel to the insertion direction and an aperture for a screw to be applied from the outside is provided at one of the two side walls of a cage-like chassis for the acceptance of at least one horizontally introducible drive carrier securable with a screwed connection. Spring elements are provided at the opposite side wall, so that the drive carrier pulled against the wall projection with the screw is secured parallel to the insertion direction free of play and protected against twisting.

Abstract: A heat sink clip (10) includes a body (12) and a fastener (14). The body includes a spring portion (20) positioned above a heat sink, and two legs (28) extending from opposite ends of the spring portion. Each leg defines an aperture (30) for engaging a catch of a retention module mounted beside an electronic device. The spring portion has a horizontal section (26) which forms a spring tongue (21). A pair of L-shaped guiding tabs (22) is formed under and spaced from the horizontal section, with a space defined between the horizontal section and the guiding tabs. A gap (24) is formed between the guiding tabs. The fastener includes an operation portion (40), and a connecting portion (42) for insertion in the space between the horizontal section and the guiding tabs. The connecting portion defines a slot (43) for engagement with the spring tongue of the body. A spring tab (46) is formed under the connecting portion.