Abstract: A securing equipment for a heat dissipater of a CPU includes a holed main body, and a movable element. The heat dissipater is positioned in a holding member for the bottom to abut the top of the CPU. The main body has rear hooks separably connected to rear holes of the holding member. The movable element includes a control part, and a front part having up-sticking portions pivoted to the upper portion of the control part. The lower portion of the control part is pivoted to the front of the main body so as to be pivotable between a vertical position where the up-sticking portions stand upright in a locking position and a horizontal position where the up-sticking portions is in a sloping unlocking position. The front part of the movable element is further formed with hooks, which engage front holes of the holding member when the up-sticking portions stand upright in the locking position, so as to cause the main body to be pressed against the tops of the radiating fins of the heat dissipater.

Abstract: The present invention relates to an electronic equipment housing usable for various types of electronic equipment such as note-type personal computers, portable information instruments, portable acoustic instruments, and on-vehicle electric materials. The electronic equipment housing of the present invention is formed by bonding two or more plate-like members. These plate-like members are different in thickness from one another. These plate-like members are bonded together through an adhesive. The electronic equipment housing of the present invention can efficiently radiate heat from heating parts, can prevent air bubbles from occurring in an adhesive between plate-like members, can reduce time required to produce the electronic equipment housing and can properly control the heat conduction.

Abstract: The described current distributor has a bus bar, a plug socket connected to the bus bar, at least one contact element which comprises an access connection, a consumer tapping and an element connecting the access connection and the consumer tapping, at least one plug connection for the plug contacts of a protective switch, which has a plug socket of the bus bar and an access socket of a contact element, and two signaling lines. In order to produce such a current distributor inexpensively and to ensure reliability of operation, it is provided in accordance with the invention that the contact element comprises a one-piece member.

Abstract: A multi-chip integrated circuit module includes a supporting layer of laminate material over which a high-density interconnect structure is formed. The laminate layer includes a first upper laminate layer (10) having a hole (14) disposed therein for receiving an integrated circuit chip die (56). A lower core laminate layer (16) having a conductive layer (18) and conductive layer (20) disposed on opposite sides thereof is laminated to the lower surface of the layer (10). Plated-through holes (36), (38) and (40) are formed through the two layers (10) and (16) to connect the conductive layer (20) with a conductive layer (12) on the upper surface of the layer (10). A high-density interconnect layer includes two laminate layers (126) and (138), each having vias formed therethrough and via interconnect structures disposed on the surfaces thereof. The via interconnect structures in the layer (126) allow for connections from the die (56) to the conductive layer (12).

Abstract: A semiconductor unit is provided, which includes a substrate, a plurality of semiconductor components loaded on the substrate, and a cooling device provided above the semiconductor components. A flat-bottomed dent, slightly smaller than the semiconductor component, is provided on a compound injection unit of the cooling device, and an injection hole for injecting a compound is formed in communication with the dent. The compound is injected through the injection hole into the dent and into a clearance provided between the compound injection unit and the semiconductor component, thus forming a compound layer in between the compound injection unit and the semiconductor component.

Abstract: A heat sink includes a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink at one side, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together.

Abstract: An electronic assembly that may include an elastomeric connector. The elastomeric connector may couple the solder ball of a BGA integrated circuit package to a substrate. The elastomeric connector provides an interconnect that may compensate for variations in the solder balls and a lack of flatness in the package and/or substrate.

Abstract: A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.

Abstract: A heat sink assembly includes a heat sink (30), a clip (20), and a fastener (10). The heat sink has a base (301) and a plurality of parallel fins (302) extending therefrom. A pair of barbs (303) is symmetrically formed on outmost sides of two adjacent central fins. The fastener includes a basal body (101), a pair of side arms (103) extending upwardly from the body, a pair of pressing plates (104) extending horizontally outwardly from top ends of the side arms, a pair of locking arms (105) depending from the pressing plates, and a pair of catches (106) inwardly formed at distal ends of the locking arms for engaging with the barbs of the heat sink. A notch (102) is defined in a bottom of the body, for facilitating the fastener abutting against a pressing section (201) of the clip.

Abstract: The invention relates to a method and a device for creating a thermally conductive path between a component of a printed circuit board and a heat sink using a electrical insulator material and a thermally conductive material. The electrical insulator material is adhesive, to assist in adhering surfaces against which it is applied. Typically, the circuit board is affixed to the heat sink, creating a gap between the component and the heat sink. The electrical insulator material is applied in the gap. Then, the thermally conductive material is applied within the electrical insulator material, causing the thermally conductive material to spread beyond the perimeter of the electrical insulator material. The electrical insulator material thus confines the thermally conductive material within the gap in thermally conductive contact between the electronic component and the heat sink.

Abstract: The power generator unit includes a container having a peripheral wall enclosing a power generating motor assembly. A breaker box is provided in an opening in the peripheral wall of the container, so as to have power outlet socket connectors accessible from outside of the container. An external electric circuit to be fed with electricity can be operatively connected to the power outlet socket connectors. Power inlet socket connectors are also provided in the breaker box, accessible from inside the container, to which the power generating motor assembly can be operatively and releasably connected. A breaker links the power inlet socket connectors to the power outlet socket connectors, to open the breaker box circuit should any excessive power demand occur. The breaker box is releasably bolted to the peripheral wall of the container, about the opening in which it is inserted. A pair of spaced-apart pockets are provided on the breaker box casing, being outwardly opened.

Abstract: A device for securing a computer data storage device in a computer enclosure includes a support frame having a top wall for supporting the data storage device and two side walls for supporting the support frame in the enclosure. Aligned openings are defined in the side walls for movably receiving a control bar therein with the control bar being movable between a released position and a locked position. Elongate slots are defined in the top wall extending in a direction normal to the moving direction of the control bar for receiving projections mounted to the data storage device. The control bar has a bottom section and at least a front section. Notches are defined in the front section through which the projections pass when the control bar is at the released position. Stop walls are formed on the bottom section offset from the notches a predetermined distance for engaging with the projections of the data storage device when the control bar is moved to the locked position.

Abstract: A heat sink structure includes a heat emitting component, an inner heat sink in thermal contact with the heat emitting component, a cabinet of a computer system in thermal contact with the inner heat sink, and an outer heat sink in thermal contact with the cabinet. The cabinet defines an outer region outside of the computer system and an inner region inside of the computer system. Generally, the outer region is cooler than the inner region. Advantageously, since the outer heat sink is located in the outer region, the outer heat sink is relatively cool compared to the heat emitting component. This drives heat from the heat emitting component through the inner heat sink and the cabinet to the outer heat sink, which dissipates this heat to the outer region outside of the computer system.

Abstract: A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a same plane. Between adjacent circuit boards there is a galley for passing through metal bonding wires to connect chip with circuit board and molding package body easily. The plurality of circuit boards together hold the chip so as to reduce thermal stress caused by CTE mismatch.

Abstract: A bus bar system having several bus bars spaced apart from each other in a first connecting plane and of an essentially square cross section and having T-shaped connecting grooves cut into all outsides for a connection with electrical installation devices having flat connectors in a second connecting plane, which is arranged perpendicular to the first connecting plane. With specially embodied connecting and insulating elements, it is possible to displace the connecting planes of the bus bars and of the flat connectors of the installations device parallel and perpendicular with respect to each other without it being necessary to perform elaborate matching assembly work at the site.

Abstract: A computer dock for use in a vehicle has a retainer body suitable for mounting in the vehicle. A moveable member is moveable with respect to the body from a retracted position within the body to an extended position, and a mounting on the moveable members retains a notebook computer. The dock has a plurality of cables for connecting power from the vehicle and for connecting a cell phone and other facilities in the vehicle to the computer.

Abstract: A circuit breaker switch essentially comprising a push button switch, an alloy metal having one end connected to a contact of a circuit of the switch and the other end being mounted to the circuit of the switch. If the current to the switch does not exceed a predetermined current value, the switch functions as a normal switch. That is, the original position of the switch is in the “OFF” position and a depression to the push button changes its position to the “ON” state. A further depression of the push button restores the push button to the “OFF” state. When the current passed to the switch exceeds the predetermined current valve, the alloy metal is thermally deformed and curved upward, which forms a gap to allow an insulating plate to be inserted to cut off the current supply and open the circuit. The switch restores to its function by resetting the push button.

Abstract: The present invention of a heat sink modular structure inside an electronic product comprises of a heat sink fan mounted on one end of an air channel pipe body blowing the heat thereon outward from an outlet of an air channel disposed inside the said air channel pipe body, and blowing another draft of cold air from an outlet of another air channel disposed inside the said air channel pipe body to the said CPU and the electronic parts adjacent to its surrounding to enable the heat generated by the other electronic parts inside the said electronic product to have sufficient air convection.

Abstract: A power element mounting structure for use in a brushless motor comprises a circuit board; a spring plate of metal, the spring plate being resiliently mounted, through a first mounting structure, on the circuit board keeping a given space therebetween; a plurality of power elements disposed on the spring plate to form a semi-assembled unit; a heat dissipation member of metal having a plurality of heat dissipation fins on an outer surface thereof, the heat dissipation member being mounted, through a second mounting structure, on the semi-assembled unit in such a manner that an inner surface thereof faces toward the power elements; and a plurality of spring pieces defined by the spring plate, the spring pieces being arranged to press the power elements against the inner surface of the heat dissipation member.

Abstract: The disclosed HV supply device has a first housing part (1) that serves as an outside cover. In addition, a second housing part (6) forming two sides is provided. On the first side is the high-voltage supply part (8), and on the second side is the low-voltage supply part (9) which is physically or spatially separated from the high-voltage supply part (8). The first side of the second housing part (6) has a first mounting rack (14) to receive electrical or electronic low-voltage (16) and high-voltage components (17), and the second side has a second mounting rack (13) to receive electrical or electronic low-voltage components (15), whereby the two mounting racks (13, 14) are connected by an electrical connecting line (11, 12) penetrating the second housing part (6). The second (6) and the first housing part (1) are designed so that the high-voltage supply part (8) is enclosed on all sides in an area within one of the two housing parts after the two housing parts (1, 6) are joined.