Abstract: Cooling apparatus for computers and other electronic devices includes a heat transfer device having a passageway through which a liquid coolant circulates. The coolant circulates from the heat transfer device to a heat dissipation device and back. The heat dissipation device has a reservoir with fins positioned thereon. A fan directs ambient air through the fins to dissipate heat from the liquid coolant. The fan and fins are separated from the interior space of the computer by walls to isolate the heat-producing components from flow of ambient air.

Abstract: A securement assembly for providing securement of a member to a surface within an electrical distribution center. The assembly includes a first mounting member and a retaining member. The first mounting member is secured within an opening in the surface and the member is retained within the first mounting member by the retaining member which is positioned over the member and the first mounting member.

Abstract: The present invention for solving the problem of suppressing the load caused by heat stress applied on an insulation substrate, reducing the manufacturing coat of a power module substrate, and improving productivity provides a power module substrate in which a buffer layer having a surface area one to three times as large as the surface area of the insulation substrate is laminated and bonded between the insulation substrate and the heat sink, wherein the buffer layer is formed using a material having a thermal expansion coefficient between the thermal expansion coefficients of the insulation substrate and the heat sink, the insulation substrate being preferably formed using AlN, Si3N4 or Al2O3, the buffer layer being preferably formed using AlSiC, and a carbon plate or a composite material of AlC, besides the thickness of the buffer layer being preferably 1.

Abstract: The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat sink further includes an electronic device support leg that extends generally transverse from the first side and that is configured to support a heat generating electrical component thereon. Alternative embodiments of the present invention may include a plurality of such electronic device support legs. A plurality of cooling fins are also included in the present invention, extending from the second side. Moreover, each of the plurality of cooling fins has a depth that is substantially less than the width of the heat sink, which give this unique heat sink an exceptional cooling efficiency. In particular advantageous embodiments, the depth to width ratio of the fins and spine, may range from about 1 to 5 or 1 to 10, respectively.

Abstract: A device for securely engaging a display panel with a base in a closed position is provided for use with a portable computer that may be constructed of both a base and a display panel that is pivotally mounted on the base. The base and the display panel combine to form the chassis of the portable computer. The device for engaging the display panel and the base in a closed position prevents the display panel from being damaged when the portable computer is being moved, stored, or shipped. The device consists of a recess for mounting a latching assembly and a latching assembly. The latching assembly supports a latch that secures the display panel to the base when the cover is in a folded down, or closed or recessed, position. The latch assembly comprises a recess that is formed in the display panel that receives the latch assembly. There is also a seat formed on the base that corresponds to the opening on the cover.

Abstract: A heat sink clip (50) includes a body (20) and an R-shaped handle (40). The body includes a central pressing portion (29), and first and second spring portions (21, 24) extending from opposite ends of the pressing portion. First and second legs (22, 27) depend from free ends of the first and second spring portions respectively. A catch (25) is stamped upwardly from the second spring portion, and then bent toward the pressing portion. A bent tab (31) is stamped outwardly from the second leg and then bent downwardly. The handle includes first and second connecting portions (41, 42), and anactuating portion (43) between the first and second portions. First and second fixing holes (44, 45) are respectively defined near the free ends of the first and second portions, and respectively engage with the catch and bent tab of the body.

Abstract: An apparatus for mounting a component in a computer includes a computer chassis and a mounting bracket assembly attached to the computer chassis. The mounting bracket assembly includes a first structural layer, a second structural layer spaced apart from the first structural layer wherein a gap is defined therebetween, and a layer of damping material disposed in at least a portion of the gap. The mounting bracket assembly is useful in space-sensitive applications while still providing vibration and acoustical noise attenuation. Furthermore, the mounting bracket assembly provides a nominal degree of impact damping during installation of a system component, reducing the potential for impact related failures.

Abstract: A CPU heat sink includes a copper bottom panel, a plurality of copper radiating fins arranged in parallel on the bottom panel, the radiating fins each having a transverse foot bar, a plurality of strips respectively upwardly extended from the transverse foot bar and arranged in parallel, and a plurality of horizontal locating flanges respectively extended from the transverse foot bar at right angles, and an aluminum base molded on the bottom panel and the transverse foot bar and locating flanges of each radiating fin by die casting, the aluminum base having four upright posts disposed in four corners, the upright posts each having a square top and a screw hole on the square top, and four bearing blocks respectively fastened to the upright posts of the aluminum base and adapted to support a fan above the radiating fins, the bearing blocks each having a countersunk hole fastened to the screw hole of one upright post of the aluminum base by a screw, and at least one screw hole for the mounting of a fan.

Abstract: An enclosure (10) for protecting and dissipating heat from electronic equipment such as telecommunications repeater cards (12). The enclosure includes: exterior walls defining a substantially enclosed chamber (14); at least one shelf (16) positioned within the chamber for holding a plurality of repeater cards, the shelf including spaced apart top and bottom walls (60, 62) configured for receiving the cards therebetween and for making direct contact with the cards to allow conduction of heat to the top and bottom walls from the cards; a plurality of elongated heat pipes (84) each having a first, proximal end (84a) coupled with the top or bottom wall for conducting heat to the heat pipe from the top or bottom wall, the heat pipes also each having a second, distal end (84b); and at least one fin (86) coupled with the second, distal end of each of the heat pipes for conducting heat to the fin from the heat pipes so that the heat may be convected from the fin to ambient air in the chamber.

Abstract: A semi-mobile desktop personal computer incorporating the features of a desktop personal computer with the mobility of a mobile personal computer. The computer includes a system enclosure attached to a storage enclosure, the storage enclosure extends outside the system enclosure and provides stability for the system enclosure by engaging the surface on which the system enclosure has been placed for use.

Abstract: Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.

Abstract: A clip includes a pin (40) and a leaf spring (50). The pin includes a columnar body (44), an expanded head (42) formed at a top end of the body, and a cone-shaped plug (48) formed at a bottom end of the body opposite the head. A slot (488) is defined through the plug and a bottom portion of the body, to enable the plug to elastically deform. The plug is thus adapted for extending through a heat sink and engaging with a printed circuit board. A flange (46) extends perpendicularly from the body between the head and the plug. The leaf spring includes a base (51), with an opening (52) defined therein for extension of the pin therethrough. A pair of inflexed prolongations (53) extends progressively downwards from opposite corners of the base, with the width of each prolongation being less than half the width of the base.

Abstract: A portable computer including two plastic enclosures has a first hinge body attached to a first one of the enclosures. The first hinge body includes a bore formed therein. A flowable lubricant such as grease is disposed within the bore. A second hinge body is attached to a second one of the enclosures. The second hinge body includes an elongated shaft pivotally mounted within the bore having grooves formed on an outer surface of the shaft. A sealing member such as an O-ring is resiliently compressed between one of the grooves and an inner surface of the bore. A friction member is seated in another one of the grooves and in contact with the inner surface of the bore. The seal member has a coefficient of friction such that friction between the seal member and the bore is negligible with respect to friction between the friction member and the bore. The seal member limits the escape of lubricant and the resulting lubricant-induced stress cracks.

Abstract: An underground equipment vault for power and electronic equipment includes an airflow system in combination with an above ground forced air source. The airflow courses through separate first and second chambers including a first chamber for power supplies and a second chamber for energy storage equipment. This airflow, sequentially traversing both chambers, dissipates heat from the equipment and further dispels hydrogen gases from the batteries to the outside air. An airflow system, utilizing fans, provides positive pressure to force the desired airflow through the chambers. The vault is closed with a dual lid structure to supply supporting strength and also supply a secure seal for closing the vault. The dual construction provides an insulating space for further insulating the vault from ambient conditions.

Abstract: An arrangement for cooling an electronic assembly includes a circuit board and an enclosure member. The circuit board has a first surface, a second surface, and at least a first electronic component or other heat-generating element secured to the first surface. The enclosure member is secured to said circuit board so as to form a fluid tight barrier of a compartment defined at least in part by said enclosure member. Such compartment includes a first subcompartment defined at least in part by said first surface and said enclosure member and a second subcompartment defined at least in part by said second surface and said enclosure member. The circuit board further includes at least one aperture extending between the first surface and the second surface such that the first subcompartment is in fluid communication with the second subcompartment.

Abstract: According to the invention a switching device (11) for an electric heating device is provided with a rod-shaped temperature sensor (15) formed by a ceramic rod (17) and an extension tube (16). The temperature sensor (16) operates a snap-action switch (22) located in a base (12) by means of an actuator separate from the said switch, which has at least one actuating part (41), which is loaded in the actuating direction by a leaf spring (34), the actuating part (41) and leaf spring (34) being in one piece. In a further development of the invention the leaf spring (34) or actuating part (41) can be a receptacle for an adjusting device, preferably an adjusting screw (38).

Abstract: A heat dissipater is composed of a base adapted to engage with a heat source, a fan assembly and a cover. The cover has two perpendicular walls, a central through hole and a path from the central through hole in the cover to the open wall at the edge of the base. With such an arrangement, the air can be directly drawn in from the central through hole and blown out of the cover through the path to dissipate the heat of nearby electronic devices.

Abstract: An external casing having a modular design for encasing a variety of hardware peripherals within an interior compartment formed by releasably engaging upper and lower halves that receive an interchangeable interface panel and allow the passage of air above and below the peripheral, thereby eliminating the need for a cooling fan internal of the casing.

Abstract: A system for distributing power to a plurality of electronic modules housed within an electronics cabinet includes an electronics cabinet and at least one power filter mounted to the electronics cabinet. At least one electronic module is housed within the electronics cabinet. A first bus bar is positioned within the electronics cabinet for receiving at least one power input cable. A second bus bar is positioned within the electronics cabinet and is electrically connected to the first bus bar and to the power filter. The second bus bar routes input power from the first bus bar to the power filter and routes filtered power to the at least one electronic module.

Abstract: An enclosure includes a base unit and a cover unit that snaps into the base unit easily, but is difficult to remove from the base unit without knowledge of the appropriate disassembly technique. The appropriate disassembly technique includes the application of pressure at key regions of the base assembly. The application of pressure at the key regions distorts the base assembly so as to disengage key portions of the cover unit from the base unit. The cover unit includes protrusions having an inclined surface and a flat surface. The inclined surface facilitates manufacturing assembly, and the flat surface encumbers the disassembly of the enclosure. The application of pressure at the key regions distorts the base unit so that the flat surfaces of the protrusions on the cover unit are disengaged from the base unit. In a preferred embodiment, the base unit is a resilient insulating material, such as plastic, and the cover unit is a shielding and heat sinking material, such as sheet metal.