Abstract: An electronic device includes one or more electronic components and an electronic enclosure enclosing the electronic components. The electronic enclosure includes venting holes and flaps blocking visibility of the electronic components through the venting holes and from outside the electronic device. In addition, air readily flows through the venting holes providing adequate cooling of the electronic device.

Abstract: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.

Abstract: Provided is a semiconductor module. The semiconductor module includes a substrate including a first surface and a second surface opposite to the first surface. A semiconductor device is disposed on the first surface of the substrate. An airflow guide is disposed on the second surface of the substrate. The airflow guide includes a plate including an end portion distantly from the second surface.

Abstract: In general, according to an embodiment, a power conversion apparatus includes a first inverter, second inverter and a cooler. The first inverter includes a plurality of semiconductor devices connected together in parallel per phase. In the second inverter, the number of parallel-connected semiconductor devices are two or more per phase, the semiconductor devices are connected together in parallel and the number of parallel-connected semiconductor devices in the second inverter is fewer than that in the first inverter per phase. The semiconductor devices in the first inverter are installed in an area of a cooling surface of the cooler positioned over a first channel. The semiconductor devices in the second inverter are installed in an area of the cooling surface positioned over the second channel.

Abstract: Liquid-cooled power unit of a power electronics device, which power unit includes at least two power modules, the cooling surface of which power modules is provided with pin-type protrusions and which power modules are fixed to the frame part of the power unit. A liquid duct is arranged inside the frame part of the power unit, and the power modules are fixed to the points of the apertures situated in the frame part on both sides of the liquid duct in such a way that the pin-type protrusions of the power modules are situated in the liquid duct. A wedge-shaped part is disposed in the liquid duct, which wedge-shaped part includes a wedge-shaped front part for spreading the liquid flow into two essentially equal flows at the point of the power modules.

Abstract: An electrical power distribution system or panelboard that includes a hollow central body with at least one insulated bus bar and a top non-energized metal mounting surface. A plurality of connection points are distributed along the bus bar for electrical device connections. The connection points are contained inside molded plastic holes or wells, and are electrically connected to the main bus bar. Electrical device connections are accomplished via connectors plugged into the holes or wells. The attachment of electrical devices of various sizes and configurations may be accommodated through the use of spacers.

Abstract: An integrated platform assembled with different electrical cabinets and components mounted on a framework in order to provide a complete datacenter critical power distribution package. The integrated platform supports the weight of cabinet enclosures and UPSs mounted onto a skeletal framework, which acts as an equipment support structure and a cable routing support system. Main and redundant power supply wiring is routed along the skeletal framework to and between the cabinet enclosures and the UPSs mounted thereon. Electrical connections between the cabinets are internally connected via bus bars as switchgear cabinets. The skeletal framework has top and bottom rails run substantially parallel to each other with cross bars connecting the top and bottom rails and a top horizontal surface to which one or more of the cabinet enclosures are mounted. The skeletal framework and cabinet enclosures are fabricated prior to installation and installed as a monolithic pre-wired pre-assembled integrated platform.

Abstract: A contact retention assembly is for electrically connecting an electrical apparatus to an electrical bus member. The contact retention assembly includes a bus stab, a spring member and a terminal contact. The bus stab includes first and second opposing sides, and at least one protrusion extending outwardly from a corresponding one of the first side and second sides. The spring member includes first and second opposing legs, an intermediate portion, and a number of openings. The terminal contact is electrically connected to the electrical apparatus, and is disposed between the bus stab and the spring member. The first and second legs of the spring member are biased toward one another to mechanically couple and electrically connect the terminal contact to the bus stab. The protrusion is disposed in a corresponding one of the openings of the spring member to retain the spring member on the bus stab.

Abstract: A system for managing heat generated by electronic equipment in an electronic equipment enclosure is provided. The system includes a duct adapted to receive a first portion of the electronic equipment. The first portion of the electronic equipment includes an air intake opening. The duct forms a barrier between the first portion of the electronic equipment and a second portion of the electronic equipment. The second portion of the electronic equipment includes an air exhaust opening. The barrier separates cooled air entering the air intake opening and heated air exiting the air exhaust opening.

Abstract: The invention relates to an improved aircraft electronics cooling system for an aircraft having a liquid cooling system, the aircraft electronics cooling system providing a thermal coupling between an electronic device to be cooled and the liquid cooling system of the aircraft. A coolant delivered by the liquid cooling system may flow through a board of the electronic device, through a heat sink on which the electronic device is arranged and/or through a housing in which the electronic device is arranged. The coolant may be permanently in the liquid state in a cooling circuit. The coolant may vaporize at least partially while cooling the electronic device.

Abstract: A power conversion apparatus is equipped with grommets each of which hermetically seals between one of a coolant inlet tube and a coolant outlet tube of a cooler. Each of the grommets has a sealing protrusion and is fit in a cut-out formed in an end of a side wall of a casing with the sealing protrusion pressed against an inner wall of the cut-out. The installation of each of the grommets is achieved by inserting the grommet through the cut-out in a direction from outside to inside the casing so that a portion of the grommet protrudes from the wall into the casing. The visual perception of such protrusion made by an assembly worker, therefore, enables the assembly worker to determine whether the grommet has been installed in place in the cut-out to establish a desired hermetical seal or not.

Abstract: Embodiments of the present invention relate to an RRU device and an assembly thereof. The RRU device includes: an enclosure, where the enclosure includes a front-end plate and a back-end plate that are respectively set on two lengthwise ends of the enclosure, multiple parallel spaced heat sinks are set on two widthwise sides of the enclosure and between the front-end plate and the back-end plate, and the front-end plate and the back-end plate extend along a widthwise direction of the enclosure by a length which is greater than a length by which the heat sinks extend; and a joint part set on the enclosure, where the joint part is used to fasten two side-by-side radio remote unit devices together.

Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.

Abstract: In one embodiment a housing for an electronic device comprises a first section, a second section, and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section. Other embodiments may be described.

Abstract: A system includes a power panel actuation system configured to translate a power panel within a panel connection rack. The power panel actuation system includes an input shaft and a plurality of cams coupled to the input shaft, wherein the plurality of cams is configured to engage with the power panel upon rotation of the input shaft, and the plurality of cams is configured to linearly translate the power panel within the panel connection rack.

Abstract: An electronic device includes a first housing with a first air inlet and outlet, a heat dissipation assembly, and a filter structure between the first housing and the heat dissipation assembly. The heat dissipation assembly defines a second air inlet and outlet. The first air inlet, the second air inlet, the second air outlet and the first air outlet communicate with each other. The heat dissipation assembly draws air across itself from the two air inlets, and expels the air from the two air outlets. The filter structure covers the second air inlet and defines a plurality of very small holes which function to filter dust out from the incoming air.

Abstract: An electronics chassis has many removable boards on sleds that are interconnected by a honeycomb interconnect structure. Interconnect boards in Y-planes and Z-planes are orthogonal to each other and form cells. Cooling air flows through the cells in an X direction, parallel to surfaces of the interconnect boards. The removable boards have connectors that mate with an edge of Z-divider interconnect boards. Fans blow air through the cells in the honeycomb structure unimpeded since no boards are perpendicular to the airflow. Notches in the rear of the Z-divider boards provide airflow equalization allowing closer spacing of fans to the honeycomb structure. A sled carrier honeycomb structure is placed in front of the honeycomb interconnect structure to guide sleds into position. Sled carrier dividers are offset from the Z-divider boards to allow removable boards to align with Z-divider boards in the Z-planes, parallel to airflow.

Abstract: An interlocking clip heatsink mounting system (10) is provided for securing a heatsink (12) in optimal thermal contact with a chip carrier (14). The clip structure (24) includes a pair of identical interlocking clip members (28) and a spring member (26). The clip side members (28) are provided with crenellations (50) and hook wedges (62) so as to interlock in partially engaged and fully engaged modes.

Abstract: Heat-dissipating assemblies may comprise mounting tabs attached to heat-generating electrical components at a first surface of each mounting tab. An opposing second surface of each mounting tab may be at least substantially coplanar with the second surfaces of the other mounting tabs. A heat sink element may be attached to the second surfaces of at least some of the mounting tabs. Methods of assembling heat-dissipating assemblies may comprise attaching first surfaces of mounting tabs to at least substantially planar assembly surfaces of an assembly fixture such that the first surfaces of the mounting tabs are at least substantially coplanar with one another. Opposing second surfaces of the mounting tabs may be attached to heat-generating electrical components. The assembly fixture may be removed. A heat sink element may be attached to the at least substantially coplanar first surfaces of at least some of the mounting tabs.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.