Abstract: A data center inside a shipping container having computing equipment and associated devices located in its interior. The data center includes computing equipment, an internal network, an external network, power supplies, a lighting system, and a controller. The power supplies and the lighting system connect to the controller, which in turn connects to the internal network. The computing equipment connects to the power supplies. A remote computing device connected to the external network communicates with the controller through the internal network. The remote computing device receives information from the controller and instructs the controller to selectively energize and de-energize the power supplies and the lighting system. The controller may have a user interface configured to display data associated with the computing equipment and other devices and systems located within the container.

Abstract: An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.

Abstract: An enclosure for a power supply is disclosed. The enclosure may include a control compartment configured to receive one or more control components, a transformer compartment positioned adjacent to the control compartment and configured to receive a transformer, and a power cell compartment positioned adjacent to the control compartment and the transformer compartment. The power cell compartment may be configured to receive a plurality of power cells arranged into a plurality of pods. The power cells may be received in the power cell compartment such that each power cell in a first pod is adjacent to at least two other power cells in the first pod. A voltage difference between adjacent power cells in a pod may be less than an acceptable voltage tolerance.

Abstract: Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract: A cover assembly for an automatic transfer switch (ATS) is provided. The ATS includes an operator-panel portion and a pole-assembly portion, wherein the operator-panel portion comprises at least one solenoid and associated wiring. The cover assembly includes and operator-panel cover and a pole-assembly cover. The operator-panel cover is configured to cover the operator-panel portion such that the at least one solenoid and associated wiring are substantially enclosed, the operator-panel cover comprising a first plurality of ventilation louvers for heat dissipation. Further, the pole-assembly cover is configured to cover the pole-assembly portion, the pole-assembly cover comprising a second plurality of ventilation louvers for heat dissipation.

Abstract: An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

Abstract: A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack, and where the opening allows directed air to enter the rack from a front direction; a printed circuit board attached to the metal frame; and a group of front panel connectors attached to the front section of the metal frame.

Abstract: An air duct includes a hollow main body defining a through slot, an inlet member and an outlet member connected to opposite ends of the main body. The inlet member includes a top wall, a bottom wall, a first sidewall, and a second sidewall. The second sidewall slantingly extends forward and away from the first sidewall. A space communicating with the through slot is bounded by the top wall, the bottom wall, and the first and second sidewalls. The space has an inlet wider than the through slot. The outlet member is perpendicularly connected to the main body and defines an outlet communicating with the through slot.

Abstract: An electrical apparatus, comprises a restricted breathing enclosure having an interior cavity, and a temperature regulator having at least an interior sensing portion within the interior cavity, the temperature regulator including a processor responsive to the interior sensing portion to send control signals to a heat transfer portion of the temperature regulator.

Abstract: A circuit module can include a substrate, photonic conversion units placed on the substrate; and a retention assembly. The retention assembly can include a heat sink in thermal contact with the photonic conversion units and a fastener. The fastener can be mechanically coupled to both the substrate and the heat sink, and configured to press the heat sink against the photonic conversion units. The plurality of photonic conversion units are removably secured to the substrate by the retention assembly without the use of a bonding material.

Abstract: A board assembly which enables reduction of the size of an electronic device test apparatus is provided. A test module 20 comprises: a first pin electronics card 21; a second pin electronics card 22; and a single intermediate water jacket 23 which is sandwiched between the first pin electronics card 21 and second pin electronics card 22. The intermediate water jacket 23 is in close contact with the first inside main surface 212 of the first pin electronics card 21 which faces the second pin electronics card 22 and is in close contact with the second inside main surface 222 of the second pin electronics card 22 which faces the first pin electronics card 21.

Abstract: An electronic device includes a circuit board, a heat generating component positioned on the circuit board, a casing receiving the circuit board and the heat generating component, and a working medium. The working medium is contained in the casing and covers the heat generating component. The working medium is electrically insulated and phase-change material, and represents solid state at normal temperature.

Abstract: An apparatus and associated methodology associated with a thermally conductive frame having a perimeter surface defining a passage. A printed circuit board assembly (PCBA) is operably disposed within the passage and connected to the frame. The PCBA includes a solid state memory component. An internal cover is disposed in the passage on one side of the PCBA. The internal cover conducts heat to the frame that is operably generated by the solid state memory component. An external cover is attachable to the frame on an opposing side of the PCBA. The external cover cooperates with the frame and the internal cover to enclose the PCBA.

Abstract: An electrical junction box includes a box body in which electrical parts are mounted and that has a water draining hole provided at a bottom wall part of the box body and a waterproof wall that is provided inside the box body along a periphery of an opening of the water draining hole. The waterproof wall includes a spherical cover wall part standing from the periphery of the water draining hole to cover the water draining hole with an inner spherical surface, and a draining opening part formed at a portion of the spherical cover wall part to allow water exist in the box body to drain to the outside of the box body through the water draining hole.

Abstract: A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.

Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.

Abstract: An electronic component assembly includes a housing that provides a cavity filled with a cooling fluid that has a liquid phase and a vapor phase. An electronic element is arranged in the cavity and is configured to generate heat. A wicking material is arranged in the cavity between the housing and the electronic device. The cavity provides a gap adjacent to the wicking material. The wicking material is configured to absorb the liquid phase, and the vapor phase is provided in the gap.

Abstract: An electric part fixing structure for a motor-driven compressor includes an electric part having a plurality of leads and a guide member for positioning the leads. The guide member is made of a plastic and has a guide hole through which the lead is passed.

Abstract: A server system and a server thereof are provided. The server system includes a rack, a server, and a fan module, wherein the server and the fan module are located in the rack. The server includes a chassis, a circuit board, a first heat source, a second heat source, a liquid cooling device, and a shielding cover. The circuit board is disposed on the chassis, and the first heat source and the second heat source are disposed on the circuit board. The liquid cooling device is thermally connected to the second heat source covered by the shielding cover. When the fan module is in operation, outside air is taken into the server by the fan module. The flow rate of an air flow passing by the first heat source is greater than that of another air flow passing by the second heat source capped by the shielding cover.

Abstract: An electronic device including a main body, a heat dissipation fan and at least one block is provided. The main body has a side shell and a bottom shell. The side shell has a first air inlet and a first air outlet. The heat dissipation fan is disposed in the main body and has at least one second air inlet and at least one second air outlet. The second air outlet is aligned to the first air outlet. The block is disposed in the main body to form a channel with the bottom shell and the dissipation fan. The channel is extended between the second air inlet and the first air inlet, so as to guide airflow to pass through the first air inlet and the second air inlet sequentially and enter the heat dissipation fan.