Abstract: An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering.

Abstract: A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of the rack. Each heat dissipation device includes a case fixed to the rack, a fan mounted to an outer side of the case, and a heat dissipation plate received in the case and aligning with the fan. The heat dissipation plate defines a vent. The fan draws heat air through the vent of the heat dissipation plate from the rack, and the heat air is cooled by refrigerant received in the heat dissipation plate to become cool air. The cool air flows in the container, and circularly flows into the cabinet from a front side of the cabinet.

Abstract: According to one embodiment, a server rack includes a server, a housing which includes a ventilation opening part, and surrounds the server, a water sensor which is provided outside the housing and senses water, a closing member which is movable between a first position in which the closing member is dislocated from the opening part and a second position in which the closing member covers the opening part, a moving mechanism which moves the closing member from the first position to the second position, an adhering mechanism which brings the closing member that has moved to the second position into close contact with the housing, and a controller which operates the moving mechanism and the adhering mechanism, when the water sensor senses water.

Abstract: A power inverter includes a metallic chassis having a containing space at an inner portion thereof, having a lid on one side in a vertical direction, the other side thereof being enclosed by a bottom, a cooling block of forming a coolant path along a bottom side in the vertical direction of the chassis, and a side portion of the inner portion of the chassis, plural semiconductor modules each incorporating a semiconductor chip for configuring an inverter circuit of converting a direct current power into an alternate current power, and provided with a direct current terminal for making a current flow to the semiconductor chip and a control terminal for controlling an operation of the semiconductor chip to be protruded to an outer portion.

Abstract: The invention relates to a control cabinet for a wind turbine including a cabinet body (24) defining an inner chamber (23) and having a peripheral wall (40). One or more electric circuits (19, 20, 21) are arranged in the inner chamber (23) and one or more electric energy storage modules (50) which are secured to the cabinet body (24). The energy storage modules (50) are arranged on an exterior side of the cabinet body and are detachably secured thereto.

Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.

Abstract: A recessed lighting fixture includes a lamp housing and a separate compact junction box, which contains a power supply that drives the lamp and serves in part to divide the interior cavity of the junction box into two separate wiring compartments. The junction box has two end walls spaced along an axis and a releasably secured cover The lighting fixture is particularly suitable for retrofit installations, especially where small aperture downlights are desired.

Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.

Abstract: A heating and heat dissipating multi-layer circuit board structure for keeping operating temperatures of electronic components is provided. The outer layer of the multi-layer printed circuit board is in contact with electronic components. The operating temperatures of electronic components are measured through by a temperature measuring circuit. When the operating temperature of at least one electronic component is lower than a default temperature, the heating circuits corresponding to the electronic components are enabled respectively to heat the electronic components through corresponding heat conduction elements. When the operating temperature of at least one electronic component is higher than another default temperature, the heating circuits corresponding to the electronic components are disabled to transfer the heat from the electronic components to the heat conduction elements automatically.

Abstract: An electronic component cooling unit includes a housing having a flow path in an interior of the cooling unit. The flow path circulates a cooling medium. Two surfaces, that is, a top surface and a bottom surface, are located at the housing. Electronic components are mounted to the housing, and side surfaces are located at the housing and surround the top surface and the bottom surface. Multiple opening portions are located at the side surfaces and communicate with the flow path. A closing member closes the opening portion or each opening portion other than the opening portions that corresponds to a supply opening and a discharge opening for the cooling medium.

Abstract: An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is spaced from an outer surface of the at least one electronic component. An opening is formed through the shroud, such that air can be driven within the shroud from the blower diffuser, and across at least one electronic component, and then outwardly of the opening. A heat exchanger is positioned in the path of air leaving the opening.

Abstract: A drive shaft extension assembly is provided for an electrical switching apparatus which is removably disposed in a cassette. The electrical switching apparatus includes a levering assembly with a drive shaft. The drive shaft extension assembly includes a housing assembly, a shaft extension including an elongated body, and a racking gear. The shaft extension is structured to be coupled to the drive shaft in a fixed orientation, thereby increasing the width of the levering assembly.

Abstract: Embodiments of the present disclosure generally pertain to passive cooling systems and methods for electronics. An exemplary passive cooling system for electronics has a circuit package and dielectric liquid. The circuit package has a cover positioned over a circuit element coupled to a substrate. The cover is attached to the substrate and creates a water-tight seal around the circuit element. The circuit package further has a porous media. The dielectric liquid directly contacts the circuit element, and heat from the circuit element is transferred to the dielectric liquid. As the liquid reaches its boiling point, vapor from the liquid is passed through the porous media for further cooling.

Abstract: A power distributor for use in vehicles is provided. The power distributor includes a base module having a central power feed and at least two universal modules, thereby forming a modular structure of the power distributor. The universal modules have defined geometries and are mechanically and electrically removably connectable to corresponding locations on the base module. Each universal module includes at least one electrical component. The base module includes a printed circuit board having at least one of current conducting paths and at least one bus bar. The base module comprises contact connectors for connection to loads of the vehicle. An electrical component is also provided as a semi-finished product for further processing in vehicles. The electrical component includes a bus bar and a lamellar contact attached thereto.

Abstract: A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: The present invention is directed to an enclosure for electrical equipment. The enclosure includes a power plate assembly and a vented cover installed over the power plate assembly. Electrical components operating at 50 volts or more are mounted to a rail in the power plate assembly. The vented cover separates the electrical components mounted to the rail from the electrical components mounted in the enclosure.

Abstract: A heat-dissipating module is disposed within an electronic device. The heat-dissipating module includes at least one vibration element, a bracket, and a driving unit. The vibration element includes a working part and a free end. The bracket is connected with the working part of the at least one vibration element. The driving unit is connected with the bracket. When the driving unit drives the bracket to vibrate at a vibration frequency, the vibration element is moved with the bracket, and a resonant vibration causes the free end of the vibration element to generate a displacement, so that an airflow is generated at the free end of the vibration element to cool the electronic device.

Abstract: Semiconductor element groups constituting a unit are mounted on a cooler heat receiving part 1 on the same plane and are adapted to radiate heat by self-cooling or cooling by wind. First and fourth semiconductor elements Q1, Q4 are arranged on the lower side of the cooler heat receiving part, second and third semiconductor elements Q2, Q3 are arranged in the middle, a first diode D5 and a second diode D6 are arranged on the upper side, the first and second semiconductor elements Q1, Q2, as well as the third and fourth semiconductor elements Q3, Q4 are each arranged in positions opposite to each other in a horizontal direction with respect to a centerline of a cooler in a vertical direction.

Abstract: A shutter device for a drawout circuit breaker. The arrangement includes first and second moveable plungers for contacting the circuit breaker. The arrangement also includes a first slider element attached to a moveable first mask. A first link arm is rotatably attached to the first plunger and the first slider element. The arrangement also includes a second slider element attached to a moveable second mask. A second link arm is rotatably attached to the second plunger and the second slider element. Movement of the first and second plungers in a first direction causes movement of the first and second slider elements and the first and second masks in a second direction transverse to the first direction relative to a back plate to form mask passageways. The arrangement also includes a plurality of mounting elements that enable movement of the back plate in the first direction.