Abstract: A cleaning agent is provided for a semiconductor substrate superior in corrosion resistance of a tungsten wiring or a tungsten alloy wiring, and superior in removal property of polishing fines (particle) such as silica or alumina, remaining at surface of the semiconductor substrate, in particular, at surface of a silicon oxide film such as a TEOS film, after a chemical mechanical polishing process; and a method for processing a semiconductor substrate surface. A cleaning agent for a semiconductor substrate is to be used in a post process of a chemical mechanical polishing process of the semiconductor substrate having a tungsten wiring or a tungsten alloy wiring, and a silicon oxide film, comprising (A) a phosphonic acid-based chelating agent, (B) a primary or secondary monoamine having at least one alkyl group or hydroxyalkyl group in a molecule and (C) water, wherein a pH is over 6 and below 7.

Abstract: The present invention relates to aqueous compositions of associative polyelectrolyte complexes (PECs), optionally containing surfactants, biocidal agents and/or oxidants, which can provide surface protection to treated articles including reduced soiling tendency, reduced cleaning effort and improved soil repellancy, as well as providing bacteriostatic properties to treated surfaces that thereby gain resistance to water, environmental exposure and microbial challenge. Treatment means and compositions are provided that employ associative polyelectrolyte complexes formed by combining a water soluble cationic first polyelectrolyte with a water soluble second polyelectrolyte bearing groups of opposite charge to the first polyelectrolyte under suitable mixing conditions where the one polyelectrolyte present in molar excess is added in the form of a first aqueous solution during a mixing step to a second aqueous solution comprising the oppositely charged polyelectrolyte present in molar deficiency.

Abstract: A cleaning liquid for lithography that is capable of removing residual material which remains after an etching process, as well as suppressing corrosion of at least one of cobalt and alloys thereof, and a method for cleaning a substrate using the cleaning liquid. The cleaning liquid for lithography includes hydroxylamine, at least one basic compound selected from amine compounds other than hydroxylamine, and quaternary ammonium hydroxides, and water, and has a pH value of 8 or higher. The cleaning liquid is used in cleaning a substrate containing at least one of cobalt and alloys thereof.

Abstract: A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.

Abstract: This invention provides a liquid composition that removes titanium nitride from a substrate without corroding tungsten or a low-k interlayer dielectric also present on said substrate. Said liquid composition has a pH between 0 and 4, inclusive, and contains the following: at least one oxidizing agent (A) selected from the group consisting of potassium permanganate, ammonium peroxodisulfate, potassium peroxodisulfate, and sodium peroxodisulfate; a fluorine compound (B); and a tungsten-corrosion preventer (C). The tungsten-corrosion preventer (C) either contains at least two different compounds selected from a group of compounds (C1) consisting of alkylamines, salts thereof, fluoroalkylamines, salts thereof, and the like or contains at least one compound selected from said group of compounds (C1) and at least one compound selected from a group of compounds (C2) consisting of polyoxyalkylene alkylamines, polyoxyalkylene fluoroalkylamines, and the like.

Abstract: An automotive cleaning composition includes by weight of the composition about 48% by weight of xylene, about 22% by weight of a nonylphenol ethoxylate, about 15% by weight of a hydrophobic glycol ether, and the balance being water.

Abstract: A thermochromic, near infrared (NIR) absorbing interlayer. The interlayer includes a NIR-absorbing substance dispersed or dissolved in a polymer matrix and a thermochromic material or system. The interlayer has an internal visible light transmission above 50% and an internal solar energy transmission below 55% when the interlayer is at 15° C. and an internal visible light transmission below 20% and an internal solar energy transmission below 20% when the interlayer is at 75° C. The internal haze of the interlayer is below 3.5%.

Abstract: A compound having Formula (I), nC7—H15—O-(G)p-H, where G is a reducing sugar residue, and p is a decimal number ?1.05 and ?5. The method for preparing the compound and its use as a hydrotropic surfactant by making soluble, in an aqueous alkaline composition, at least one non-ionic surfactant having Formula (II), R—(O—CH(R?)—CH2)n-(0-CH2-CH2)m-0-H, where R is a straight, branched, saturated or unsaturated aliphatic hydrocarbon radical including 8-14 carbon atoms, R? is a methyl or ethyl radical, n and m are whole numbers ?0 and ?15, assuming that n+m?0. Cleaning compositions containing 0.5% to 20% of compounds of Formula (I), 0.5% to 80% of compounds of Formula (II), 10-50 wt % of at least one alkaline agent, 15-89 wt % of water, and optionally, 10-50 wt % of at least one anti-limescale agent are useful for cleaning hard surfaces.

Abstract: A liquid cleaning and/or cleansing composition comprising abrasive cleaning particles; one or more surfactants selected from the group consisting of anionic, nonionic, cationic, amphoteric and mixtures thereof; and a first acidic component wherein said acidic component consists of one or more chelating acids; wherein at least one nonionic surfactant is comprised in said composition and the total level of nonionic surfactant is less than 2% by weight of the total composition and/or at least one anionic surfactant is comprised in said composition and the total level of anionic surfactant is less than 2% by weight of the total composition.

Abstract: Alkaline ware wash detergents containing an alkali metal alkalinity source and alkanol amine phosphonate scale inhibitors and methods of employing the same for superior cleaning efficacy and hard water scale control are disclosed. Alkanol amine phosphonates beneficially reduce scale build-up, including calcium carbonate scale build-up from alkaline detergents used with hard water sources. Methods of employing the detergent compositions are also disclosed.

Abstract: Liquid compositions useful for the cleaning of residue and contaminants from a III-V microelectronic device material, such as InGaAs, without substantially removing the III-V material. The liquid compositions are improvements of the SC1 and SC2 formulations.

Abstract: This invention relates to a polymer composition, comprising: water; a water-soluble polymer; and solid particulates of a sequestering agent. The composition may be used for decontaminating, cleaning and/or washing substrates contaminated with contaminants and/or contaminated materials.

Abstract: A fabric treatment agent and a fabric treatment apparatus, and a fabric treatment method using the same, wherein the fabric treatment agent is a liquid fabric treatment agent including a cationic surfactant having a content ratio of 0.5% to 1.0% and silicone oil having a content ratio of 0.05% to 0.1%.

Abstract: Methods of cleaning sugar evaporators with a cleaning composition comprising a sugar or sugar-moiety containing compound are disclosed. The methods are capable of improved scale and fouling removal from treated surfaces, including scale containing calcium oxalate, calcium dihydrogen phosphate, silica and/or other components from sugar evaporators. The methods reduce time required for scale removal without the need for highly alkaline cleaning compositions, elevated temperatures and/or mechanical force applied to the scale.

Abstract: Disclosed is a liquid chemical for forming a water-repellent protecting film at least on a surface of a recessed portion of an uneven pattern at the time of cleaning a wafer having a finely uneven pattern at its surface and containing silicon at at least a part of the uneven pattern. This liquid chemical contains a silicon compound A represented by the general formula: R1aSi(H)bX4-a-b and an acid A, the acid A being at least one selected from the group consisting of trimethylsilyl trifluoroactate, trimethylsilyl trifluoromethanesulfonate, dimethylsilyl trifluoroactate, dimethylsilyl trifluoromethanesulfonate, butyldimethylsilyl trifluoroactate, butyldimethylsilyl trifluoromethanesulfonate, hexyldimethylsilyl trifluoroacetate, hexyldimethylsilyl trifluoromethanesulfonate, octyldimethylsilyl trifluoroactate, octyldimethylsilyl trifluoromethanesulfonate, decyldimethylsilyl trifluoroacetate and decyldimethylsilyl trifluoromethanesulfonate.

Abstract: Formulations comprising (A) at least one aminocarboxylate selected from methylglycine diacetate (MGDA), iminodisuccinic acid (IDA) and glutamic acid diacetate (GLDA), and salts and derivatives thereof, and (B) at least one alkoxylated alkyleneimine polymer with an average molecular weight Mw in the range from 800 to 25 000 g/mol which has a positive charge density of at least 5 meq/g and which has in the range from 2 to at most 80% by weight alkylene oxide side chains, based on total alkoxylated alkyleneimine polymer.

Abstract: A cleaner composition includes: a saturated aliphatic hydrocarbon (A); an anionic surfactant (B); a nonionic surfactant (C); and water (D). The cleaner composition contains the saturated aliphatic hydrocarbon (A) in a proportion of 60.0% by mass to 85.0% by mass, the anionic surfactant (B) in a proportion of 8.0% by mass to 15.0% by mass, the nonionic surfactant (C) in a proportion of 2.0% by mass to 5.0% by mass, and the water (D) in a proportion of 1.0% by mass to 20.0% by mass, forms a W/O microemulsion or a solubilized W/O emulsion, and has a volume resistivity of 1×109 ?·cm or less.

Abstract: Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %. hydroxide based on a total weight of the cleaning composition and deionized water.

Abstract: The present invention comprises a hard surface cleaning and treatment composition with a synergistic combination of mild surfactants that makes the composition particularly suited for leather, synthetic leather, vinyl and stainless steel. The composition is gentle and non-damaging to leather and synthetic leather, and leaves no sticky residue. The composition can clean food soils such as mustard, ketchup, shortening and grease and requires no personal protective equipment when being used. In addition, a method of preserving a leather surface or article by contacting said surface with said substrate is disclosed as well as specific methods associated with making the composition to form a stable water in oil emulsion.

Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.