Abstract: A device mounting board includes a metallic substrate, an oxide film formed such that the surfaces of the metallic form are oxidized, an insulating resin layer disposed on the oxide film facing one main surface of the metallic layer, and a wiring layer disposed on the insulating resin layer. The film thickness of a certain partial region of the oxide film disposed below a first semiconductor device is greater than that of the other regions surrounding the partial region of the oxide film. Conversely, the film thickness of the insulating resin layer underneath a second semiconductor device is less than that of the insulating resin layer underneath the first semiconductor device.

Abstract: An electric wire terminal connection structure includes an electric wire including a core made of a metallic material and an insulation layer covering the core, a terminal fitting attached to a terminal of the electric wire and made of a metallic material other than the metallic material of the core, and an intermediary cap to be crimped to the core by the terminal fitting and to cover an exposed portion of the core exposed by removing the insulation layer at the terminal of the electric wire. The intermediary cap has conductivity and is made of a metallic material having a value of a standard electrode potential between that of the core and that of the terminal fitting.

Abstract: A flexible cable has a conductor formed by twisting a plurality of annealed copper wires and a plurality of alloy wires, an assembled conductor formed by twisting a plurality of the conductors, an insulated wire core formed by covering the assembled conductor with an insulator, a cable core portion formed by twisting a plurality of the insulated wire cores, and a sheath covering the outside of a single or a plurality of the cable core portions.

Abstract: A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from the second surface to the first circuit layer. The insulation layer is disposed on the first surface and has a third surface, a fourth surface, and first openings. The first openings expose the first circuit layer and an aperture of each first opening is increased gradually from the third surface to the fourth surface. The conductive blocks fill the first openings and connect with the first circuit layer. The first conductive structure includes conductive vias filling the blind vias and a second circuit layer disposed on a portion of the second surface.

Abstract: A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.

Abstract: An electrical conductor includes an ultra-thin layer of aluminum-doped zinc-oxide and a nano-layer of alumina in contact and conformal with a surface of the ultra-thin aluminum-doped zinc-oxide layer.

Abstract: A star-quad cable for transmitting electrical signals, having at least two pairs of conductors, each conductor having one wire made of an electrically conductive material and a conductor sheath radially enclosing the wire and made of an electrically insulating material, the conductors being arranged on the corners of a square in a cross-section, with the conductors of a pair arranged on diagonally opposite corners of the square, wherein four conductors are twisted at a predetermined stranding factor; and a shield made of an electrically conductive material and enclosing the two pairs of conductors is arranged radially on the outside, constructed from a weave of individual shield wires. At least one shield wire or at least one shield wire bundle is stranded radially enclosing the conductors such that they run in the axial direction substantially parallel to a wire of a conductor.

Abstract: As Technical Problem, provided is a transfer sheet using graphene as a transparent conductive material, and a transparent conductor. As solution problem, there is provided a transfer sheet that includes a substrate sheet having releasability and smoothness, a metal thin film layer partially or entirely formed on the surface of the substrate sheet to reflect the smoothness of the substrate sheet, and a transparent conductive film layer formed on the metal thin film layer and mainly composed of graphene.

Abstract: Any one of the fan-out leads includes a first metal strip portion having a predetermined number, located on a glass substrate, disposed along an extension direction of the fan-out lead and is spaced apart; an insulation layer covering each of the first metal strip portion, and disposed with a first through hole and a second through hole; and a second metal strip portion located on the insulation layer and being contacted with each of the first metal strip portion by the first through hole and the second through hole. Wherein, the lengths of the first metal strip portions of the fan-out leads are gradually increased along the direction which is from the center to the edge of the fan shape such that impedances of the fan-out leads are consistent.

Abstract: There is provided a multilayer ceramic capacitor, including a ceramic body including a plurality of dielectric layers stacked in a width direction and having upper and lower surface, first and second side surfaces, and first and second end surfaces, a first internal electrode formed on the dielectric layer and including a first lead part exposed to the upper and lower surfaces, a second internal electrode facing the first internal electrode, having at least one dielectric layer therebetween and having a second lead part exposed to the upper and lower surfaces, a first external electrode, a second external electrode, a first dummy pattern, and a second dummy pattern, wherein when a length of the ceramic body is B, a distance of the first lead part is C1, and a distance of the first dummy pattern is C3, 0.1?(C1+C3)/B?0.6 is satisfied.

Abstract: An electric cable made from at least one elongated electric conductor and a multilayer insulation surrounding the electric conductor. The multilayer insulation has a first semiconducting layer and an electrically insulating layer, where the two layers are made from a silicone rubber based composition. The semiconducting silicone rubber based composition of the first semiconducting layer has carbon rovings as conductive filler.

Abstract: An extra-flexible insulated electric wire includes a conductor portion and an insulating cover. The conductor portion includes an inner layer and an outermost layer. In the inner layer, conductive strands are collectively twisted. In the outermost layer, conductive strands are disposed along an outer circumference of the inner layer. The insulating cover covers the conductor portion.

Abstract: A composite core for use in electrical cables, such as high voltage transmission cables is provided. The composite core contains at least one rod that includes a continuous fiber component surrounded by a capping layer. The continuous fiber component is formed from a plurality of unidirectionally aligned fiber rovings embedded within a thermoplastic polymer matrix. The present inventors have discovered that the degree to which the rovings are impregnated with the thermoplastic polymer matrix can be significantly improved through selective control over the impregnation process, and also through control over the degree of compression imparted to the rovings during formation and shaping of the rod, as well as the calibration of the final rod geometry. Such a well impregnated rod has a very small void fraction, which leads to excellent strength properties. Notably, the desired strength properties may be achieved without the need for different fiber types in the rod.

Abstract: A method for electrically connecting an offshore first electrical plant to a second electrical plant, the offshore first electrical plant being an offshore wind turbine generator, the method comprising providing a transition cable terminated at one end with a first connector part, the transition cable being connected or connectable at the other end to the offshore wind turbine generator above the water surface, and providing a cable terminated at one end with a second connector part and connected or connectable at the other end to the second electrical plant, the second connector part being adapted to mate with the first connector part to form a connector.

Abstract: A gold finger, includes a substrate, an embossable adhesive layer and a plurality of wires. The gold finger is achieved through adhering an embossable adhesive layer to a side of the substrate, providing grid-shaped grooves on a side of the embossable adhesive layer away from the substrate, embedding conductive grids of the wires in the grooves to form the wires. The gold finger is disposed on a sensing component, the wires of the gold finger are electrically connected with a circuit board through an anisotropic conductive adhesive. The contact area of the wire and the embossable adhesive layer is increased through embedding the conductive grid of the wire, which is grid-shaped structure, in the grooves such that the wires are tightly combined to the embossable adhesive layer and not easy to fall off or be scratched. The present invention further provides a touch screen containing the gold finger.

Abstract: A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height.

Abstract: A flat-conductor connection element for an antenna structure is described. The flat-conductor connection element is arranged in or on a pane and has: a flat conductor with a base layer, a conductor track, a first dielectric layer, a shield, and a second dielectric layer and a metal frame.

Abstract: A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.

Abstract: The invention relates to a bushing for sealing a strand-shaped element (10), in particular one or more lines, in an opening (14) of a wall (15), comprising a foamed sealing body (40), which completely surrounds the strand-shaped element (10) and defines a volume, and a fastening body (20) for fastening the bushing to the wall (15), characterised in that the fastening body (20) is made of a different material than the sealing body (40), the volume defined by the scaling body (40) is delimited on one side at least along a portion of said side and is connected at least by bonding to the sealing body (40) along said portion.

Abstract: A hollow sealing structure includes a substrate, an element part provided on a first surface of the substrate, a cap that covers the element part, and a resin layer that covers the cap. The substrate includes a positioning part positioning the cap. The cap includes a fixation part being arranged at the positioning part and fixing the cap on the substrate. The resin layer is connected to the positioning part and the fixation part.