Abstract: A bulk acoustic wave filter includes: a first bulk acoustic wave resonator including, in an order from bottom to top, a first cavity, a first bottom electrode, a first segment of a piezoelectric layer, and a first top electrode; a second bulk acoustic wave resonator disposed adjacent to the first bulk acoustic wave resonator, and including, in the order from bottom to top, a second cavity, a second bottom electrode, a second segment of the piezoelectric layer, and a second top electrode; a boundary structure surrounding the first cavity and the second cavity, the boundary structure including a boundary portion extending between and separating the first cavity and the second cavity, and the boundary portion being disconnected at a disconnection region; and a first release hole formed in the piezoelectric layer, and overlapping the disconnection region.

Abstract: Circuits and methods for improving the noise figure (NF) of an amplifier, particularly an LNA, in high-gain modes while improving the IIP3 of the amplifier in low-gain modes. The source of an amplifier common-source FET is coupled to circuit ground thorough a degeneration circuit comprising a two-port inductor and a bypass switch coupled in parallel with the inductor. A switched feedback circuit is coupled between the gate of the common-source FET and a feedback node in the amplifier output signal path. During a low gain mode, the inductor is entirely bypassed and the enabled feedback circuit lowers the input impedance of the common-source FET and reduces the gain of the amplifier circuit, essentially eliminating the need for a degeneration inductor. During a high gain mode, the source of the common-source FET is coupled to circuit ground through the inductor and the feedback circuit is disabled. Other gain modes are supported.

Abstract: A power amplifier circuit includes a first impedance transformer circuit arranged to connect with a carrier device, and a second impedance transformer circuit arranged to connect with a peaking device. Both the first and the second impedance transformer circuit include a parallel impedance transformer arrangement.

Abstract: An acoustic wave device includes an interdigital transducer electrode connected to first and second terminals, and a reflector connected to the second terminal. In a group of electrode fingers of the interdigital transducer electrode, the electrode fingers at one end and another end in a second direction are respectively first and second end electrode fingers, the first end electrode finger includes a wide portion at a distal end portion. The first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An inner busbar portion of one of first and second busbars not connected to the first end electrode finger, is located on an inner side in the second direction relative to the wide portion of the first end electrode finger so as not to overlap the wide portion of the first end electrode finger in a first direction.

Abstract: An automatic gain control circuit includes a linear-to-log conversion circuit, a current amplifier circuit, and an amplitude sense circuit. The current amplifier circuit includes a current input terminal coupled to an output terminal of the linear-to-log conversion circuit. The amplitude sense circuit includes an input terminal coupled to an output terminal of the current amplifier circuit, and an output terminal coupled to a gain control input terminal of the current amplifier circuit.

Abstract: A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers on top of one another and that has a coil built thereinto, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body is parallel to the mounting surface. The multilayer coil component includes first and second connection conductors. The first and second connection conductors overlap the coil conductors in a plan view from the stacking direction and are located closer to the mounting surface than a center axis of the coil. Distances between adjacent coil conductors are not constant in a side view from a direction perpendicular to the stacking direction.

Abstract: Circuits and methods for achieving good amplifier AM-AM and AM-PM metrics while achieving good power, PAE, linearity, and EVM performance. Embodiments compensate for a non-linear distortion profile (e.g., an AM-PM and/or AM-AM profile) in an amplifier by pre-processing an input signal, such as a radio-frequency signal, to alter the non-linear distortion profile of the input signal so as to compensate for the non-linear distortion profile imposed by a coupled device, such as an amplifier.

Abstract: In some embodiments, an apparatus includes a plurality of first conductive traces oriented in a first direction in a first layer and plurality of second conductive traces oriented in a second direction in a second layer coupled by vias to define first hierarchical networks. A plurality of third conductive traces oriented in the first direction in a third layer and a plurality of fourth conductive traces oriented in the second direction in a fourth layer are coupled by vias to define second hierarchical networks. Open ends of the first or second traces at a last stage of the first hierarchical networks comprise first ends and open ends of the third or fourth traces at a last stage of the second hierarchical networks comprise second ends. A first end and a corresponding second end are non-collinear to each other and perpendicular to a major plane of the first layer.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: Acoustic wave resonators are disclosed that include a piezoelectric layer and an interdigital transducer electrode over the piezoelectric layer. The interdigital transducer electrode has a rotation angle and a tilt angle. The rotation angle and the tilt angle can together increase a figure of merit of the acoustic wave device. The rotation angle and the tilt angle can both be non-zero.

Abstract: A directional coupler (1) includes a substrate (10), a main line (20) formed directly or indirectly on the substrate (10), sub-lines (21, 22 and 23) at least part of each of which is formed directly or indirectly on the substrate (10) along the main line (20), a switch (30) switching connections among end portions of the plurality of sub-lines (21, 22 and 23), and detection output terminals (FWD and REV) connected to the sub-line (21), wherein, when looking at the substrate (10) in plan, the end portions of the sub-lines (21, 22 and 23) are disposed on the opposite side to the detection output terminals (FWD and REV) relative to the main line (20), and the sub-line (21) to which the detection output terminals (FWD and REV) are connected is overlapped with or surrounded by the sub-lines (22 and 23).

Abstract: A system of modular components each include pin ports that may be connected in different configurations to enact alternative planar designs. Each modular component has asymmetries that are utilized to facilitate alternative wiring. Such asymmetries could include protrusions in the wafer to align edge connections. Alternatively, or in addition, the asymmetries include differences in copper disposition to certain edge connections. Each modular component has a non-conductive coating on each side of the wafer to insulate the underlaying copper layer.

Abstract: The invention relates to a SAW resonator (100) comprising at least: a substrate (102); a layer (108) of piezoelectric material arranged on the substrate; a first attenuation layer (112) arranged between the substrate and the layer of piezoelectric material, and/or, when the substrate comprises at least two different layers (104, 106), a second attenuation layer (114) arranged between the two layers of the substrate; and in which the at least one attenuation layer is/are heterogeneous.

Abstract: CRLH lines including left-handed shunt inductors and left-handed series capacitors are provided on gate side transmission lines of a plurality of FETs.

Abstract: An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a silicon oxide film arranged on the piezoelectric substrate to cover the IDT electrode. The IDT electrode includes first and second electrode layers laminated on each other, the first electrode layer is made of metal or an alloy with a density higher than a density of metal of the second electrode layer and a density of silicon oxide of the silicon oxide film, the piezoelectric substrate is made of LiNbO3 and ? is in a range of equal to or greater than about 8° and equal to or less than about 32° with Euler Angles (0°±5°, ?, 0°±10°) of the piezoelectric substrate, and the silicon oxide film contains hydrogen atoms, hydroxyl groups, or silanol groups.

Abstract: An acoustic wave device includes a laminated film on a support substrate and inside a portion of an outer edge of the support substrate in plan view and including a piezoelectric thin film, an IDT electrode on the laminated film, an insulating layer on the support substrate and the laminated film and extending from a region above the support substrate to a region above the laminated film, a connecting electrode on the insulating layer and electrically connected to the IDT electrode, and an external connection terminal electrically connected to the connecting electrode and disposed directly on or above the connecting electrode and outside a region where the laminated film is on the support substrate. A principal surface of the support substrate on the laminated film side includes a recess at an outer edge of the laminated film, and the recess is covered with the insulating layer.

Abstract: An elastic wave device manufacturing method includes a preparing a piezoelectric wafer on which IDT electrodes are provided in elastic wave device forming portions, providing on a first main surface of the piezoelectric wafer support layers in the elastic wave device forming portions, bonding a cover member to cover the support layers to obtain a multilayer body, cutting the multilayer body in a first direction multiple times, cutting the multilayer body in a second direction orthogonal to the first direction to obtain elastic wave devices, in which a resin layer extends across a boundary between the elastic wave device forming portions adjacent to each other on the first main surface of the piezoelectric wafer, and the second cutting step is performed in a state in which the resin layer is present.

Abstract: An operational amplifier includes a first differential input pair, a first switch and a second switch. The first differential input pair includes a first input transistor and a second input transistor. The first input transistor has a gate terminal coupled to an output terminal of the operational amplifier. The second input transistor has a gate terminal. The first switch is coupled between the gate terminal of the first input transistor and the gate terminal of the second input transistor. The second switch is coupled between a first input terminal of the operational amplifier and the gate terminal of the second input transistor.

Abstract: A waveguide filter having a core including an external face and internal faces defining a channel for filtering and guiding the waves. The channel includes several slots, each having a first and a second face. The first face is inclined in relation to the second face. A method for manufacturing the waveguide filter.

Abstract: A signal gain determination circuit including a digital comparator, a digital controller and an arithmetic module, and a signal gain determination method are provided. A sensing integration circuit generates a first count during a first integration time according to a first sensing signal. The digital comparator compares the first count and a predetermined count to generate a comparison result. The digital controller generates a control signal for indicating a signal gain to a signal amplifier of the sensing integration circuit according to the comparison result. The signal amplifier adjusts the first sensing signal according to the signal gain to generate a second sensing signal, so that the sensing integration circuit generates a second count corresponding to the second sensing signal during a second integration time. The arithmetic module generates an output count corresponding to the first sensing signal according to the second count and the signal gain.