Abstract: An electronic device includes an error correction circuit configured to detect an error included in internal data, to generate a failure detection signal during a read operation, and to correct the error included in the internal data during a refresh operation, and a core circuit configured to store an address signal for activating a word line in which the internal data including the error is stored through as a failure address signal when the failure detection signal is input to the core circuit, and store the error-corrected internal data in the core circuit through a word line activated by the failure address signal during the refresh operation.

Abstract: A non-volatile storage device includes a memory that stores data in a non-volatile manner, a power supply that generates an internal voltage to feed it to the memory, a controller that controls the memory and the power supply, an A/D converter that performs A/D conversion on the internal voltage, and a fault detector that detects a fault related to data written in the memory based on the output of the A/D converter.

Abstract: A memory array comprising strings of memory cells comprises a conductor tier comprising conductor material. The memory array comprises laterally-spaced memory blocks individually comprising a vertical stack comprising alternating insulative tiers and conductive tiers directly above the conductor tier. Conducting material of a lowest of the conductive tiers is directly against the conductor material of the conductor tier. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers. Intervening material is laterally-between and longitudinally-along immediately-laterally-adjacent of the memory blocks. The conducting material in the lowest conductive tier is directly against the channel material of individual of the channel-material strings. Conductive material is of different composition from that of the conducting material above and directly against the conducting material. Other embodiments, including method, are disclosed.

Abstract: A method of forming an apparatus comprises forming pillar structures extending from a base material. Upper portions of the pillar structures may exhibit a lateral width that is relatively greater than a lateral width of lower portions of the pillar structures. The method also comprises forming access lines laterally adjacent to the lower portions of the pillar structures and forming digit lines above upper surfaces of the pillar structures. Memory devices and electronic systems are also described.

Abstract: A semiconductor device includes a memory core circuit configured to generate core data from bank data outputted by a bank or generate the core data from a dummy column address based on a read operation for the bank. The semiconductor device also includes a data control circuit configured to generate a switching signal from a bank active signal or a dummy bank address based on the read operation for the bank and and configured to control the output of the core data based on the switching signal.

Abstract: A semiconductor device includes: a memory circuit having a plurality of quadrants arranged at corners of the memory circuit and surrounding a bank control component; wherein a first quadrant of the plurality of quadrants includes a first bit cell core and a first set of input output circuits configured to access the first bit cell core, the first quadrant defined by a rectangular boundary that encloses portions of two perpendicular edges of the memory circuit; wherein a second quadrant of the plurality of quadrants includes a second bit cell core and a second set of input output circuits configured to access the second bit cell core, the second quadrant being adjacent the first quadrant, wherein a border between the first quadrant and the second quadrant defines a first axis about which the first quadrant and the second quadrant are symmetrical.

Abstract: Provided herein is a memory device and a method of operating the memory device. The memory device includes a memory cell array including a plurality of memory cells, a peripheral circuit configured to perform a program operation for storing data in selected memory cells among the plurality of memory cells, and a control logic circuit configured to control the peripheral circuit to form threshold voltage distributions corresponding to target program states corresponding to the data to be stored in the selected memory cells, respectively, wherein the control logic controls the peripheral circuit to perform a main verify operation for any one of the target program states of the selected memory cells when a pre-verify operation for the any one of the target program states has passed.

Abstract: Methods, systems, and devices for techniques to mitigate asymmetric long delay stress are described. A memory device may activate a memory cell during a first phase of an access operation cycle. The memory device may write a first state or a second state to the memory cell during the first phase of the access operation cycle. The memory device may maintain the first state or the second state during a second phase of the access operation cycle after the first phase of the access operation cycle. The memory device may write, during a third phase of the access operation cycle after the second phase of the access operation cycle, the second state to the memory cell. The memory device may precharge the memory cell during the third phase of the access operation cycle based on writing the second state to the memory cell.

Abstract: A method for performing an erase operation of a partially programmed memory block of a non-volatile memory structure. The method comprises: (1) applying an erase voltage bias level to a channel region of the memory block, (2) applying a word line voltage level to all programmed word line(s) of the memory block, (3) applying a “float” condition to all unprogrammed word line(s) of the memory block, and (4) applying an erase verify operation to all word line(s) of the memory block, wherein the “float” condition comprises omitting application of the word line voltage to the unprogrammed word line(s).

Abstract: A system includes: a high bandwidth memory (HBM) including a first sensing unit configured to generate one or more first environmental signals corresponding to a first transistor in a first memory cell, and a second sensing unit configured to generate one or more second environmental signals corresponding to a second transistor in a second memory cell; and a differentiated dynamic voltage and frequency scaling (DDVFS) device configured to perform the following (1) for a first set of the memory cells which includes the first memory cell, controlling temperature by adjusting one or more first transistor-temperature-affecting (TTA) parameters of the first set based on the one or more first environmental signals, and (2) for a second set of the memory cells which includes the second memory cell, controlling temperature by adjusting one or more second TTA parameters of the second set based on the one or more second environmental signals.

Abstract: A semiconductor device may include: a first receiver configured to receive a chip select signal from a receiving node to which a termination resistor is coupled and configured to generate a first internal chip select signal; a command pulse generation circuit configured to generate a command pulse for entering into a self-refresh operation based on an internal command address and the first internal chip select signal; and an operation control circuit configured to, when the semiconductor device enters the self-refresh operation based on the command pulse, generate a resistor value change signal that adjusts the value of the termination resistor.

Abstract: An integrated circuit is provided. The integrated circuit includes: a first data line group, including a plurality of local data lines arranged in an array; a second data line group, including a plurality of complementary local data lines arranged in an array, the plurality of complementary local data lines and the plurality of local data lines respectively transmitting signals having opposite phases; and a plurality of read circuits, configured to read, in response to a read control signal, signals of the local data lines or the complementary local data lines during a read operation, each of the plurality of read circuits being electrically connected to a local data line at a boundary of the first data line group or connected to a complementary local data line at a boundary of the second data line group.

Abstract: Apparatuses for controlling power supply to sense amplifiers are described. An example apparatus includes a bank. The bank includes: a first plurality of memory cells; a second plurality of memory cells; first sense amplifiers coupled to the first plurality of memory cells; second sense amplifiers coupled to the second plurality of memory cells; a first power control circuit and a coupled to the first sense amplifiers at a common power supply node; and a second power control circuit coupled to the second sense amplifiers at the common power supply node. The first and second power control circuits receive a plurality of control signals. The first and second power control circuits comprise first and second drive strengths respectively responsive to activation of a control signal of the plurality of control signals. The first drive strength and the second drive strength are different from each other.

Abstract: A memory apparatus and method of operation are provided. The memory apparatus includes memory cells configured to retain a threshold voltage. The memory cells are connected to one of a plurality of word lines and are arranged in strings comprising a plurality of blocks. A control means is coupled to the plurality of word lines and the strings and is configured to periodically determine a read frequency metric associated with a plurality of read operations of one of the plurality of blocks of the memory cells. The control means is also configured to relocate data of the one of the plurality of blocks and cause the one of the plurality of blocks to remain unused for a predetermined relaxation time based on the read frequency metric.

Abstract: A three dimensional non-volatile memory structure includes word lines connected to non-volatile memory cells arranged in blocks. A plurality of word line switches are connected to the word lines and one or more sources of voltage. The word line switches are arranged in groups of X word line switches such that each group of X word line switches is positioned in a line under Y blocks of non-volatile memory cells and has a length that is equal to the width of the Y blocks of non-volatile memory cells, where X>Y.

Abstract: A flat field transistor (FFT) based dynamic random-access memory (DRAM) (FFT-DRAM) is disclosed. The FFT-DRAM comprises an epitaxially grown source region comprising a source extension and an epitaxial source over and in contact with the source extension. The epitaxially grown source region is over a surface of a semiconductor substrate. The FFT-DRAM further comprises a trench capacitor structurally integrated into the epitaxially grown source region. The trench capacitor has a first terminal formed by the epitaxially grown source region and a second terminal being a conductive material filling one or more trenches of the trench capacitor. The second terminal is connected to a ground terminal or a fixed voltage terminal.

Abstract: A circuit for testing a memory and a test method thereof are provided. According to the circuit for testing a memory provided by the present disclosure, a switch control circuit is connected between a discharge end and a negative bias signal end of a Sub Wordline Drive (SWD) and configured to input a trigger signal, so that potential of a Word Line (WL) signal end in a to-be-tested circuit meets a preset potential suspension range. Then, it is determined whether there is leakage behavior between the WL signal end and a Bit Line (BL) signal end in the to-be-tested circuit by detecting whether the present level state of a stored signal in the to-be-tested circuit is consistent with an initial level state. The to-be-tested circuit is a corresponding circuit in a single memory.

Abstract: An anti-fuse memory unit circuit, an array circuit and a reading and writing method are disclosed. The advantages of the device and method include: 1. the anti-fuse memory cell circuit is a pure combinational circuit, compared to time sequence circuit, after a delay of a certain time, this disclosed device closes all paths and stops the logic action of entire circuit, thus lowering the static power consumption to approximately 0; 2. this circuit constituted two positive feedback loops through the design of a switch and a logic calculation module, which enables its readout circuit to read “0” or “1” more reliably; 3. this circuit can eliminate a complicated timing sequence control part, even output the anti-fuse codes directly without latching the readout circuit output OUTA/OUTB; 4. this circuit layout is flexible.

Abstract: Methods, systems, and devices for a cross-point pillar architecture for memory arrays are described. Multiple selector devices may be configured to access or activate a pillar within a memory array, where the selector devices may each be or include a chalcogenide material. A pillar access line may be coupled with multiple selector devices, where each selector device may correspond to a pillar associated with the pillar access line. Pillar access lines on top and bottom of the pillars of the memory array may be aligned in a square or rectangle formation, or in a hexagonal formation. Pillars and corresponding selector devices on top and bottom of the pillars may be located at overlapping portions of the pillar access lines, thereby forming a cross point architecture for pillar selection or activation. The selector devices may act in pairs to select or activate a pillar upon application of a respective selection voltage.

Abstract: Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to provide row clear features. In some embodiments, the memory device may receive a command from a host device directed to a row of a memory array included in the memory device. The memory device may determine that the command is directed to two or more columns associated with the row, where each column is coupled with a group of memory cells. The memory device may activate the row to write the two or more columns using a set of predetermined data stored in a register of the memory device. Subsequently, the memory device may deactivate the word line based on writing the set of predetermined data to the two or more columns.