Patents Examined by Hung Bui
  • Patent number: 7061775
    Abstract: EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: June 13, 2006
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Bruce C. Beihoff, Dennis L. Kehl, Lee A. Gettelfinger, Steven C. Kaishian, Mark G. Phillips, Lawrence D. Radosevich
  • Patent number: 6940711
    Abstract: An electronic energy meter and its package is described in which the meter package has a reduced number of parts, and the main circuit board assembly has the metering electronics on board, thereby eliminating the need for flying leads and point-to-point wiring within the package. The energy meter includes a first enclosure portion, a circuit board assembly for performing metering functions, a partial terminal block, and a second enclosure portion. The first and second enclosure portions are mateable with each other to form a meter package, in which the circuit board assembly and partial terminal block are at least partially contained within the meter package.
    Type: Grant
    Filed: August 28, 2002
    Date of Patent: September 6, 2005
    Assignee: Elster Electricity, LLC
    Inventors: Peter W. Heuell, Garry M. Loy, Russell C. Broome, Lars Anders Lindqvist
  • Patent number: 6839239
    Abstract: The present invention discloses a large form factor media enclosure structure configured to removably retain a smaller form factor device therein. The large form factor media enclosure structure includes a first flexible retainer, and a second retainer oppositely disposed from said first retainer. A catch paw is disposed along the first retainer, for frictionally engaging the smaller form factor device.
    Type: Grant
    Filed: July 17, 2002
    Date of Patent: January 4, 2005
    Assignee: 3Com Corporation
    Inventor: Seang Wee Lee
  • Patent number: 6839240
    Abstract: A housing for electronic control devices in motor vehicles comprises a generally parallelepipedal frame of plastics and a metallic envelope with spaced parallel top and bottom walls interconnected by parallel side walls and at least one open face. The top, bottom and side walls define a space and the frame is fitted into such space. The control device includes a printed circuit board and electronic components connected to the printed circuit board and engaged in shaped holding structures of the frame. The printed circuit board is located between the bottom wall and the frame. The printed circuit board is rigidly connected to the metallic envelope by metallic fasteners extending from the top wall through the frame and to the printed circuit board.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: January 4, 2005
    Assignee: TRW Automotive Electronics & Components GmbH & Co. KG
    Inventors: Robert Skofljanec, Reinhard Lange
  • Patent number: 6809935
    Abstract: A new method is provided for mounting a semiconductor on the surface of a Printed Circuit Board. A layer of Elastomer is deposifed on the surface face of the PCB, this layer of Elastomer makes the PCB into a thermally compliant PCB such that the thermal mismatch between the PCB and the semiconductor die that is mounted on the PCB is sharply reduced. Openings are created in the layer of Elastomer and electrical interfaces are created such that the PCB can be connected to the semiconductor die that is mounted on the PCB.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: October 26, 2004
    Assignee: Megic Corporation
    Inventor: Jin-Yuan Lee
  • Patent number: 6807067
    Abstract: A battery-locking mechanism for securing a battery (60) having an upper end in a portable electronic device (1) includes a plurality of spring members (50) which are received in a plurality of receptacles (28) defined by a plurality of partition walls. A battery-receiving compartment (24) is defined by an upper wall (242), a lower wall (246), and a bottom (248). A plurality of apertures (2422) is defined through the upper wall. Each receptacle is located adjacent to the upper wall and is in communication with the aperture. Each spring member includes a base portion (52) and an elastic portion (54). A free end of the elastic portion extends to the aperture. A tab protrudes from the upper end of the battery, extending into the aperture when the battery is arranged into the battery-receiving compartment, and the spring element then presses against the tab of the battery. The battery is thus secured in the battery-receiving compartment of the portable electronic device.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: October 19, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: YongHeng Zhou
  • Patent number: 6804119
    Abstract: A connector, particularly suited for use in a digital camera, having electrostatic discharge features that prevent the occurrence of electrostatic discharge events. The connector comprises a printed circuit board that includes a ground contact, a power contact, and a plurality of signal contacts that are offset from an edge of the printed circuit board. A row of vias are disposed between the signal contacts and the edge of the printed circuit board, and adjacent opposite sides of each of the signal contacts, that attract electrostatic energy before it can reach the signal contacts. The signal contacts have different lengths and shapes, depending upon their purpose. An electrostatic discharge protection method and digital camera are also disclosed.
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: October 12, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Ted Ziemkowski
  • Patent number: 6804121
    Abstract: A housing for biometric sensor chips and a method for producing such a housing includes a freely accessible fingerprint checking area on a sensor chip, a mount substrate with contact outer surfaces thereon, the mount substrate being a mounting strip with perforated edges, on which the contact outer surfaces are disposed partially outside a housing frame, and the sensor chip is positioned within the housing frame.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: October 12, 2004
    Assignee: Infineon Technologies AG
    Inventors: Reinhard Fischbach, Manfred Fries
  • Patent number: 6798668
    Abstract: In a receiving apparatus according to the present invention, a shield plate, which is made of metal, is mounted above IF amplifiers and output terminal mounting parts of a circuit substrate, thereby decreasing adverse effects caused by a back lid with unstable earthing. This produces a stable earthing condition, and further, changes a condition where signals are reflected in a space produced in the apparatus, resulting in the improvement of its isolation characteristic.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: September 28, 2004
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masato Kozaki
  • Patent number: 6785145
    Abstract: A duct, for channeling air from outside of a personal computer (PC) to cool a processor (CPU) of the PC, has a hollow body. This body comprises spaced apart sidewalls connected by an inner wall and an outer wall. In a lower section of the outer wall is an intake opening prepared to align with vent openings in an enclosure of the PC. As the walls of the body lower section extend upward, the side walls pinch inward to form a narrow top end. This narrow top end then connects with a narrow bottom end of an upper section of the body. The inner wall of the upper section arches inward while the outer wall flares upward. Inner end edges of the upper section walls define an outlet opening prepared to fit next to the processor. During operation, an intake fan of the CPU draws air through the duct that then discharges directly on the processor. This air flow may be enchanced by another fan unit carried in the duct upper section.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: August 31, 2004
    Inventor: Sidney S. Wong
  • Patent number: 6771513
    Abstract: The specification discloses a controller housing that utilizes card guides that may be installed and removed without the use of tools. Various arrangements of the controller housing with and without the card guides allows for the controller housing to accept electronic circuit cards of varying sizes. Thus, if a manufacturer desires to increase the number of points on an input/output card, for example, those additional points need not necessarily be contained in a card having the same form factor. Instead, the manufacturer may provide a larger form factor card and that card may be inserted into the controller housing by appropriately adjusting the location of the card guide within the particular opening into which the new card is to be inserted.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: August 3, 2004
    Assignee: Daniel Measurement and Control, Inc.
    Inventors: Brian P. LaMothe, Irvin J. Schwartzenburg, Richard J. Vanderah, Oliver J. Olivero
  • Patent number: 6768643
    Abstract: Methods and apparatus for preventing the accidental or premature decoupling of an electrical connection, the electrical connection having two electrical connectors which can be coupled and decoupled. The invention includes a securing apparatus configured to secure the coupling of a first electrical connector to a compatible second electrical connector. The apparatus includes a moveable securing member. The moveable securing member is configured to be moved from a first position which prevents the first and second electrical connectors from being decoupled, to a second position which allows the first and second electrical connectors to be decoupled. The apparatus further includes an actuator configured to move the securing member between the first and second positions. The actuator is responsive to an authorization command, so that a user or a controller can cause the securing member to be moved. The securing apparatus can be further provided with a securing member sensor.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: July 27, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert A. Rust, Thomas W. Ives
  • Patent number: 6765807
    Abstract: An apparatus is provided for reducing or eliminating a gap defined between adjacent components of an electronic system, thereby reducing electromagnetic interference generated by the electronic system. The apparatus includes a cam having a cam surface positionable adjacent a component of the electronic system. The cam is moveable to an actuated position in which the cam surface applies a force to the component. The apparatus further includes a support mountable to the electronic system. The support engages the cam and facilitates the movement of the cam. The movement of the cam with respect to the support and into the actuated position causes the cam surface to apply the force to the component, thereby reducing or eliminating a gap between the component and an adjacent component of the electronic system.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: July 20, 2004
    Assignee: Unisys Corporation
    Inventors: Kenneth J. Neeld, Terry W. Louth
  • Patent number: 6765800
    Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: July 20, 2004
    Assignee: Rambus Inc.
    Inventors: Belgacem Haba, Richard E. Perego, David Nguyen, Billy W. Garrett, Jr., Ely Tsern, Craig E. Hampel, Wai-Yeung Yip
  • Patent number: 6765792
    Abstract: A docking station that accepts a portable computing device is disclosed. The docking station comprises a first surface that supports a bottom surface of the portable computing device. The first surface includes a means for restricting the movement of the portable computing device. The docking station additionally includes a body or a trunk that interfaces the portable computing device with an external device. The docking station additionally includes a hinge which joins the first surface to the body or trunk, in which the hinge permits the portable computing device to be rotated between a horizontal and a vertical orientation as well as various acute angles.
    Type: Grant
    Filed: May 5, 2003
    Date of Patent: July 20, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Memphis Zhihong Yin, Glen A Oross
  • Patent number: 6762942
    Abstract: Two substrate leaves are coupled by a folded flexible circuit medium. Integrated circuit components can be mounted to opposite faces of both leaves. A signal terminal projects from one of the leaves. Both leaves include paths for communicating signals between their respective components and the terminal. Preferably the leaves are formed by two outer, rigid substrates each laminarly affixed to a respcective inner substrate, the inner substrates being separate sections of the folded circuit medium and the outer substrates being separated sections of a rigid circuit medium. Components are mounted to the exposed faces of the substrates. The fold includes paths for communicating signals between the leaf distal from the terminal and the terminal, the signal paths between one leaf and the terminal being closely matched in length and impedance to corresponding paths between the other leaf and the terminal.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: July 13, 2004
    Inventor: Gary W. Smith
  • Patent number: 6760230
    Abstract: A power feedforward amplifier uses integral cavities to provide RF isolation between subcircuits of the power amplifier. The chassis includes a main chassis body and a lid structure adapted to couple with the chassis body and define the subcircuit cavities. The inner lid includes an amplifier dividing wall and interstage walls adapted to isolate the main and error amplifier subcircuits of the feedforward power amplifier and further to isolate individual components of the subcircuits. In one embodiment, the amplifier subcircuits are mounted on a single circuit board and isolated from each other by the dividing wall. A delay line subcircuit portion is integral with the main chassis body and is coupled beneath the error amplifier subcircuit to contain and electromagnetically shield a delay line filter subcircuit while providing direct connection with the error amplifier.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: July 6, 2004
    Assignee: Andrew Corporation
    Inventors: Robert W. Kooker, Paul E. White, Thomas A. Bachman, II
  • Patent number: 6760229
    Abstract: A system having a removable protective enclosure for an electronic component. The protective enclosure may have a base and a circuit board that may be captured by the base without use of a tool or a separate fastener. A memory module may be disposed on the circuit board. The protective enclosure may be adapted to be mechanically and electrically coupleable to an enclosure.
    Type: Grant
    Filed: September 9, 2002
    Date of Patent: July 6, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brett D. Roscoe, George D. Megason, Christian H. Post
  • Patent number: 6757176
    Abstract: This invention relates to circuit boards and methods of fabricating circuit boards. A circuit board includes a core layer and a surface layer. The core layer includes a number of fibers and the surface layer has a thickness that is between about 10% and about 30% of the circuit board thickness. Including fibers in the core layer increases the strength of the circuit board. The surface layer is essentially free of fibers and relatively thick. The thickness of the surface layer inhibits the formation of cracks in the circuit board, which improves the reliability of circuits and systems coupled to the circuit board.
    Type: Grant
    Filed: August 22, 2000
    Date of Patent: June 29, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Yong Du
  • Patent number: 6754085
    Abstract: A mounting apparatus having first and second blocks securable within a housing. The first block has first and second grooves for respectively receiving a first edge of a first circuit board and a first edge of a second circuit board such that the first and second circuit boards are aligned with each other and are spaced apart. The second block has a groove for receiving a second edge of the first circuit board that is perpendicular to the first edge of the first circuit board and a surface to which the second circuit board is attached adjacent a second edge of the second circuit board that is perpendicular to the first edge of the second circuit board.
    Type: Grant
    Filed: November 1, 2001
    Date of Patent: June 22, 2004
    Assignee: ADC Broadband Access Systems, Inc.
    Inventor: Peter R. Kalkbrenner