Patents Examined by Hung Bui
  • Patent number: 6657871
    Abstract: Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
    Type: Grant
    Filed: June 20, 2002
    Date of Patent: December 2, 2003
    Assignee: Rambus Inc.
    Inventors: Donald V. Perino, Belgacem Haba, Sayeh Khalili
  • Patent number: 6654254
    Abstract: A printed circuit board assembly includes a printed circuit board (10), a retention module (20) mounted on the printed circuit board, and a back plate (30) attached to an underside of the printed circuit board opposite the retention module. The printed circuit board defines a plurality of through holes (16). The retention module defines a plurality of countersunk holes (25) therein, corresponding to the through holes of the printed circuit board. The back plate includes a base (32), and a plurality of latching posts (34) extending upwardly from the base. The latching posts extend through the through holes of the printed circuit board and engage in the countersunk holes of the retention module, thereby fixing the retention module to the printed circuit board. A plurality of fasteners (40) engages in the latching posts, thereby facilitating resilient engagement of the latching posts in the countersunk holes of the retention module.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: November 25, 2003
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming-Lun Szu, Sen-Jong Chen
  • Patent number: 6650546
    Abstract: A chip component assembly is provided that includes a plurality of chip components each having respective first and second terminal elements, the first terminal elements being joined to corresponding solder pads on a printed circuit board, the solder pads being in communication with electronic circuitry of the printed circuit board, and the second terminal elements being joined together by an array ground plane of a grounding device. The grounding device additionally includes a ground path structure which physically and electrically connects the array ground plane, and thus the chip components, to a ground pad located on the printed circuit board so as to provide a ground path from the chip components. Preferably, the array ground plane additionally includes a plurality of resilient contact elements which provide for substantial and continuous contact between the array ground plane and an ancillary ground plane, such as the top cover of a PC card.
    Type: Grant
    Filed: February 27, 2001
    Date of Patent: November 18, 2003
    Assignee: 3Com Corporation
    Inventors: Jon A. Nelson, Rick Giles, David Oliphant
  • Patent number: 6650547
    Abstract: The present invention provides a space-saving rotary structure for relaying signals which can relay a large number of signal lines without causing a disconnection of the signal lines. The rotary structure for relaying signals comprising a fixed frame which is supported and fixed in the inside of first and second casings, a rotary sleeve which is rotatably inserted into a through hole of the fixed frame and has a distal end thereof projected to the outside of the first and the second casing, a rotary frame which is arranged outside the first and second casings and is fixed to the distal end of the rotary sleeve such that the rotary frame is integrally rotatable with the rotary sleeve, and a flexible printed wiring film which has a distal end thereof pulled out to the outside of the first and second casings along the rotary sleeve and is wound around a winding tongue of the rotary sleeve which is positioned in the inside of the first and the second casings.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: November 18, 2003
    Assignee: Omron Corporation
    Inventors: Yoshinobu Hemmi, Tsuyoshi Uchida, Satoshi Takamori
  • Patent number: 6650549
    Abstract: A hub includes a bluetooth system module coupled to a hub module. The hub module is also coupled to an upstream port and a plurality of downstream ports provided on a housing of the hub respectively enabling the hub to connect to an electronic device via the upstream port and to connect to a plurality of peripherals via the downstream ports for performing a wireless signal communication therebetween, thereby reducing the number of cables connected between the electronic device and peripherals.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: November 18, 2003
    Assignee: D-Link Corp.
    Inventor: Wen-Hao Chiao
  • Patent number: 6646888
    Abstract: According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: November 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Manfred Cwik, Harald Pross, Rene Frank Schrottenholzer
  • Patent number: 6646890
    Abstract: Mezzanine boards can be added to and removed from a supporting base board mounted in a slot of a shelf adjacent other base boards while the base boards remain in electrical service. Guide rails allow a mezzanine board to be slid into position from the front edge of the base board. The guide rails themselves can be moved to provide a new spacing to accommodate a different width mezzanine board without having to take the supporting base board out of service. Openings in the sides of the guide rails promote the flow of air between the mezzanine board and the base board to provide cooling.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: November 11, 2003
    Assignee: Lucent Technologies Inc.
    Inventors: Charles Calvin Byers, Todd Keaffaber, Andrew F. Scott
  • Patent number: 6646884
    Abstract: The power substrate is inserted in a housing (1) as base plate and together with the same forms a standardized power part from whose top side (11) there are projecting terminal pins (5) which are soldered by through-soldering to via holes of the board (4). The circuit board (4), in a strip portion (6) thereof that remains free, has contact pads (7) as control and power terminals by means of which the module can be soldered directly into the slot-like opening of a system circuit board (8).
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: November 11, 2003
    Assignee: Tyco Electronics Logistics AG
    Inventors: Michael Frisch, Bernd Winkens
  • Patent number: 6646893
    Abstract: A system and method for supporting at least one electrical cable is provided. The at least one electrical cable may be secured to a movable electronic device disposed within a chassis. A harness is provided that is securable to at least one electrical cable. A flexible support member is provided to support the harness and the at least one electrical cable. The flexible support member may move with the electrical device as the electrical device is moved. The flexible support member may comprise wire. A wire reel may be provided to extend and retract the wire. The wire of the wire reel may be unwound as the electrical device is moved from a normal position to a withdrawn position. The wire of the wire reel may be wound as the electronic device is moved from the withdrawn position to the normal position.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: November 11, 2003
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thomas T. Hardt, Allison R. McGrew
  • Patent number: 6643143
    Abstract: A circuit board assembly that includes a circuit board and a bracket. The bracket has a first flange, a second flange, and a third flange. The first flange and the second flange are coupled to the circuit board. The circuit board assembly also includes a switch mounting board. The switch mounting board is coupled to the third flange of the bracket. The circuit board assembly also includes a first switch and a second switch, which are coupled to the switch mounting board. The circuit board assembly further includes a connector that is coupled to the circuit board. At least a first portion of the connector is positioned between the circuit board and the first switch. At least a second portion of the connector is positioned between the circuit board and the second switch.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: November 4, 2003
    Assignee: Sun Microsystems, Inc.
    Inventors: Thomas E. Stewart, Robert J. Lajara, Timothy W. Olesiewicz
  • Patent number: 6643142
    Abstract: A module (1) for contactless communication includes a plurality of electrical components (4, 5, 6, 7, 8) which each have at least two contact faces (9, 10, 11, 12, 13, 14, 15, 16) for the electrical connection. The electrical components (4, 5, 6, 7, 8) of the module are mounted both on a component side (MB) and an on adhesive side (MK) of a lead frame (M) formed by metal strips (MS). During the manufacture of the module (1) the metal strips (MS) of the lead frame (M) are held in one plane (E) and in position by means of an adhesive tape (K). The adhesive tape (K) has openings (A1, A2, A3, A4, A5, A6) at given positions of the lead frame (M) so as to enable electrical components to be mounted on the adhesive side (MK) of the lead frame (M).
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: November 4, 2003
    Assignee: Koninklijke Philips Electronics N.V.
    Inventors: Gunter Aflenzer, Joachim Heinz Schober, Marcus Toth
  • Patent number: 6639808
    Abstract: A card guide system is provided. The card guide system comprises a chassis having a top and a bottom frame portion. The top and bottom frame portions each include a plurality of card guide members disposed thereon. The card guide members of the top frame portion are a mirror image of the card guide members of the bottom frame portion. In addition, the plurality of card guide members are adapted to receive a circuit card and secure the circuit card using tension, wherein when the circuit is received by the card guide members the circuit card is bowed.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: October 28, 2003
    Assignee: ADC Telecommunications, Inc.
    Inventor: Philip G. Umberger
  • Patent number: 6639805
    Abstract: A casing for a PC cartridge includes an upper casing having clamping sides respectively formed on opposite sides of the upper casing, two hooks respectively and oppositely formed on a front side of the upper casing, a lower casing securely connected to the upper casing and having a plastic frame with a tilting side formed on opposite sides of the frame, a pair of front positioning blocks oppositely formed on a front side of the frame and a pair of rear positioning blocks oppositely formed on a rear side of the frame, wherein each of the front positioning blocks has an L shaped hole corresponding to the hooks of the upper casing. Each clamping side clamping a bottom of a corresponding one of the tilting sides and the hooks being received in the L shaped holes secure engagement between the upper casing and the lower casing.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: October 28, 2003
    Inventor: Wan-Tien Chen
  • Patent number: 6636429
    Abstract: A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference (“EMI”). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.
    Type: Grant
    Filed: September 20, 2001
    Date of Patent: October 21, 2003
    Assignee: Ballard Power Systems Corporation
    Inventors: Douglas Maly, Sayeed Ahmed, Scott Parkhill, Fred Flett
  • Patent number: 6628530
    Abstract: A shielded case includes a plurality of walls. At least one of the walls is formed by at least first and second separate sections which abut one another along an interface. A depression is formed in at least one of the first and second sections so as to cause at least one of said sections to expand toward the other of section thereby pressure-welding said first and second sections to one another along at least part of said interface.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: September 30, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Tadashi Takaya
  • Patent number: 6625033
    Abstract: A rack-mountable system enclosure for limiting the escape of internally generated electromagnetic interference includes a system case, a front panel, a back panel, overlapped seams formed to couple the front panel and the back panel to the system case such that no gaskets and a minimal number of fasteners including welds, screws and rivets are required, at least one front opening through which communication media passes and apertures formed within the system case for providing air inlet and egress ports.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: September 23, 2003
    Assignee: White Rock Networks
    Inventor: Joseph Steinman
  • Patent number: 6625041
    Abstract: The present invention discloses an expansion card fixture for fixing the expansion card using in a network to a socket on a printed circuit board, which comprises a first plate, a second plate, a supporting member, at least one blocking plate and at least two side plates, where one end of the second plate connects to the bottom of the first plate, and thus the second plate directs to the first plate at an angle. The deformed structure constituted of the first plate and the second plate can recover to its original shape. One end of the supporting member connects to the middle of the first plate to support the expansion card. The blocking plate comprises an edge plate and a top hook, in which the edge plate whose bottom connects to the top of the first plate is perpendicular to the second plate to prevent longitudinal movement of the expansion card.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: September 23, 2003
    Assignee: Accton Technology Corporation
    Inventor: Sheng-Chung Chen
  • Patent number: 6625039
    Abstract: An electromagnetic shield system for cartridge-based printed circuit cards inserted into a printed circuit mother board comprises a card level system and a board level system which are electrically connected upon card insertion to provide more effective EMI shielding system. Prongs on a card level tab provide continuous EMI shielding even as card insertion operations are taking place. The principal linkage between the card level and board level systems is provided by a flexible shield strip which mates with apertures in a conductive board stiffener and simultaneously contacts not only a conductive cartridge bezel, but also contacts an EMI shield plate disposed on the printed circuit card.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: September 23, 2003
    Assignee: International Business Machines Corporation
    Inventors: Dennis R. Barringer, Harold M. Toffler
  • Patent number: 6625035
    Abstract: A latch assembly for removably attaching a motherboard within an enclosure and for removably attaching a co-planar daughter board to the motherboard includes a first latch that is pivotally attached to the motherboard and a first latch actuator, wherein in an engaged position, the first latch extractor engages a first extraction surface of the enclosure. The assembly further includes a second latch that is pivotally attached to the daughter board, the second latch having a second latch extractor and a second latch actuator, wherein in the engaged position, the second latch extractor engages a second extraction surface of the motherboard. The first latch and the second latch pivot in adjacent planes. The second latch, however, may be disengaged to remove the daughter board from the motherboard without disengaging the first latch.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: September 23, 2003
    Assignee: White Rock Networks
    Inventors: Joseph Steinman, Greg Lowe
  • Patent number: 6621714
    Abstract: An apparatus and method for retaining a length of fiber optic cable to a circuit board includes a body portion. The body portion of the apparatus includes at least a pair of spaced legs extending from the body portion, each of the legs is adapted to be received in a mounting opening formed in the PC board. Each of the spaced legs includes a foot portion adapted for securing the body to the circuit board and at least a pair of spaced arms extend from the body portion defining a slot between the arm and the body portion for receiving and retaining a portion of the length of fiber optic cable. The arms are spaced a distance from each other for retaining the fiber optic cable in an arc having a radius greater than a minimum bend radius of the fiber optic cable.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: September 16, 2003
    Assignee: 3Com Corporation
    Inventors: Hong Li, Kenneth S. Laughlin, Craig G. Mitchell, Thomas C. Ruberto