Abstract: A shield and a method for shielding are provided for preventing radio frequency energy from entering or exiting an electronic device. The shield includes a frame surrounding the electronic device. The frame has a first frame wall and a second frame wall arranged with a first gap in between that extends along the first frame wall. The first frame wall is arranged in a first plane, the second frame wall is arranged in a second plane, and the first plane intersects the second plane. The shield also includes a cover surrounding the frame. The cover has a first cover wall and a second cover wall arranged with a second gap in between that extends along the second cover wall. The arrangements of the first gap and the second gap prevent radio frequency energy from entering or escaping the electronic device.

Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.

Abstract: A combination device of the IC package connection device and the main board comprises a socket and a main board. The socket has a holding assembly which is placed on the top surface of the socket. The holding assembly connects to the external IC package electrically and the socket has a plurality of solder balls. The solder balls are placed on the bottom surface of the socket and connect to the holding assembly electrically. The socket is stable on the top surface of the main board and connects to the main board electrically. The positions of a plurality of PTHs in the main board are corresponding to the plurality of solder balls. The totally melting temperature of the solder balls is higher than that in prior art in order to make the solder balls be in controllable semi-solid state in solder reflow step.

Abstract: Surface applied passive devices for use on electronic circuit boards are formed by applying layers of conductive, insulating, and other material to a thin polymer film carrier. The surface applied passives are thin enough to fit underneath standard integrated circuit packages in order to conserve space on the circuit board. Resistors, capacitors, inductors and other passive circuits may be formed on thin polymer films, less than 8 mils thick. This significantly aids in conserving space on an electronic circuit board.

Abstract: There is disclosed a junction box including a junction box main body, a connector portion, and a cable portion which connects the junction box main body to the connector portion. Terminal connecting portions are formed to extend from opposite side edges of a strip portion of a flexible printed circuit constituting the cable portion in a short direction of the strip portion, and are connected to first to third connecting terminals. The third connecting terminal is connected to a desired connecting terminal connecting portion of a circuit distribution wiring circuit of a joint connector, electricity is conducted through a plurality of circuit portions in a desired circuit mode, and a wiring design freedom degree is enhanced.

Abstract: A butt joined electronic module has first and second coplanar transmission structures that are independently aligned in a proximate abutting relationship. The coplanar transmission structures are formed on respective first and second electrical elements that are secured on respective independently positioned and mechanically joined carrier and housing. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors. The carrier and housing are bonded together as a single module.

Abstract: A printed circuit board (PCB) includes a first layer having first and second surfaces, with an above-board device mounted thereon. The PCB includes a second layer having third and fourth surfaces. One of the surfaces can include a recessed portion for securedly holding an interstitial component. A via, electrically connecting the PCB layers, is also coupled to a lead of the interstitial component.

Abstract: A handheld type electronic device of this invention includes two housings respectively provided with electronic system components, a rotary device, and an electrical connector electrically connecting the electronic system components in the two housings. The invention is characterized in that the rotary device has a pivoting portion disposed on one side of one of the housings to rotatably connect with the other one of the housings, and a receiving portion. The electrical connector is disposed in the receiving portion and is confined in the housing provided with the rotary device such that rotation of the pivoting portion can bring the two housings to open or close while the electrical connector remains immovable.

Abstract: A modular electronic chassis system with nested electronic plug-in modules including at least one circuit board providing a first-module-receiving-location and a second-module-receiving-location such that the system is capable of supporting modules in a nested configuration having increased packaging density. A first plug-in module detachably engaged with the first-module-receiving-location. A second plug-in module detachably engaged with the second-module-receiving-location so that the first plug-in module and the second plug-in module are nested.

Abstract: A protective circuit device (3) according to the present invention prevents overcharge to a storage battery (2). Protective circuit device (3) has a circuit board body (32) with a prescribed circuit pattern, and island portions (33, 34) having on their surfaces a plurality of external terminals (30) and connected to circuit board body (32) through a metal piece (35, 36). Island portions (33, 34) preferably includes first and second islands. First island (33) preferably has an external terminal (30) and is parallel to circuit board body (32). Second island (34) is preferably arranged between first island (33) and circuit board body (32) and is vertical to circuit board body (32).

Abstract: An enclosure for electronic circuitry includes a container that is formed to define an enclosed volume. An open end of the container is sealed by a printed circuit board which also provides electrical connection to the enclosed electronic circuitry by means of connectors mounted to its inside and outside surface.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: An electromechanical device for mounting an electronic assembly on a mounting rack, in particular for mounting a display instrument recessed in a dashboard. There is at least one conductive Velcro-type connector between the electronic assembly (6) and the mounting rack (7), the conductive Velcro-type connector serving both for the mechanical fastening and the electrical contacting of the assembly (6) on the mounting rack (7).

Abstract: Disclosed herein is an enclosure for mounting one or more electronic units to a substrate, such as a printed circuit board.

Abstract: A mounting apparatus for attaching expansion cards (60) to a computer enclosure includes a fastening member (10), a retaining bracket (30), and a rear panel (50). The fastening member includes a spring finger (12) and two opposite sidewalls (14). A pair of pivot pins (141) perpendicularly extends from outside faces of bottom ends of the sidewalls respectively, and a protrusion (143) is formed on one of the sidewalls. The retaining bracket includes a main body (34) and a pressing body (32)). A catch opening (341) and an aperture (343) are defined in the main body, for receiving the spring finger and the protrusion respectively. A support plate (54) is bent perpendicularly outwardly from the rear panel. The fastening member is pivotably attached to the retaining bracket. The main body is slidably attached to the rear panel. The expansion cards are retained between the support plate and the pressing body.

Abstract: An information-processing device comprises at least one crossbar-board; a plurality of back panels detachably connected electrically and mechanically to different sides of the crossbar-board; and at least one motherboard detachably connected electrically and mechanically to each of the back panels. The crossbar-board has a switching element mounted thereon. The motherboard has an information-processing semiconductor element mounted thereon.

Abstract: A retainer provides locking and compliance between components. In a first implementation, the retainer includes a non-compliant member and a compliant member. The non-compliant member is configured to expand in a first direction. The compliant member attaches to the non-compliant member and is configured to deflect forces applied to the non-compliant member in the first direction or a second direction opposite to the first direction. In a second implementation, the retainer includes a rail and a group of wedge segments configured to attach to the rail and expand in a first direction. At least one of the wedge segments includes an integrated spring element.

Abstract: A circuit board programming/debugging arrangement and method includes a circuit board and frame assembly and a programming/debugging device. The assembly includes a printed circuit board, a first frame section coupled to the circuit board and at least one second frame section coupled to at least one of the circuit board and the first frame section. The second frame section is movable from an operational position to a non-interfering programming/debugging position wherein the second section would interfere with coupling of the programming/debugging device to the circuit board. The programming/debugging device is coupled to the circuit board while the at least one second frame section is in the programming/debugging position.

Abstract: A two layer PBGA which includes a metal ground plane at its bottom layer. The ground plane is preferably a metal plane which is connected to ground through a metal connection to a ball pad at the center of the package and a ball pad proximate the edge of the package. The ground plane is voided around the signal and power balls, via and “dog bones”. The PBGA is configured such that the ground plane serves effectively the same function as the second layer ground plane in a conventional four layer PBGA. The PBGA provides a cheaper alternative to the generally more expensive four layer PBGA, and provides better cross talk performance (especially for high frequency signaling) as well as better thermal performance as a result of having more metal at the bottom layer of the package.

Abstract: A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semiconductor die and passive components without encapsulating the passive components within the encapsulation protecting the semiconductor die. The shield cap provides electromagnetic shielding and physical protection for the passive components and may provide thermal conduction from a semiconductor die by contacting the semiconductor die. The shield cap may be perforated to permit air circulation through the shield cap for providing improved thermal performance or may be a solid metal shield, providing improved electromagnetic shielding.