Patents Examined by Hung V. Ngo
  • Patent number: 10779396
    Abstract: A printed circuit board includes a first insulating layer having a cavity, a metal pattern including a first shielding pattern disposed on an inner wall of the cavity and a second shielding pattern spaced apart from the first shielding pattern and covering the first shielding pattern, an electronic device positioned in the cavity and surrounded by the first shielding pattern and the second shielding pattern, and a second insulating layer stacked on the first insulating layer and embedding the electronic device therein.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: September 15, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yeo-Il Park, Yong-Duk Lee, Sang-Ho Jeong
  • Patent number: 10779450
    Abstract: A thermally conductive composition is provided, which has a base material; and at least one of a permittivity adjusting filler having a lower permittivity than the base material and a high permeability filler having a higher permeability than the base material. The entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: September 15, 2020
    Assignees: Kitagawa Industries Co., Ltd., Seiko Epson Corporation
    Inventors: Toru Matsuzaki, Yasuhiro Kawaguchi, Masahiro Saito, Kensuke Mitsuya, Masaaki Ito, Toshiyuki Omori
  • Patent number: 10779395
    Abstract: An electronic assembly includes a printed circuit board (PCB) and an electromagnetic interference (EMI) shield. The PCB includes a plurality of electronic components and a plurality of electrically-conductive traces. The EMI shield is sized and shaped to form a perimeter around at least one of the plurality of electronic components on the PCB. The plurality of electrically-conductive traces cross the perimeter formed by the EMI shield. The EMI shield includes a plurality of decoupling, filtering, or matching components electrically connected between the EMI shield and the plurality of electrically-conductive traces such that the plurality of decoupling, filtering, or matching components are configured to shunt signal noise from the plurality of electrically-conductive traces. The EMI shield is electrically connected to the PCB via the plurality of decoupling, filtering, or matching components to encapsulate and electromagnetically isolate the plurality of electronic components.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 15, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Jason Allen Harrigan
  • Patent number: 10770878
    Abstract: An electric connection box includes a frame having a cylindrical outer wall, and a cover having a side wall fitted into one end in an axial direction of the outer wall. The outer wall has a plate-shaped protruded portion, and the protruded portion has a pair of side portions respectively placed at one end and the other end in a width direction. The side wall has a pair of edge portions and has a notch between the pair of edge portions. Each of the pair of edge portions has a first facing surface and a second facing surface. The first facing surface abuts on the pair of side portions in a thickness direction of the protruded portion, and the second facing surface faces the pair of side portions in the width direction and positions the cover with respect to the frame.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: September 8, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Akinori Nakashima, Kunihiko Takeuchi
  • Patent number: 10772200
    Abstract: A fabric coated with functional silicone rubber, the fabric being configured such that a coating layer may not be easily separated from the fabric and may be used to form a power line or a signal line. The fabric includes: a woven fabric made by weaving and including uniform pores therein; and a coating layer formed by coating a surface of the woven fabric with liquid silicone rubber in which electrically conductive particles larger than the pores of the woven fabric are dispersed and mixed, wherein the liquid silicone rubber permeates into the pores of the woven fabric by the weight thereof and is cured such that the silicone rubber is anchored to the woven fabric, and an electrically conductive layer having electrical conductivity is formed as the electrically conductive particles are caught on the surface of the woven fabric and increase in density at the surface of the woven fabric.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: September 8, 2020
    Assignee: WAVE COMPANY CO., LTD.
    Inventors: Na-Yun Cho, Sang-Chul Lee, Ji-Hun Han
  • Patent number: 10763646
    Abstract: A spark plug having a metal shell and an insulator, wherein a stepped portion that includes a rear-end-side facing surface that retains an insulator either directly or via another member is provided at an inner periphery of a metal shell. The stepped portion includes a first convex portion that includes the rear-end-side facing surface, a second convex portion that is disposed on a front end side of the first convex portion and that is adjacent to the first convex portion, and a connection portion that connects the first convex portion and the second convex portion to each other.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: September 1, 2020
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventor: Hiroki Shimada
  • Patent number: 10763588
    Abstract: A shield, when coupled to a tracker device that is worn by an individual, reduces interfering signals originating from the human body that can adversely impact the detection of signals transmitted by the tracker device. The shield can include multiple layers of components. Specifically, the shield includes a base component that is attached to an adhesive element on the first side of the base and covered by a removable backing. Furthermore, the base, through a second side of the base, is attached to a first non-conductive element, which is further coupled to a second non-conductive element. Each of the non-conductive elements attenuates interfering signals that originate from the human body and therefore, enables the detection of signals transmitted by the patient tracking system. For example, in view of the reduced interference signals, a RF signal transmitted by the patient tracking system can be detected at remote distances.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: September 1, 2020
    Assignee: TENX HEALTHCARE, INC.
    Inventors: Philip McCall, II, Kenneth Condren
  • Patent number: 10765046
    Abstract: Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventor: Robert Sankman
  • Patent number: 10765045
    Abstract: An EMP-protective composite structure that includes at least one enclosure having walls, a ceiling, at least one ingress/egress portal and a base, each of the walls, the ceiling, the ingress/egress portal and the base including at least one blast-resistant structural panel and at least one layer of an EMP barrier that provides magnetic conduction, field absorption and field reflection fully-enclosing the structural panel. An encapsulation barrier is provided having a blast-deflecting surface overlying the at least one enclosure. A HEMP door or circuitous path is provided from an exterior of the EMP-protective structure, through the encapsulation barrier and to the at least one ingress/egress portal of the enclosure. The circuitous path is configured to absorb and deflect EMP as the EMP passes along the circuitous path. Embodiments of the blast-resistant structural panel are also disclosed.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: September 1, 2020
    Assignee: Go Team CCR, LLC
    Inventor: Francis Norbert Hector
  • Patent number: 10763654
    Abstract: A connecting system for quickly securing a hollow tube to a structure or to another hollow tube using a connector that has a housing with a tapered interior edge that operably engages a locking element positioned therein. When the tube is inserted into the locking element, the locking element holds and locks the tube in place in the connector. A guide ring may be provided within the connector to facilitate proper alignment of the tube within the connector and provide electrical continuity throughout the entire tube connecting system. One or more bearings may be provided as part of the locking element to facilitate initial tube insertion and then compression locking of the tube by the locking element. The connector can include a variety of structure engaging portions to allow the connector to be operably secured to a variety of structures such as electrical junction boxes, electrical conduits, tubes, armored cables, metal clad cables, flexible metal cables and the like.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: September 1, 2020
    Assignee: Fortune Industries International, Inc.
    Inventor: David Hong Yeh
  • Patent number: 10757846
    Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 25, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Haejin Lee, Min Park, Jungje Bang, Kyungha Koo, Yunjeong Park
  • Patent number: 10750609
    Abstract: In a structure for mounting a shielded module on a printed wiring board, the shielded module includes a mounting substrate, a shielding layer, and a solder layer. Electronic components are mounted on a main surface of the mounting substrate. The shielding layer is provided in an area from above the mounting substrate to a side surface of the mounting substrate and covers the electronic components. The solder layer is provided on a side surface of the shielding layer. The shielding layer is connected to a surface electrode located on the printed wiring board via the solder layer. The surface of the solder layer is depressed.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 18, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Norifumi Kobayashi, Tomoyoshi Hiei
  • Patent number: 10748837
    Abstract: A heatsink assembly including a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity are configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: August 18, 2020
    Assignee: ELTA SYSTEMS LTD.
    Inventor: Michael Kedem
  • Patent number: 10741952
    Abstract: The electrical connector is equipped with a retention mechanism for securing mounting a heat sink upon a CPU which is received within an insulative housing of the connector. The retention mechanism includes a pair of seats, a pair of towers fixed to the pair of seats, respectively, a pressing device retained between the pair of towers in a deformable manner. The pressing device is intimately seated upon the heat sink to significantly press the heat sink against the CPU when the pressing device is deformed in a tensional status.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: August 11, 2020
    Assignees: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Heng-Kang Wu, Fu-Jin Peng
  • Patent number: 10727617
    Abstract: An electrical cable arrangement comprises a dimensionally stable flat conductor bar with a flat conductor shield; at least one electric cable connected thereto and having a cable shield; and a shield housing made of an aluminum material and having a first housing part and a second housing part. Between the housing parts a closed accommodating chamber is formed for a connecting section between the flat conductor bar and the cable. When in the installed state, the flat conductor bar and the cable are each clamped tight between the housing parts by an end face section in such a manner that the flat conductor shield and the cable shield are directly or indirectly interconnected for the shield transition.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: July 28, 2020
    Assignee: LISA DRAEXLMAIER Gmbh
    Inventor: Wolfgang Wimmer
  • Patent number: 10729026
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: July 28, 2020
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10729043
    Abstract: An electromagnetic effect protective cap assembly for enclosing an end portion of a fastener assembly extending through a structure, includes a sidewall configured to define an interior space and having an end portion of the sidewall which defines a first opening aligned with the interior space which allows passage of the end portion of the fastener assembly through the first opening and into the interior space. The protective cap further includes a second opening which is defined by and extends through the sidewall and is spaced apart from the first opening. In addition, the protective cap further includes a valve member positioned in blocking relationship with respect to the second opening with the valve member positioned between the interior space and an exterior of the sidewall.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: July 28, 2020
    Assignee: THE BOEING COMPANY
    Inventors: Philipp A. Boettcher, Derek R. Tuck
  • Patent number: 10729003
    Abstract: An anti-electromagnetic interference circuit board includes a circuit board and a magnetic conductor. The circuit board has a plurality of vias, and the magnetic conductor is covered on the circuit board to cover some of the vias. The magnetic conductor includes a plate, a carrier, a sprayed magnetic conductor, and a wave absorbing magnetic conductor.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: July 28, 2020
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ping-Han Tsou, Li-Chien Wan
  • Patent number: 10716202
    Abstract: The subject disclosure relates generally to a method of implementing magnetic shielding walls with specific respective dimensions to reduce crosstalk between transmission lines in wire-bonds for supercomputing chipsets. In one embodiment, the device comprises: a chip-set comprised of superconducting materials; at least one superconducting data line attached to chip-set dies by a set of wire bonds; and magnetic shielding walls that respectively isolate the set of wire bonds.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: July 14, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Salvatore Bernardo Olivadese
  • Patent number: 10714919
    Abstract: As described herein, a wall box installation tool may include a template body, one or more hollow pegs, a guide ring, and/or one or more template cards. The template cards may be configured to be installed on a front surface of the template body. A template card may define a plurality of holes therethrough. The guide ring may be configured to be installed within a pre-drilled hole in a wall. Each template card may be associated with a respective electrical device configuration. A subset of bores extending through the hollow pegs may be accessible via the template card when the template card is installed on the front surface of the template body. The wall box installation tool may include one or more fasteners that are configured to install a template card onto the front surface of the template body.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: July 14, 2020
    Assignee: Lutron Technology Company LLC
    Inventors: Gregory S. Altonen, Adam Andersen, Xavier Boudin, Michel Hanns, Eric Johnathan Mace