Patents Examined by Hung V. Ngo
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Patent number: 12262494Abstract: An electrical apparatus, including a first housing having a fluid-filled or fluid-perfused wet space and a dry space that are separated from one another by a wall, wherein the wall includes an opening, one or more power-conducting and/or power-switching elements arranged in the wet space, and a control electronics for the one or more power-switching elements arranged in the dry space. The electrical apparatus includes a second housing extending from the opening into the wet space, wherein the second housing reaches up to or encloses a power-conducting element, and a sensor arranged in the second housing, the sensor being configured to measure a variable that depends on an electrical power flowing through the power-conducting element. The second housing seals the opening in the wall in a fluid-tight manner. Measured values or signals of the sensor conducted by lines are passed through the opening into the dry space.Type: GrantFiled: October 11, 2023Date of Patent: March 25, 2025Assignee: DR. ING. H.C. F. PORSCHE AKTIENGESELLSCHAFTInventors: Sebastian Wachter, Patrick Fuchs
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Patent number: 12262520Abstract: Provided are methods of forming graphene laminate compositions and architectures. The method comprises: (i) contacting a graphene structure comprising one or more planar graphene sheets with a first interlayer material; (ii) depositing of a conductive material, where in the conductive material is deposited along an edge of the graphene and one end of the first interlayer; and (iii) contacting the graphene structure with a second interlayer material. Also provided are graphene laminates structures comprising doped graphene films having improved mechanical strength, electrical mobility and optical transparency.Type: GrantFiled: November 29, 2019Date of Patent: March 25, 2025Assignee: The Research Foundation for The State of University New YorkInventors: Matthew Eisaman, Jan Folkson, Joseph Andrade
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Patent number: 12262518Abstract: A circuit board assembly includes a circuit board, a noise source and a shielding cover. The circuit board has an upper surface, a lower surface and a plurality of grounding areas. The lower surface faces away from the upper surface, and the grounding areas are located at the lower surface. The noise source is located at the upper surface of the circuit board. The shielding cover includes a covering body and a plurality of elastic grounding arms. The covering body is in contact with the upper surface and covers the noise source. The elastic grounding arms are connected to the covering body. The elastic grounding arms are in contact with the lower surface of the circuit board and respectively in electrical contact with the grounding areas.Type: GrantFiled: August 22, 2023Date of Patent: March 25, 2025Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Yu Shu Tai, Chih-Cheng Li
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Patent number: 12262495Abstract: An electrical connection box includes an auxiliary housing of a tubular shape interposed between a first housing and a second housing in a state where a second terminal is in complete contact with a first terminal. The auxiliary housing includes a holding portion that positions and holds the first terminal with respect to the first housing and a guide portion that guides the second terminal toward the first terminal in a state where the auxiliary housing is disposed on an opening side of the first housing.Type: GrantFiled: November 29, 2023Date of Patent: March 25, 2025Assignee: YAZAKI CORPORATIONInventors: Isanori Shimizu, Arata Yagi
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Patent number: 12250801Abstract: The present invention provides an electromagnetic wave-absorbing composite material and a manufacturing method therefor, the electromagnetic wave-absorbing composite material comprising: a polymer composite including a refractive index-adjusting material therein; and a plurality of conductive wires formed on at least one surface of the polymer composite, wherein electromagnetic waves reflected in a matching frequency (f) range derived through Mathematical Formulas 1 to 3 described in the present invention are 0.2 dB or less.Type: GrantFiled: August 2, 2022Date of Patent: March 11, 2025Assignee: KOREA INSTITUTE OF MATERIALS SCIENCEInventors: Byeong Jin Park, Tae Hoon Kim, Sang Bok Lee, Byung Mun Jung, Seung Han Ryu, Yu Kyung Han, Suk Jin Kwon
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Patent number: 12250800Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.Type: GrantFiled: September 22, 2021Date of Patent: March 11, 2025Assignee: Intel CorporationInventors: Yew San Lim, Jeff Ku, Boon Ping Koh, Min Suet Lim, Tin Poay Chuah
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Patent number: 12245409Abstract: An apparatus for a light source includes: an electrical insulator that defines a channel; a gasket that surrounds at least a portion of the electrical insulator; and a shield between the channel and the gasket. The channel is configured to receive an electrical conductor. The gasket includes a non-metallic material.Type: GrantFiled: August 27, 2021Date of Patent: March 4, 2025Assignee: Cymer, LLCInventor: Mohammad Amin Khamehchi
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Patent number: 12245411Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17.Type: GrantFiled: November 23, 2021Date of Patent: March 4, 2025Assignee: 3M INNOVATIVE PROPERTIES COMPANYInventors: Chao Yang, Yuan Zhao, Zhiyong Xu, Ju Le Sun
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Patent number: 12238912Abstract: This application discloses electromagnetic energy mitigation assemblies and automotive vehicle components comprising the electromagnetic energy mitigation assemblies. An electromagnetic energy mitigation assembly includes a first electrically conductive layer and a second electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer. Third and fourth permalloy layers are along respective third and fourth opposite sides of the second electrically conductive layer. An electromagnetic noise suppression layer is sandwiched between the second and third permalloy layers. An automotive vehicle component includes an electromagnetic energy mitigation assembly configured to be positioned relative to one or more batteries of an automotive vehicle for providing electromagnetic shielding for the one or more batteries. The electromagnetic energy mitigation assembly includes a first electrically conductive layer.Type: GrantFiled: August 31, 2023Date of Patent: February 25, 2025Assignee: Laird Technologies (Shenzhen) Ltd.Inventors: Tsang-I Tsai, Yunxi She, Dong-Xiang Li, Jie-Sheng Chen, Min-Wei Hsu
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Patent number: 12238911Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.Type: GrantFiled: November 14, 2022Date of Patent: February 25, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Haejin Lee, Min Park, Kyuhwan Lee
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Patent number: 12232306Abstract: An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).Type: GrantFiled: March 29, 2022Date of Patent: February 18, 2025Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.Inventors: Takahiko Katsuki, Hiroshi Tajima, Sirou Yamauchi
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Patent number: 12232250Abstract: This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an “M-shape” overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.Type: GrantFiled: October 27, 2022Date of Patent: February 18, 2025Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Chuncheng Gong, Li Fan, Weijin Pan, Junwei Mu, Ge Zhang
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Patent number: 12230950Abstract: A junction box can include an enclosure defining a first enclosure end and a second enclosure end, a cavity extending into the enclosure from the first enclosure end towards the second enclosure end, the first enclosure end defining an opening to the cavity; a mounting insert removably positioned within the opening; and a locking collar removably coupled to the first enclosure end, the locking collar being repositionable on the first enclosure end between a tightened configuration and a loose configuration, the locking collar securing the mounting insert to the enclosure in the tightened configuration.Type: GrantFiled: July 29, 2021Date of Patent: February 18, 2025Assignee: Lumien Enterprise, Inc.Inventor: Haicheng Zhang
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Patent number: 12232305Abstract: A metal-foam structure is used to shield or reduce harmful electromagnetic waves that are generated by electronic devices. A metal-foam material has regulated pores and is incorporated in an electronic device. The metal foam structure shields, prevents, or reduces harmful electromagnetic waves generated by the electronic device from reaching the human body or interfering with a sensitive electronic component. This metal foam is a relatively lightweight material having regulated microscale pore structure. The pores in the metal foam can also form directionality relative to the direction of incoming electromagnetic waves for more effective reflection or absorption of electromagnetic waves. The metal foam can also be used as both an electromagnetic-shielding and a heat-dissipating component for electronics including popular consumer electronics such as mobile phones, notebooks, and high-power desktop computers.Type: GrantFiled: March 30, 2021Date of Patent: February 18, 2025Assignee: CellMo Materials Innovation, Inc.Inventors: Gigap Han, Kaiwen Tseng, Heeman Choe
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Patent number: 12224565Abstract: An adaptor plate includes a front plate that is configured to span across at least a portion of a front of an electrical junction box and includes one or more adaptor plate mounting features configured to align with corresponding mounting features of the electrical junction box. A DIN rail engagement portion extends backward from the front plate (and into the junction box) and is configured to fit at least partially into an elongated DIN rail mounting recess of a DIN rail device. In some cases, a first mounting slot is disposed within a first side of the DIN rail engagement portion for receiving a first mounting latch of the DIN rail device, and a second mounting slot is disposed within a second side of the DIN rail engagement portion for receiving a second mounting latch of the DIN rail device.Type: GrantFiled: September 6, 2019Date of Patent: February 11, 2025Assignee: HONEYWELL INTERNATIONAL INC.Inventors: Xinyan Zheng, Haitao Li, Wei Chen, Xuewei Liu, Bhavesh Gupta
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Patent number: 12224250Abstract: According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.Type: GrantFiled: June 5, 2023Date of Patent: February 11, 2025Assignee: SHIBAURA MECHATRONICS CORPORATIONInventors: Hisashi Nishigaki, Atsushi Fujita, Shohei Tanabe, Yoshinao Kamo, Shigeki Matsunaka
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Patent number: 12224568Abstract: An electrical box including a central housing with a first side opening, a second side opening opposite the first side opening, and a rear opening, each of the first and second side openings configured to receive an electrical or data interface device, a first extension compartment around the first side opening, the first extension compartment including a first door, and a second extension compartment around the second side opening, the second extension compartment including a second door.Type: GrantFiled: June 13, 2023Date of Patent: February 11, 2025Assignee: HUBBELL INCORPORATEDInventors: Jian Hua Li, Joseph Nicholas Cretella
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Patent number: 12213295Abstract: Disclosed herein are apparatuses and methods for providing a shield tile. In some embodiments, the shield tile includes a diamond in a shape of a prism. The diamond includes a first region converted to graphite. The first region is parallel to a base of the prism, and the first region extends to at least one face of the prism.Type: GrantFiled: January 15, 2024Date of Patent: January 28, 2025Assignee: Ellansalabs Inc.Inventors: Omar Besim Hakim, David S. Wesson
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Patent number: 12199374Abstract: There are provided a connector and a mounting structure, the connector including: a terminal fitting; an electric wire connected to the terminal fitting; a housing that includes a fitting portion having a shape protruding in a fitting direction with a mating part and accommodating the terminal fitting, an outer wall portion defining an internal space in which the electric wire is routed, and a hollow convex portion formed by a part of the outer wall portion protruding outward to have a convex shape in the fitting direction; and a fuse that includes a fused portion accommodated in a hollow portion of the convex portion and is connected to the electric wire.Type: GrantFiled: October 14, 2022Date of Patent: January 14, 2025Assignee: YAZAKI CORPORATIONInventors: Tsuyoshi Hamai, Takatoshi Suzuki, Junya Yamamoto
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Patent number: 12200867Abstract: The present application provides a synchronous rectification assembly, a manufacturing method thereof and a power supply. The synchronous rectification assembly comprises a first circuit board, a transformer, an electrical connection piece and a second circuit board; wherein the transformer is electrically connected to the first circuit board, and the second circuit board is provided with a conductive contact for being electrically connected to an external apparatus, and the electrical connection piece is electrically connected to the first circuit board and the second circuit board respectively; the first circuit board is configured to perform synchronous rectification on the output signal of the transformer and then transmit the output signal to the conductive contact of the second circuit board through the electrical connection piece.Type: GrantFiled: November 30, 2022Date of Patent: January 14, 2025Assignee: APLUS POWER TECHNOLOGY (HANGZHOU) CO., LTD.Inventor: Yuetian Wang