Patents Examined by Hung V. Ngo
  • Patent number: 12142903
    Abstract: The present invention provides a waterproof sealing mechanism for motor cable of swimming pool robots, which comprising a housing, wherein a sealing groove is provided on the outer side of the housing, and a sealing protrusion is integrally provided at the bottom of the sealing groove, connecting wire hole located inside the sealing protrusion is provided at the bottom of the sealing groove, and a sealing soft body is provided inside the sealing groove, the top of the sealing groove is provided with a rubber pressing plate mounted on the housing, and the middle part of the sealing soft body is provided with a threading hole running through the sealing soft body, the middle part of the rubber pressing plate is provided with a threading hole running through the rubber pressing plate, the sealing soft body is installed in the sealing groove, the soft rubber is pressed at the bottom of the fixing base main body, so that the soft rubber deforms to shrink the wire threading hole, and the leads is tightly wrapped in
    Type: Grant
    Filed: October 23, 2022
    Date of Patent: November 12, 2024
    Assignee: Shenzhen Seauto Technology Co., Ltd.
    Inventor: Zhuoming Deng
  • Patent number: 12141407
    Abstract: Provided is a conductive film in which wire visibility of a metal wire is suppressed and visibility is improved. The conductive film includes a substrate and a conductive layer that is disposed on the substrate and consists of a metal wire, with a width of 2 ?m or less, a height of 1 ?m or less, and the metal wire has a metal layer, a first blackening layer, and a second blackening layer in this order from a side of the substrate. The first and second blackening layers contain a metal atom and at least one selected from the group consisting of an oxygen atom and a nitrogen atom. In the first blackening layer, a content of the metal atom at an intermediate position in a thickness direction is larger than a content of the metal atom at an intermediate position in the second blackening layer in a thickness direction.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: November 12, 2024
    Assignee: FUJIFILM Corporation
    Inventor: Shigehide Itoh
  • Patent number: 12137547
    Abstract: A wiring module includes: a functional sheet disposed between a panel and an interior member in a vehicle; a transmission member disposed on one surface side of the functional sheet; and a conductive sheet covering a part of the transmission member. The functional sheet includes a conductive layer and a layer having a function of at least one of a thermal adjustment function or a sound insulation function, and the conductive sheet is electrically connected to the conductive layer.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: November 5, 2024
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yuriya Kato, Kosuke Sone, Ai Takehisa, Takuya Taniguchi
  • Patent number: 12133371
    Abstract: An EMF shield is disclosed. The EMF shield includes a scattering layer and a reflective layer having an exterior surface and an interior surface opposite the exterior surface. The scattering layer includes a metal coating disposed at the exterior surface. The reflective layer includes a first side and a second side opposite the first side, the first side of the reflective layer being coupled to the interior surface of the scattering layer, wherein the reflective layer comprises a dielectric material. The metal coating includes an adhesive coating for coupling to an electronic device. The EMF shield is configured to scatter and reflect the EMF signal. After the EMF signal is initially scattered by the metal coating, the reflective layer causes the EMF signal to reflect.
    Type: Grant
    Filed: August 20, 2022
    Date of Patent: October 29, 2024
    Assignee: SWITCH PROJECT LLC
    Inventor: Ben Salem
  • Patent number: 12133370
    Abstract: A shielding film and a circuit board are provided. The shielding film includes a first film layer (11), a contrast structural layer (12) and an electromagnetic shielding layer (13). The first film layer (11) is disposed on a first side of the electromagnetic shielding layer (13). The contrast structural layer (12) is disposed on the first side of the electromagnetic shielding layer (13). The grayscale value of the color of the contrast structural layer (12) is greater than the grayscale value of the color of the first film layer (11). In the contrast structural layer (12) and the first film layer (11), a hollowed-out pattern of an identification code is formed on a layer away from the electromagnetic shielding layer (13).
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: October 29, 2024
    Assignee: GUANGZHOU FANGBANG ELECTRONICS CO., LTD
    Inventor: Zhi Su
  • Patent number: 12125608
    Abstract: The present invention provides a differential paired cable with compensation functions, including: a first wire; a second wire; a first insulating layer; a second insulating layer; a ground wire; and a shielding layer. By controlling at least one of a length difference between the first insulating layer and the second insulating layer exposed outside of the shielding layer to be greater than 0.1 mm, a diameter difference between the first wire and the second wire to be greater than 0.005 mm, and a length difference between a welding portion of the first wire and a welding portion of the second wire to be greater than 0.05 mm, a signal transmission rate of one of the first wire and the second wire is compensated, so as to reduce an intra pair skew of the differential paired cable.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: October 22, 2024
    Inventor: James Cheng Lee
  • Patent number: 12120860
    Abstract: The present disclosure is directed to achieve greater space efficiency. A wiring module (A) includes a first transmission line (20), and a noise shielding member (40) that has a sheet shape and is arranged along the first transmission line (20). The noise shielding member (40) has a thickness of 100 ?m to 600 ?m. Since the noise shielding member (40) has a sheet shape, and thus the space for arranging the noise shielding member (40) can be made smaller, it is possible to achieve greater space efficiency. Since the noise shielding member (40) has a thickness of 100 ?m to 600 ?m, it is possible to obtain a high noise shielding effect.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: October 15, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hiroyuki Kodama, Kiyoshi Kato, Yuya Iwaguchi, Shuhei Ozu
  • Patent number: 12120861
    Abstract: An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: October 15, 2024
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yoshiharu Yanagi, Hiroshi Tajima
  • Patent number: 12120859
    Abstract: A curtain for shielding an electromagnetic field may include a plurality of strip elements. A first strip element and a second strip element of the plurality of strip elements may have an electrically conductive layer. In a shielding configuration of the curtain, the electrically conductive layer of the first strip element is electrically connected to the electrically conductive layer of the second strip element and/or to an electrical connecting terminal for a reference potential. The plurality of strip elements can be variably positioned against one another.
    Type: Grant
    Filed: December 29, 2022
    Date of Patent: October 15, 2024
    Assignee: Siemens Healthineers AG
    Inventors: Johann Sukkau, Michael Wullenweber
  • Patent number: 12114472
    Abstract: A Radio Frequency, “RF”, component and a method of making the same. The component includes a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also includes a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier includes a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member includes a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: October 8, 2024
    Assignee: NXP B.V.
    Inventors: Philipp Franz Freidl, Mustafa Acar, Antonius Hendrikus Jozef Kamphuis, Jan Willem Bergman
  • Patent number: 12106873
    Abstract: A two-core flat cable includes a pair of metal wires, an insulating covering that bundles and covers the pair of metal wires along a longitudinal direction thereof, an electrically conductive shield that covers an entire perimeter surface of the covering, and an insulating sheath that covers the shield, wherein the shield is comprised of a metal coating laver, and the sheath is comprised of a lamination sheet of an insulating resin.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: October 1, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yuto Kobayashi
  • Patent number: 12108583
    Abstract: An electromagnetic wave shielding material includes a metal layer for ground connection provided as an outermost layer of a laminate; wherein only one surface of the metal layer for ground connection is laminated on the insulating layer via the adhesive layer, and assuming d1 is a thickness and ?1 is a Young's modulus of the adhesive layer on the one surface, d2 is a thickness and ?2 is a Young's modulus of the metal layer for ground connection, and ?3 is a composite Young's modulus of the adhesive layer on the one surface and the metal layer for ground connection, the following relational expression is satisfied: ?3/?2>0.60; in which, ?3=?1 (d1/(d1+d2))+?2 (d2 (d1+d2)).
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: October 1, 2024
    Assignee: JX Advanced Metals Corporation
    Inventor: Yukito Yamamoto
  • Patent number: 12101872
    Abstract: A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: September 24, 2024
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventor: Yuusuke Haruna
  • Patent number: 12089383
    Abstract: An expansion joint sealing system includes a core body having an EMP, EMI, RFI, electronic surveillance and/or EMR shielding/barrier material introduced in the core body as at least one of a component or layer, disposed on the core body as a coating or wrapping, or disposed beneath the core body. The core body with the shielding/barrier material is configured to expand and contract when compressed between substrates forming an expansion joint to accommodate movement of the substrates and maintain a seal of the expansion joint.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: September 10, 2024
    Assignee: SIKA TECHNOLOGY AG
    Inventors: William Witherspoon, Lester Hensley
  • Patent number: 12069844
    Abstract: The device consists of a container manufactured from a metamaterial with the property of transparency to visible light, for the holding of electrical or electronic devices, which electromagnetically protects the same and renders them electromagnetically undetectable. The purpose of the device is to guarantee user confidentiality in the use of the electromagnetic waves associated with telecommunications, by means of the use of a type of container that encloses any type of telecommunication device or appliance, with the potentiality that the insertion thereof into said container prevents the detection by means of electromagnetic waves of said appliance, and therefore makes impossible the tracing of said appliance by electromagnetic remote sensing means, including mobile telephony, radiofrequencies, or satellite telecommunication means such as GPS, Galileo, or other systems, without it being necessary to switch off said appliance beforehand.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: August 20, 2024
    Inventor: Jesus Perez Santafe
  • Patent number: 12062495
    Abstract: An electronic device includes a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.
    Type: Grant
    Filed: June 8, 2023
    Date of Patent: August 13, 2024
    Assignee: TDK CORPORATION
    Inventors: Akihiro Masuda, Takaaki Sato, Norihisa Ando, Shinya Ito, Kosuke Yazawa
  • Patent number: 12049728
    Abstract: The present disclosure relates to electromagnetic shielding paper based on modification of a conductive MOF material and a preparation method thereof, and belongs to the technical field of electromagnetic shielding. The method includes the following steps: putting polyimide fibers into a precursor solution of the conductive MOF material, and reacting to obtain MOF material modified PI fibers; mixing the modified fibers with aramid pulp, and carrying out papermaking, squeezing and drying to obtain a paper-based precursor; generating a conductive polymer (polypyrrole) in situ by using a gas-phase polymerization method, and finally obtaining the electromagnetic shielding paper based on the modification of the conductive MOF material. The electromagnetic shielding paper prepared by the present disclosure not only has good conductivity and electromagnetic shielding performance, but also has good mechanical properties and thermal stability.
    Type: Grant
    Filed: May 30, 2023
    Date of Patent: July 30, 2024
    Assignees: JIANGSU AOSHEN HI-TECH MATERIALS CO., LTD., JIANGNAN UNIVERSITY
    Inventors: Shihua Wang, Ruqiang Zhang, Mingdong Tao, Zhu Long, Tao Guo, Yongzhen Zhan, Xinglong Tang, Ling Miao, Chang Sun
  • Patent number: 12046424
    Abstract: Provided is an airtight terminal that is designed to enable implementation of a method for sealing a can case with the airtight terminal with improved readiness and at a reasonable price, as well as an electrical device package and a method for manufacturing an electrical device package. Provided is an airtight terminal that includes a lid composed of a dish-shaped thin metal sheet having a through hole in a surface of the sheet, a lead passing through the through hole in the lid, and an insulating material to hermetically seal a gap between the lead and the lid, wherein the lid has an engagement portion along an edge of the lid to seal a can case by seaming.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 23, 2024
    Assignee: Schott Japan Corporation
    Inventors: Yutaka Onezawa, Naoki Bokuda
  • Patent number: 12041717
    Abstract: An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hyunmo Yang, Junwhon Uhm, Yonghyun Park, Yongwon Lee, Sangwon Ha
  • Patent number: 12028966
    Abstract: A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: July 2, 2024
    Assignee: Marvell Asia Pte, Ltd.
    Inventors: Shaowu Huang, Dance Wu