Patents Examined by Hung V. Ngo
  • Patent number: 11824340
    Abstract: The invention relates to a connection arrangement for connecting a busbar (40) to a housing (10) for electrical components (30), comprising the busbar (40) and at least one wall (11) of the housing (10) and at least one electrically insulating element (50), characterized in that the connection arrangement (20) has at least one fastening element (60; 61A; 62) for preferably detachable connection to the wall (11) of the housing (10) and the at least one electrically insulating element (50) is formed from a material having good thermal conductivity.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: November 21, 2023
    Inventors: Martin Dopadlo, Heike Strumberger
  • Patent number: 11825640
    Abstract: An electromagnetic shielding device (40) including at least one hollow protective textile sleeve (50) having a main rest diameter D1 and an interior volume configured to receive one or several elongated element(s) (20, 21), at least one hollow connecting textile sleeve (60) having a rest diameter D2, D2 greater than D1. The protective textile sleeve (50) comprises a substantially annular front part (52) having a front open end (54), the connecting textile sleeve (60) includes a substantially annular rear part (62) having a rear open end (64), and the shielding device (40) includes a first electrically conductive, in particular at least partially annular, securing area (70) in which the rear part (62) of the connecting sleeve (60) and the front part (52) of the protective sleeve (50) are at least partly secured.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: November 21, 2023
    Inventors: Clément Dousteyssier, Ryan Christian Gray
  • Patent number: 11818284
    Abstract: A personal shielding device applicable to a screen, in particular a touch screen of an electronic device, has a continuous absorbent sheet at least partially made of metal material. The continuous absorbent sheet is adapted to absorb electromagnetic waves emitted by the electronic device in direction of a user.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: November 14, 2023
    Assignee: Tiziana VIGNI
    Inventor: Tiziana Vigni
  • Patent number: 11792913
    Abstract: This document describes techniques and apparatuses directed to the mitigation of physical impact-induced mechanical stress damage to printed circuit boards through the utilization of a conductive shield track having a varied width (dynamic width). In an aspect, disclosed is a device that includes a printed circuit board, an electrical component on the printed circuit board in a shielded area, a conductive shield track on the printed circuit board, a component shield having a sidewall and a sidewall base, and solder disposed between the sidewall base and the conductive shield track to couple the component shield to the ground plane of the PCB to form a shielded compartment over the shielded area.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: October 17, 2023
    Assignee: Google LLC
    Inventors: Eric Robert Lee, Hsinhsin Lee
  • Patent number: 11792967
    Abstract: Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: October 17, 2023
    Inventors: Kyle L. Grosse, Gary A. Frazier, Catherine Trent
  • Patent number: 11792966
    Abstract: A flexible laminate for shielding against electromagnetic radiation includes: a) at least one metal foil; and b) a sheet-like substrate made of a fiber material, film material, or foam material. The laminate includes a plurality of objects formed by incisions into a base area of the laminate. Each object of the plurality of objects is made of two or more incisions having a common initial point. The two or more incisions, or each of two adjacent incisions of the two or more decisions, define an angle of 45° to 160°.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: October 17, 2023
    Inventors: Ulrich Schneider, Sarah Senne, Michael Zaplatilek
  • Patent number: 11783961
    Abstract: A conductive film includes a transparent supporting layer and a conductive grid. The transparent supporting layer includes a first side face and a second side face arranged opposite to each other, and the first side face is provided with grooves. A conductive material is filled in the grooves to form the conductive grid interconnected, and the conductive grid includes a plurality of circle lattices. Since the conductive material is filled in the grooves to form the conductive grid and the conductive grid includes a plurality of circle lattices, the dot pattern presented is relatively soft, and the impact on vision caused by interference is reduced.
    Type: Grant
    Filed: October 10, 2021
    Date of Patent: October 10, 2023
    Inventors: Sheng Zhang, Fei Zhou
  • Patent number: 11785752
    Abstract: An electromagnetic wave absorbing thermally conductive composition contains a matrix resin component, metal soft magnetic particles, and thermally conductive particles. The metal soft magnetic particles are carbonyl iron particles and are present in an amount of 30% by volume or more when the electromagnetic wave absorbing thermally conductive composition is a population parameter. A value of an imaginary part (??) of relative permeability of the electromagnetic wave absorbing thermally conductive composition is 0.9 or more in at least some bands in a frequency range of 18 to 26.5 GHz. The electromagnetic wave absorbing thermally conductive composition in the form of a sheet has a thermal conductivity of 2.0 W/m·K or more in the thickness direction. A sheet of the present invention incudes the above composition in the form of a sheet.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 10, 2023
    Assignee: Fuji Polymer Industries Co., Ltd.
    Inventor: Shingo Ito
  • Patent number: 11785731
    Abstract: A cable connector module includes a housing having a cavity and a cable connector module received in the cavity. The cable connector module includes a circuit card having rows of signal contact pads on a mounting surface. The cable connector module includes cable assemblies terminated to the circuit card arranged in rows each having a cable and a ground clip coupled to an end of the cable. The cable connector module includes a cable holder coupled to the housing that holds the cables assemblies relative to each other within the cavity of the housing.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: October 10, 2023
    Inventors: Chad William Morgan, Bruce Allen Champion, John Joseph Consoli, Leo Joseph Graham
  • Patent number: 11784479
    Abstract: A rapid wiring device includes a junction box provided with a limiting groove of which the bottom surface is provided with the tip portions of two conductors. A wire box fixing a second electric wire is set in the limiting groove, then it is combined on the junction box through a tightening cover, which is used to push the wire box to move towards the bottom of the limiting groove, so that the tip portions of the two conductors pass through the wire box and penetrate the insulating layer of the second electric wire to touch the core wire of the second electric wire, so that the first electric wire and the second electric wire are quickly connected.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: October 10, 2023
    Inventor: Jerry Yang
  • Patent number: 11785727
    Abstract: Techniques are disclosed relating to a locking pin used to secure components in an electronics module. For example, in some embodiments an electronics module includes a housing lower part that includes a lower receiving element and a housing upper part that includes an upper receiving element that is aligned with the lower receiving element. In various embodiments, a locking pin may be used to connect a circuit board in the electronics module. For example, in some embodiments the circuit board includes at least one lead-through opening and the circuit board is connected to the housing lower part via the locking pin that is inserted in a positive-locking manner through the lead-through opening into the lower receiving element. Further, in some embodiments, an upper pin section of the locking pin may be inserted into an upper receiving element of the housing upper part in a positive-locking manner.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: October 10, 2023
    Assignee: TURCK Holding GmbH
    Inventor: Nikolaj Löwen
  • Patent number: 11785738
    Abstract: Proposed is an electronic apparatus with which it is possible to increase design freedom concerning a wall section formed with vent holes. A rear wall section (20D) includes a rectilinear wall section (21i) spaced rearward from a rear edge (41c) of a circuit board (41), and an inclined wall section (21j) located on the rear side relative to the rectilinear wall section (21i). An inner wall section (42e) is located between the inclined wall section (21j) and the rear edge (41c) of the circuit board (41), and is not located between the rectilinear wall section (21i) and the rear edge (41c) of the circuit board (41).
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: October 10, 2023
    Assignee: Sony Interactive Entertainment Inc.
    Inventors: Ichiro Sasaki, Keiichi Aoki
  • Patent number: 11778794
    Abstract: An electromagnetic interference (EMI) shielded device which includes an object to be shielded and an EMI shielding material encompassing the object. The EMI shielding material is made up of, but not limited to a broadband biopolymer or polymer dissolved in organic solvents and shielding guest material. The specific makeup of the shielding material and fabrication procedure of the shielding material is also included herein.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: October 3, 2023
    Assignee: Software Defined Technologies, Inc
    Inventors: De Yu Zang, Michael M. Salour, James G. Grote
  • Patent number: 11777327
    Abstract: A storage case and charging device for a VR equipment includes a lower housing having an accommodation groove for accommodating the VR equipment; an upper housing covering the accommodation groove and detachably connected with the lower housing; and a first charging plug being disposed in the accommodation groove. The first charging plug is configured for inserting into and electrically connecting to a first charging port of the VR equipment for charging the VR equipment.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: October 3, 2023
    Inventor: Jinxin Gu
  • Patent number: 11770919
    Abstract: An electromagnetic interference shielding composite. The electromagnetic interference shielding composite includes a polymer substrate formed into a shape of a packaging component. The composite further includes an electromagnetic interference layer contacting the polymer substrate and a conductive coating contacting the electromagnetic interference layer. An integrated power electronic module includes packaging including the electromagnetic interference shielding composite. A method of forming the electromagnetic interference shielding composite for an integrated power electronic module includes molding a polymer substrate into a shape of a packaging component, forming an electromagnetic interference layer on the polymer substrate, and forming a conductive coating on the electromagnetic interference layer.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: September 26, 2023
    Inventors: Seongchan Pack, Anthony Michael Coppola, James R. Salvador
  • Patent number: 11765875
    Abstract: A shielding film having a multi-layered metal structure is provided, including an insulating layer and a multi-layered metal compounded on the insulating layer, wherein the thickness of each layer of metal is 0.05-5 ?m, the multi-layered metal has 2-10 layers, and a conductive bonding layer is disposed between the multi-layered metal. In the present application, the thickness of each layer of metal is controlled by providing a multi-layered metal, and a conductive bonding layer is bonded between the layers of metal such that the shielding film has good flexibility and shielding effect. Additionally, the conductive bonding layer is used so that the binding force between the layers of metal is good, and a high-frequency signal shielding performance of greater than 80 db@10 ghz is ensured so that the shielding film has good flexibility and meets flexibility requirements for flexible circuit boards while also having good high-temperature resistance.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: September 19, 2023
    Inventor: Haiyu Tian
  • Patent number: 11765872
    Abstract: A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 ?m or more and 30 ?m or less.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: September 19, 2023
    Inventors: Yuki Ochiai, Shunsuke Mochizuki, Shu Okasaka
  • Patent number: 11758705
    Abstract: Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: September 12, 2023
    Inventors: Takahiko Katsuki, Hiroshi Tajima, Yuusuke Haruna
  • Patent number: 11751343
    Abstract: A modularly expandable electronic control unit comprises: an electronic circuit board on which a conductor track is disposed on a side in a region of lateral edges and enclosing an inner region and separating it from an outer region of the side, a housing having two halves for receiving the electronic circuit board. With the housing assembled, at least one housing half has an encircling electrically conductive shielding wall which rests on and establishes electrical contact with the conductor track and/or has at least one receptacle accessible from outside the assembled housing. The receptacle is disposed so the electronic module placed in the receptacle may be electrically connected to a module connection port disposed in the outer region of the electronic circuit board. The electronic circuit board has electrical connections between the module connection port and one or more electronic assemblies disposed on the inner region.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: September 5, 2023
    Assignee: Continental Automotive GmbH
    Inventors: Florian Von Reitzenstein, Christoph Kopp, Harsha Walvekar
  • Patent number: 11751319
    Abstract: An electronic device is disclosed. The disclosed electronic device includes a printed circuit board including at least one through-hole, a holder which is positioned through the through-hole and protrudes upward and downward from the printed circuit board, and a solder layer for bonding one area of the holder to one surface of the printed circuit board.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: September 5, 2023
    Inventor: Hyunwoo Chung