Abstract: An electrical connection box includes a busbar, a box main body in which the busbar is provided, and a cover that covers the box main body. The cover has an engaging part. The box main body has an engaged part that is engaged with the engaging part to combine the box main body and the cover. A recessed part is formed in an outer peripheral wall of a unit that is formed by combining the box main body and the cover. The recessed part houses a lock part that is formed by engagement between the engaging part and the engaged part. The recessed part has a depth dimension with which the lock part is positioned closer to a central side of the unit than an end surface of the outer peripheral wall.

Abstract: Provided are a magnetic field shielding sheet and a manufacturing method therefor. The magnetic field shielding sheet includes: a sheet main body formed from a magnetic material to be capable of shielding a magnetic field; a first protection layer disposed to cover one surface of the sheet main body; a second protection layer disposed to cover the other surface, opposite from the one surface, of the sheet main body; a third protection layer interposed between the first protection layer and the second protection layer to cover the side surface of the sheet main body in the thickness direction of the sheet main body; and a sealing part formed on the side portion of the sheet main body so that the sheet main body is sealed, wherein a stepped portion formed between the sheet main body and the sealing part is reduced by means of the third protection layer.

Abstract: A method of controlling a temperature profile of an optical window comprising: measuring a temperature-dependent electrical property of a thermally sensitive material included in the optical window using an embedded electromagnetic interference shield in the optical window to determine the temperature profile of the optical window, the embedded electromagnetic interference shield including a two-dimensional array of electrically conductive wires; and based on the measurements, selectively biasing at least one wire of the two-dimensional array of electrically conductive wires to locally alter the temperature-dependent electrical property of the thermally sensitive material in at least one selected spatial region of the optical window to control the temperature profile of the optical window.

Abstract: A resin molded body includes: resin; and a conductive member having a coil shape with a center axis; with a flat surface in at least part of the resin molded body, in which an average angle between the flat surface and the center axis is 50° or greater.

Abstract: A first electromagnetic shielding fabric connects to first and third zipper tapes around an opening. A second electromagnetic shielding fabric connects to second and fourth zipper tapes around a door to fit the opening. The first, second, third and fourth zipper tapes each have a row of teeth that mesh pairs of the tapes. An elongated gasket is fixedly secured to the first electromagnetic shielding fabric and can be wrapped around the elongated gasket in a positon between the first and third zipper tapes. Another elongated gasket can be fixedly secured to the second electromagnetic shielding fabric and can be wrapped around the elongated gasket in a positon between the second zipper tape and the fourth zipper tape. Extra elongated gaskets can be fixedly secured with extra electromagnetic shielding fabric wrapped around the extra elongated gaskets. The various elongated gaskets can be compressible foam.

Abstract: An electrical connection box includes an auxiliary housing of a tubular shape interposed between a first housing and a second housing in a state where a second terminal is in complete contact with a first terminal. The auxiliary housing includes a holding portion that positions and holds the first terminal with respect to the first housing and a guide portion that guides the second terminal toward the first terminal in a state where the auxiliary housing is disposed on an opening side of the first housing.

Abstract: A circuit board assembly includes a circuit board, a noise source and a shielding cover. The circuit board has an upper surface, a lower surface and a plurality of grounding areas. The lower surface faces away from the upper surface, and the grounding areas are located at the lower surface. The noise source is located at the upper surface of the circuit board. The shielding cover includes a covering body and a plurality of elastic grounding arms. The covering body is in contact with the upper surface and covers the noise source. The elastic grounding arms are connected to the covering body. The elastic grounding arms are in contact with the lower surface of the circuit board and respectively in electrical contact with the grounding areas.

Abstract: An electrical apparatus, including a first housing having a fluid-filled or fluid-perfused wet space and a dry space that are separated from one another by a wall, wherein the wall includes an opening, one or more power-conducting and/or power-switching elements arranged in the wet space, and a control electronics for the one or more power-switching elements arranged in the dry space. The electrical apparatus includes a second housing extending from the opening into the wet space, wherein the second housing reaches up to or encloses a power-conducting element, and a sensor arranged in the second housing, the sensor being configured to measure a variable that depends on an electrical power flowing through the power-conducting element. The second housing seals the opening in the wall in a fluid-tight manner. Measured values or signals of the sensor conducted by lines are passed through the opening into the dry space.

Abstract: Provided are methods of forming graphene laminate compositions and architectures. The method comprises: (i) contacting a graphene structure comprising one or more planar graphene sheets with a first interlayer material; (ii) depositing of a conductive material, where in the conductive material is deposited along an edge of the graphene and one end of the first interlayer; and (iii) contacting the graphene structure with a second interlayer material. Also provided are graphene laminates structures comprising doped graphene films having improved mechanical strength, electrical mobility and optical transparency.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.

Abstract: The present invention provides an electromagnetic wave-absorbing composite material and a manufacturing method therefor, the electromagnetic wave-absorbing composite material comprising: a polymer composite including a refractive index-adjusting material therein; and a plurality of conductive wires formed on at least one surface of the polymer composite, wherein electromagnetic waves reflected in a matching frequency (f) range derived through Mathematical Formulas 1 to 3 described in the present invention are 0.2 dB or less.

Abstract: The present invention relates to a circuit board to which a 3D formed electromagnetic shielding film is attached, a 3D formable electromagnetic shielding film, a 3D formed electromagnetic shielding film, and a method for attaching an electromagnetic shielding film to a circuit board. The circuit board includes an electronic component. The 3D formed electromagnetic shielding film includes a molding layer, a shielding layer, and an adhesive film. The molding layer and the adhesive film are laminated. The shielding layer is a conductive non-woven layer embedded in the adhesive film. A ratio of a surface area S2 of the electromagnetic shielding film after forming with an upper surface area of the electronic component deducted to a surface area S1 thereof before forming with the upper surface area of the electronic component deducted is 1.5 to 17.

Abstract: An apparatus for a light source includes: an electrical insulator that defines a channel; a gasket that surrounds at least a portion of the electrical insulator; and a shield between the channel and the gasket. The channel is configured to receive an electrical conductor. The gasket includes a non-metallic material.

Abstract: This application discloses electromagnetic energy mitigation assemblies and automotive vehicle components comprising the electromagnetic energy mitigation assemblies. An electromagnetic energy mitigation assembly includes a first electrically conductive layer and a second electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer. Third and fourth permalloy layers are along respective third and fourth opposite sides of the second electrically conductive layer. An electromagnetic noise suppression layer is sandwiched between the second and third permalloy layers. An automotive vehicle component includes an electromagnetic energy mitigation assembly configured to be positioned relative to one or more batteries of an automotive vehicle for providing electromagnetic shielding for the one or more batteries. The electromagnetic energy mitigation assembly includes a first electrically conductive layer.

Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.

Abstract: This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an “M-shape” overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.

Abstract: A junction box can include an enclosure defining a first enclosure end and a second enclosure end, a cavity extending into the enclosure from the first enclosure end towards the second enclosure end, the first enclosure end defining an opening to the cavity; a mounting insert removably positioned within the opening; and a locking collar removably coupled to the first enclosure end, the locking collar being repositionable on the first enclosure end between a tightened configuration and a loose configuration, the locking collar securing the mounting insert to the enclosure in the tightened configuration.

Abstract: A metal-foam structure is used to shield or reduce harmful electromagnetic waves that are generated by electronic devices. A metal-foam material has regulated pores and is incorporated in an electronic device. The metal foam structure shields, prevents, or reduces harmful electromagnetic waves generated by the electronic device from reaching the human body or interfering with a sensitive electronic component. This metal foam is a relatively lightweight material having regulated microscale pore structure. The pores in the metal foam can also form directionality relative to the direction of incoming electromagnetic waves for more effective reflection or absorption of electromagnetic waves. The metal foam can also be used as both an electromagnetic-shielding and a heat-dissipating component for electronics including popular consumer electronics such as mobile phones, notebooks, and high-power desktop computers.

Abstract: An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A1) including one or more island-shaped metal layer fragments. Each opening (A1) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

Abstract: An adaptor plate includes a front plate that is configured to span across at least a portion of a front of an electrical junction box and includes one or more adaptor plate mounting features configured to align with corresponding mounting features of the electrical junction box. A DIN rail engagement portion extends backward from the front plate (and into the junction box) and is configured to fit at least partially into an elongated DIN rail mounting recess of a DIN rail device. In some cases, a first mounting slot is disposed within a first side of the DIN rail engagement portion for receiving a first mounting latch of the DIN rail device, and a second mounting slot is disposed within a second side of the DIN rail engagement portion for receiving a second mounting latch of the DIN rail device.