Patents Examined by Hung V. Ngo
  • Patent number: 12046424
    Abstract: Provided is an airtight terminal that is designed to enable implementation of a method for sealing a can case with the airtight terminal with improved readiness and at a reasonable price, as well as an electrical device package and a method for manufacturing an electrical device package. Provided is an airtight terminal that includes a lid composed of a dish-shaped thin metal sheet having a through hole in a surface of the sheet, a lead passing through the through hole in the lid, and an insulating material to hermetically seal a gap between the lead and the lid, wherein the lid has an engagement portion along an edge of the lid to seal a can case by seaming.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: July 23, 2024
    Assignee: Schott Japan Corporation
    Inventors: Yutaka Onezawa, Naoki Bokuda
  • Patent number: 12041717
    Abstract: An electronic device is provided, which includes a PCB including a first alignment mark formed on a first surface of the PCB, and an RFPCB including a plurality of layers, a rigid portion disposed on the first surface of the PCB, a flexible portion extending from the rigid portion, and a first protrusion formed as one of the plurality of layers protruding and extending from the rigid portion. A second alignment mark corresponding to the first alignment mark of the PCB is defined in the first protrusion. The first protrusion overlaps at least partially with the first alignment mark of the PCB.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: July 16, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hyunmo Yang, Junwhon Uhm, Yonghyun Park, Yongwon Lee, Sangwon Ha
  • Patent number: 12028966
    Abstract: A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: July 2, 2024
    Assignee: Marvell Asia Pte, Ltd.
    Inventors: Shaowu Huang, Dance Wu
  • Patent number: 12029018
    Abstract: The present invention is directed at electromagnetic shielding that is particularly suitable for applications in electric vehicles. The electromagnetic shielding is relatively lightweight and can be integrated into a carpet or textile type construction.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: July 2, 2024
    Assignee: AURIA SOLUTIONS UK 1 LTD.
    Inventors: Ernest Franklin Wilson, Timothy Joel Allison, Eric Staudt
  • Patent number: 12029020
    Abstract: A multilayer electromagnetic shielding system providing two stacks spaced apart by an air gap, wherein each stack has an electric-field-attenuating layer adhered to a magnetic-field-attenuating layer. An electromagnetically inert material may sandwich the spaced apart stacks for insulative and structural purposes.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: July 2, 2024
    Inventors: Dan Miulli, James Garvin Wiginton, IV, James Brazdzionis, Paras Savla
  • Patent number: 12029019
    Abstract: An electromagnetic wave transmissive cover is configured to be employed in a vehicle to which a sensor device is attached. The electromagnetic wave transmissive cover includes a cover body that is attached to the vehicle and covers the sensor device from a front side in an emission direction of the electromagnetic waves, and a seal member that provides a seal between the sensor device and the cover body. The seal member includes an attachment base portion that is attached to the cover body while surrounding the electromagnetic wave transmissive portion, and an annular hollow seal portion that is coupled to the attachment base portion and is in contact with the sensor device while surrounding the electromagnetic wave transmissive portion.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: July 2, 2024
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Yosuke Tsuchiya, Koji Fukagawa, Risa Hirano
  • Patent number: 12022641
    Abstract: An electromagnetic wave suppression sheet includes an electromagnetic wave transmitting layer having conductivity and transparency; a suppression layer having transparency; a conductive mesh having openings formed by woven lines; and an adhesive layer having transparency in this order from an outer side toward an inner side. The openings of the conductive mesh have a region in which the suppression layer and the adhesive layer are in contact with each other. A method of manufacturing an electromagnetic wave suppression sheet includes steps of preparing a laminate including the suppression layer, and the conductive mesh disposed to be in contact with the suppression layer; and applying a pressure to the conductive mesh in a direction of the suppression layer.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: June 25, 2024
    Assignee: MAXELL, LTD.
    Inventors: Ryo Shoda, Masayuki Toyoda
  • Patent number: 12021359
    Abstract: An electric wire protection member to be provided at an end in a longitudinal direction of a tube that covers an outer circumference of an electric wire, the electric wire protection member including: a case; and a magnetic core provided to surround the outer circumference of the electric wire, wherein: the case includes: a core housing that houses the magnetic core; and a cover that covers an inner circumferential edge at the end of the tube, the core housing and the cover are formed in one piece with the case.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 25, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Yoshio Mizutani
  • Patent number: 12021417
    Abstract: A drive assembly for a vehicle includes a converter having a converter housing and an electric converter circuit disposed in the converter housing, an electric machine having a machine housing disposed adjacent to the converter housing and a stator/rotor arrangement disposed in the machine housing, a plurality of conductor bars which electrically connect the converter circuit and the stator/rotor arrangement and extend through first passage openings formed in the converter housing and through second passage openings formed in the machine housing, and a shielding frame which is made of an electrically conductive material, is disposed between the converter housing and the machine housing, encloses the plurality of conductor bars and abuts the converter housing and the machine housing.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 25, 2024
    Assignee: Robert Bosch GmbH
    Inventors: Gergo Jozsef Katlan, Denes Zsiga, Kejing Yang
  • Patent number: 12020684
    Abstract: There is disclosed a text to speech announcement system capable of operating without an external power source for long periods of time.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: June 25, 2024
    Assignee: CONNECTPOINT, INC.
    Inventors: Frederick A. Wood, Charles Menzel
  • Patent number: 12016164
    Abstract: An assembly for electromagnetic interference (EMI) shielding to prevent incident radiation from penetrating through a gap to an interior of an aircraft includes an electromagnetic band gap (EBG) structure. The EBG structure has a patch-and-via array connected to a ground layer. The EMI shielding includes a conductive adhesive and is flexible for conforming attachment to curved aircraft surfaces. The shielding may be located on a deflector plate that is parallel to an adjacent aircraft surface, on the airframe surface opposite to the deflector plate, or in both locations. The assembly filters out penetrating electromagnetic energy and prevents highly resonant cavity mode build-ups of electromagnetic energy inside a nacelle or other enclosure effectively protecting electrical equipment in the interior.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: June 18, 2024
    Assignee: The Boeing Company
    Inventors: Kyu-Pyung Hwang, Thomas D. Mitchum, Philipp Andreas Boettcher, Young Song
  • Patent number: 12016165
    Abstract: The present invention aims to provide a shield package having a highly distinctive patterned portion formed on a surface of a shield layer. The shield package of the present invention includes a package in which an electronic component is sealed with a sealing material, and a shield layer covering the package, wherein a surface of the shield layer includes a patterned portion and a non-patterned portion other than the patterned portion, and a ratio of Sal (autocorrelation length) of the non-patterned portion to Sal of the patterned portion is as follows: (Sal of non-patterned portion)/(Sal of patterned portion)>4.0.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: June 18, 2024
    Assignee: Tatsuta Electric Wire & Cable Co., Ltd.
    Inventors: Hiroaki Umeda, Hidetoshi Noguchi, Hajime Nakazono, Sougo Ishioka
  • Patent number: 12003053
    Abstract: An elastic electrical contact terminal capable of implementing a reliable electrical connection between objects, wherein the electrical contact terminal includes: an elastic core; a silicone rubber adhesive applied to the outer surface of the elastic core; and an electrically conductive fiber wrapped around and bonded to the elastic core by means of being interposed with the silicone rubber adhesive, wherein a sheet has a polymer coating layer formed on the inner surface thereof facing the silicone rubber adhesive, and has a metal layer formed on the outer surface thereof.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: June 4, 2024
    Assignee: JOINSET CO., LTD.
    Inventor: Sun-Ki Kim
  • Patent number: 12002740
    Abstract: A printed circuit board including a dielectric insulation layer having a top side facing a first side and a bottom side opposite the first side that faces a second side of the dielectric insulation layer, at least one conducting track formed on the dielectric insulation layer, and one or more conductor rails, wherein each of the one or more conductor rails is mechanically coupled to the dielectric insulation layer, and a first portion of each of the one or more conductor rails is arranged on the first side and a second portion of each of the one or more conductor rails is arranged on the second side of the dielectric insulation layer.
    Type: Grant
    Filed: January 25, 2023
    Date of Patent: June 4, 2024
    Assignee: Infineon Technologies AG
    Inventors: Sebastian Michalski, Guido Bönig
  • Patent number: 12004335
    Abstract: The invention concerns a device for absorbing electrical noise on lines, with a housing having two housing parts, wherein each housing part is provided for receiving an element of a noise-absorbing material, wherein in the closed state, the housing has a passage opening in each of two opposing end walls for one or more lines, wherein the elements in the housing parts in the closed state of the housing form a passage for one or more lines, wherein the passage openings in the housing and the passage formed by means of the elements define a passage direction for the at least one line, and wherein a locking device is provided for locking the housing parts in the closed state of the housing, wherein the housing parts are configured such that by means of a relative movement of the housing parts with respect to each other, wherein a main component of the relative movement runs parallel to the passage direction, the housing parts can be moved into the closed state of the housing and locked together in the closed stat
    Type: Grant
    Filed: September 7, 2020
    Date of Patent: June 4, 2024
    Assignee: WÜRTH ELEKTRONIK EISOS GMBH & CO. KG
    Inventor: Klaus Aupke
  • Patent number: 11988527
    Abstract: The present invention is used to compose the structure of a system that operates inside pipelines. It can be used in a robotic system in the form of a train to move tools inside small diameter tubes or ducts. It avoids the need for costly commercial connectors with limited variety of connections. The proposed solution is to partition/separate the electronic or hydraulic components into pressure vessel modules, thereby making it necessary to provide an adequate means of interconnection between said modules by means of an elastomeric conduit. Each module has a heat exchanger system (sink) to remove the heat generated by the electronic equipment installed inside thereof. The product of the invention has a sufficient degree of freedom to move in ducts and underwater pipes, where the hydrostatic pressure is extremely high.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: May 21, 2024
    Assignees: PETRÓLEO BRASILEIRO S.A.—PETROBRÁS, SERVIO NACIONAL DE APRENDIZAGEM INDUSTRIAL—SENAI
    Inventors: André Viegas Wentz, Cristiane Mioto Becker, Enzo Costamilan, Eduardo Gerhardt, Hugo Francisco Lisboa Santos
  • Patent number: 11991815
    Abstract: Provided is a circuit structure having a novel structure that allows heat from a heat-generating component to be dissipated more efficiently. A circuit structure includes: a heat-generating component that generates heat when energized; energization bus bars that are connected to connection portions of the heat-generating component; cooling members that are formed separately from the energization bus bars, and are connected to the connection portions of the heat-generating component along with energization bus bars, and the heat-transfer portions that are provided in the cooling members, and are in heat-conductive contact with a heat-dissipating body.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: May 21, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Koushi Igura, Hiroki Shimoda, Taiji Yanagida, Kazuya Komaki, Ayaka Asano
  • Patent number: 11974418
    Abstract: This document describes a light-sealing gasket with crossbar force distribution. The gasket can be used in an electronic device with a sensor package that is capable of transmitting and receiving signals and is positioned behind a display of the device. The gasket provides a shield between the receive signals and the transmit signals, prevents signal crosstalk, and protects the delicate panel layer of the display. Use of this gasket in an electronic device allows manufacturers to add more features to the device and enrich the user experience.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: April 30, 2024
    Assignee: Google LLC
    Inventors: David I. Rosen, Matthew Douglas Dombach, James L Tanner, Warren Z. Jones, Timothy Patrick Barber
  • Patent number: 11974417
    Abstract: A shelter with electromagnetic interference (EMI) protection includes first and second wall panels including EMI protection. The panels are connected by at least one of: (i) a hinged connection; (ii) a scissor joint connection. The hinged connection includes an EMI protected hinge that extends between the first and second panels and includes a first hinge leaf, a second hinge leaf, and a hinge joint. A flexible EMI protection covering extends across the hinge joint. The scissor joint connection includes a first hook connected to the first panel and a second hook connected to the second panel and an EMI gasket is located in an open channel of the first hook. Part of the first hook is received in a second open channel of the second hook and part of the second hook is received in the first open channel of the first hook and the gasket is compressed.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: April 30, 2024
    Assignees: HDT Expeditionary Systems, Inc., Berg Companies, Inc.
    Inventors: Charles Deighton, Travis Lontz, Wade Milek, Brent Condie
  • Patent number: 11974419
    Abstract: Methods, systems, and apparatuses for electromagnetic shielding are provided, particularly for semiconductor packages and/or printed circuit boards. For example, an optical device covered by an RF can may be attached to a substrate. The RF can may have a first aperture for an optical path of the optical device. A deposition layer may provide electromagnetic shielding in conjunction with the RF can. The deposition layer may include one or more portions that are deposited at the same time, including a first portion with an aperture that narrows the aperture of the RF can. The deposition layer, after being deposited, may be cured. The deposition layer and RF can may provide electromagnetic shielding for the optical device.
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: April 30, 2024
    Inventors: Florian Perminjat, Karine Saxod, Etienne Brosse