Patents Examined by Hung V. Ngo
  • Patent number: 11751319
    Abstract: An electronic device is disclosed. The disclosed electronic device includes a printed circuit board including at least one through-hole, a holder which is positioned through the through-hole and protrudes upward and downward from the printed circuit board, and a solder layer for bonding one area of the holder to one surface of the printed circuit board.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: September 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Hyunwoo Chung
  • Patent number: 11751343
    Abstract: A modularly expandable electronic control unit comprises: an electronic circuit board on which a conductor track is disposed on a side in a region of lateral edges and enclosing an inner region and separating it from an outer region of the side, a housing having two halves for receiving the electronic circuit board. With the housing assembled, at least one housing half has an encircling electrically conductive shielding wall which rests on and establishes electrical contact with the conductor track and/or has at least one receptacle accessible from outside the assembled housing. The receptacle is disposed so the electronic module placed in the receptacle may be electrically connected to a module connection port disposed in the outer region of the electronic circuit board. The electronic circuit board has electrical connections between the module connection port and one or more electronic assemblies disposed on the inner region.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: September 5, 2023
    Assignee: Continental Automotive GmbH
    Inventors: Florian Von Reitzenstein, Christoph Kopp, Harsha Walvekar
  • Patent number: 11744026
    Abstract: An electrical enclosure including a housing having a plurality of side walls and a base, a housing cover positioned over, and secured to, the housing, a circuit board positioned between the housing and the housing cover, a plurality of connectors extending through the housing cover and the circuit board and into the housing, the plurality of connectors securing the housing cover and the circuit board to the housing, a first protrusion extending inwardly from a first side wall of the housing, and a second protrusion extending inwardly from a second side wall of the housing.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: August 29, 2023
    Assignee: Appleton Grp LLC
    Inventors: Darwin A. Villanueva, Valerie B. Comia, Mark Chester B. Nepomuceno, Joel Jeremiah G. Atienza, Klaus Weinmann
  • Patent number: 11744049
    Abstract: Disclosed are an electrical apparatus, a method for manufacturing an electrical apparatus, and a motor vehicle, and the electrical apparatus. In the apparatus, a chamber includes a first electrical element located at a first position and a second electrical element located at a second position, the first electrical element and the second electrical element having different heat dissipation characteristics. The electrical apparatus further includes a potting spacer, the potting spacer separating the chamber into two sub-chambers: a first sub-chamber and a second sub-chamber. The first electrical element is located in the first sub-chamber, and the second electrical element is located in the second sub-chamber.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: August 29, 2023
    Assignee: Valeo Siemens eAutomotive (Shenzhen) Co., Ltd.
    Inventors: Gongyuan Qu, Ronghui Li
  • Patent number: 11744055
    Abstract: An electrically conductive multilayer film for providing an electrical path between two conductive surfaces includes a plastic backing layer, an electrically conductive layer disposed on a first side of the plastic backing layer, and a recovery layer disposed on an opposite second side of the plastic backing layer. An average thickness of the multilayer film is less than about 100 microns. A hollow gasket can be formed from the multilayer film by winding or bending the multilayer film into a flexible hollow closed loop. When the multilayer film is wound to form a flexible closed loop having an outside diameter of no more than about 7 mm with the conductive layer forming an outside layer of the loop, a resistance of the closed loop across a diameter of the closed loop remains less than about 2? when the loop is compressed across the diameter by at least 20%.
    Type: Grant
    Filed: May 13, 2019
    Date of Patent: August 29, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Bing Huang, Su Zhang, Xin Zhang, Jing Fang, Fan Gao
  • Patent number: 11737225
    Abstract: A housing has electrically conductive top and bottom parts which together form an accommodation chamber. A circuit board is arranged in the accommodation chamber. A bottom side of the circuit board is connected electrically to the top side via conductive bores. The circuit board has circuit components and electromechanical plug components for connecting to components outside the housing. A first electrically conductive separating wall electrically connects the housing top part to the top side of the circuit board. A second electrically conductive separating wall electrically connects the housing bottom part to the bottom side of the circuit board. The first and second separating walls subdivide the accommodation chamber into first and second accommodation-chamber sections that are disposed on opposite sides of the first and second separating walls.
    Type: Grant
    Filed: June 15, 2022
    Date of Patent: August 22, 2023
    Assignee: Vitesco Technologies GmbH
    Inventors: Christian Pump, Detlev Bagung
  • Patent number: 11737204
    Abstract: A network device having improved thermal cooling is provided. The network device includes a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 22, 2023
    Assignee: ARISTA NETWORKS, INC.
    Inventors: Pranav Devalla, Harold Wang, Prasad Venugopal, Aravind Musunuri
  • Patent number: 11729897
    Abstract: The disclosed hybrid shielding structure may include a printed circuit board (PCB) that is to be overmolded with at least a portion of molding compound. The PCB may include various electronic components disposed thereon. The hybrid shielding structure may also include conductive trenches and conductive fences that are disposed on the PCB. The conductive trenches and the conductive fences may provide an electromagnetic shield for at least a portion of the electronic components of the PCB. The hybrid shielding structure may further include a conformal shielding and a PCB ground flood and ground layers. Various other systems, electronic devices, apparatuses, and methods of manufacturing are also disclosed.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: August 15, 2023
    Assignee: Meta Platforms Technologies, LLC
    Inventors: Qiuming Li, Ming Lei, Colden Niles Eldridge, Yeonsoo Ko
  • Patent number: 11729931
    Abstract: A metrology device includes a housing, a lower support structure, a PCB coupled to the lower support structure, and a cover coupled to the lower support structure and the housing. The housing supports the cover in three coordinate directions. The lower support structure includes a first pillar that supports the PCB and mechanically couples with the cover. The first pillar causes the PCB to stand off from the lower support structure and causes the cover to stand off from the PCB. The metrology device also includes a second pillar that extends from the lower support structure to a base to cause the lower support structure to stand off from the base. The cover has a non-circle shape, and a cross section of the housing at a same elevation of the housing as an elevation of the cover within the housing is a circle.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: August 15, 2023
    Assignee: Itron, Inc.
    Inventor: Kirby Kimble Nelson, III
  • Patent number: 11729958
    Abstract: An electromagnetically insulating device includes a body material, an electrically conductive EMI attenuation layer, and a plurality of conductive elements. The body material is substantially planar and flexible. The EMI attenuation layer is positioned inside the body material. The plurality of conductive elements are positioned in the body material. The EMI attenuation layer and the plurality of conductive elements are configured to be electrically connected to an external ground connection.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: August 15, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventor: Jesse William Sanders
  • Patent number: 11723165
    Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: August 8, 2023
    Assignee: APPLE INC.
    Inventors: David Pakula, Stephen Brian Lynch, Richard Hung Minh Dinh, Tang Yew Tan, Lee Hua Tan
  • Patent number: 11723181
    Abstract: An aspect of the present invention provides an electromagnetic wave absorption film that is less susceptible to the surrounding environment.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 8, 2023
    Assignee: LINTEC Corporation
    Inventor: Taiga Matsushita
  • Patent number: 11716837
    Abstract: Disclosed is an electromagnetic shielding film, including a supporting layer and N conductive layers. The supporting layer has a first side surface and a second side surface arranged oppositely, the N conductive layers are stacked on at least one of the first side surface and the second side surface, and N?2. Each of the N conductive layers includes a conductive grid, the conductive grid includes a conductive material filled in a grid-shaped trench, and at least two of the N conductive layers have conductive materials for shielding different bands, respectively. Different conductive layers have different conductive materials, and therefore can shield different bands, thereby broadening a shielding band of the electromagnetic shielding film, which can better meeting market demands.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: August 1, 2023
    Assignee: SHINE OPTOELECTRONICS (KUNSHAN) CO., LTD.
    Inventor: Sheng Zhang
  • Patent number: 11715941
    Abstract: An electrical box including a central housing with a first side opening, a second side opening opposite the first side opening, and a rear opening, each of the first and second side openings configured to receive an electrical or data interface device, a first extension compartment around the first side opening, the first extension compartment including a first door, a second extension compartment around the second side opening, the second extension compartment including a second door, and an exterior cover extending at least partially over the central housing, the first extension compartment, and the second extension compartment.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: August 1, 2023
    Assignee: HUBBELL INCORPORATED
    Inventors: Jian Hua Li, Joseph Nicholas Cretella
  • Patent number: 11708703
    Abstract: The present invention relates generally to the field of faraday cages. More specifically, the present invention relates to a carport tent faraday cage device. The device is primarily comprised of a tent body, further comprised of at least one roof frame, at least one wall frame, and at least one door. The tent body is comprised of three layers, an exterior layer, a middle layer, and an interior layer. Further, the tent body material has a middle layer that is comprised of a woven copper wire to prevent the electromagnetic radiation from entering the device. The device further is comprised of a grounding stake and a tether to direct the electrical current away from the device and into the ground. The device provides users with a device to store their vehicles, or other electronic devices without the risk of damage by electromagnetic radiation.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: July 25, 2023
    Inventor: Alan Zlataric
  • Patent number: 11710707
    Abstract: According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: July 25, 2023
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Hisashi Nishigaki, Atsushi Fujita, Shohei Tanabe, Yoshinao Kamo, Shigeki Matsunaka
  • Patent number: 11706908
    Abstract: A switchable wire includes filaments, each of which includes a heat-activated material layer that may be indirectly heated to change its state between different states having different electrical conductivity. In an example embodiment the indirect heating may be electrically resistance heating by passing electrical current through an electrically-resistive core of the filament. The heat passing through an electrically-insulative coating around the core, and into a heat-activated material layer around the electrically-insulative coating. The heat-activated material may be a chalcogenide material that is shiftable between a crystalline electrically-conducting state and an amorphous electrically-insulating state. The state of the material may be controlled by controlling the heating profile through controlling heating in the core. Many such filaments may be twisted together to form a switchable wire. Such wires may be used in any of a variety of devices where switchable electrical conductivity is desired.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: July 18, 2023
    Assignee: Raytheon Company
    Inventor: Catherine Trent
  • Patent number: 11700719
    Abstract: A housing wall includes at least one air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure. The first mesh structure is coextensively arranged with the second mesh structure. The first layer and the second layer are electrically conductively coupled. The first mesh structure includes a first plurality of through-holes. The second mesh structure includes a second plurality of through-holes. The through-holes of the first plurality of through-holes are misaligned compared to through-holes of the second plurality of through-holes such that a nonuniform total through-hole configuration of the air grid is provided.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: July 11, 2023
    Assignee: Rohde & Schwarz GmbH & Co. KG
    Inventors: Johannes Steffens, Josef Koeppl, Martin Kappels, Stefan Dannerbauer, Stefan Aman
  • Patent number: 11690207
    Abstract: In a magnetic shield material including a magnetic layer containing a magnetic material and an electrically conductive layer containing an electrically conductive material, the electrically conductive layer is designed to have a thickness corresponding to a frequency band of electromagnetic wave to be shielded. More specifically, the thickness of the electrically conductive layer (thickness of the aluminum foil in the drawing) is designed to have a thickness to maximize magnetic field shield effect of the magnetic shield material (thickness of the aluminum foil corresponding to peak value frequency in curve E in the drawing) in a frequency band of electromagnetic wave to be shielded. This makes it possible to obtain good magnetic field shield effect of the magnetic shield material in the frequency band of electromagnetic wave to be shielded.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: June 27, 2023
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Taichi Ishihara
  • Patent number: 11688918
    Abstract: An electromagnetically shielded or reflecting device having a film of shielding or reflecting material and a device for obtaining, in a dielectric material volume, selective propagation of electromagnetic radiation in predetermined frequency band.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: June 27, 2023
    Assignee: Software Defined Technologies, Inc.
    Inventors: Manichandra Morampudi, Ravishankar Sundararaman, Michael M. Salour