Patents Examined by Hung V. Ngo
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Patent number: 11917750Abstract: A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.Type: GrantFiled: February 17, 2020Date of Patent: February 27, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Huijuan Wang, Jinsen Cai, Bin Hu, Bo Kong, Tian Zhao
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Patent number: 11910544Abstract: A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.Type: GrantFiled: May 2, 2022Date of Patent: February 20, 2024Assignee: Vitesco Technologies USA, LLCInventors: Uwe Stephan, Donald J. Zito
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Patent number: 11910584Abstract: The present application relates to a composite material. The present application can provide a composite material having high magnetic permeability and also having excellent mechanical properties such as flexibility. The composite material may be used in various applications, and for example, may be used as an electromagnetic-wave shielding material and the like.Type: GrantFiled: September 27, 2019Date of Patent: February 20, 2024Assignee: LG CHEM, LTD.Inventors: Dong Woo Yoo, Yeon Soo Lee, Jin Kyu Lee
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Patent number: 11910583Abstract: An electromagnetic wave absorption structure includes at least one electromagnetic wave composite absorbing layer. The electromagnetic wave composite absorbing layer includes a conductive composite layer and an insulating layer. The insulating layer is stacked and overlapped with the conductive composite layer. The electromagnetic wave absorption structure can provide good electromagnetic wave absorption function, and have the features of light and thin, so it is particularly suitable for satisfying the electromagnetic wave absorption or shielding requirements of thin electronic products.Type: GrantFiled: August 19, 2021Date of Patent: February 20, 2024Assignee: BLACK SOLUTION NANOTECH CO., LTD.Inventor: Feng-Yu Wu
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Patent number: 11903122Abstract: An anti-interference circuit board and a terminal, where the anti-interference circuit board includes a substrate having a first surface and a first region for placing a magnetometer is disposed on the first surface. A plurality of circuit layers are disposed in the substrate in a stacked manner. The first functional circuit and the second functional circuit are disposed to compensate for interference to the magnetometer in the first region, and during disposing, the first functional circuit and the second functional circuit are located below the magnetometer to reduce an occupied surface area of the anti-interference circuit board.Type: GrantFiled: February 12, 2020Date of Patent: February 13, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Dong Huang
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Patent number: 11901712Abstract: An appliance includes a cabinet with a rear panel. The rear panel defines a recessed portion with an offset surface and an aperture defined on the offset surface. A power connector is disposed in the aperture. The power connector includes a cable engagement section configured to engage a power cable and a source engagement section opposing the cable engagement section. The source engagement section extends through the rear panel to engage a power receiver within the cabinet. A mounting flange is disposed between the cable engagement section and the source engagement section and operably couples to the offset surface. A cover is coupled to the rear panel over the recessed portion. The cover includes an outer rim and a body protruding outward from the outer rim. An opening is defined between a bottom section of the body and the rear panel through which the power cable is configured to extend.Type: GrantFiled: April 13, 2023Date of Patent: February 13, 2024Assignee: Whirlpool CorporationInventors: Murgyappa Mahadev Athani, Lingaraj I. Bandiwad, Jakub Buczkowski, Varun D. Kuvalekar, Rafal Serniak, Shaikh Meejanali Shoukatali, Scott Patrick Kokoska
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Patent number: 11903176Abstract: An electromagnetic emission shield for protecting a facility having a volume comprised of coal combustion residue. The shield includes a carbon-based material positioned inside an interior space of the coal combustion residue proximate to and interposed between a potential source of electromagnetic emission and the facility.Type: GrantFiled: October 20, 2022Date of Patent: February 13, 2024Assignee: GO TEAM CCR, LLCInventors: Francis Norbert Hector, Jr., Davidson A. Scott
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Patent number: 11903153Abstract: A display assembly for an imaging device including a display panel, a display, a first control unit, a second control unit and a thermally insulating layer, and a housing. The thermally insulating layer divides the housing in at least a first cavity including the first control unit and a second cavity including the second control unit. The thermally insulating layer preventing heat generated in the first cavity or the second cavity from reaching the other cavity and including an electrically conductive material to at least partially shield electromagnetic radiation generated in the first or the second cavity from reaching the other cavity.Type: GrantFiled: July 23, 2021Date of Patent: February 13, 2024Assignee: Ficosa Adas, S.L.U.Inventors: Daniel Abad Garcia, Xavier Armengol
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Patent number: 11895814Abstract: In an embodiment a device comprising for shielding electromagnetic radiation includes a lower protector mountable on a vehicle body, a conductive shielding structure mountable on the lower protector and conductively connectable to the vehicle body, a conductive shielding net wrapped around and attached to an outer surface of a high voltage wiring, the conductive shielding net attachable and conductively connectable with the conductive shielding structure and an upper protector attachable to the lower protector and configured to press the conductive shielding net to the conductive shielding structure.Type: GrantFiled: May 22, 2023Date of Patent: February 6, 2024Assignees: Hyundai Motor Corporation, Kia Corporation, Yura Corporation Co., Ltd.Inventors: Sam Gyun Lee, Dong Kyu Lim, Hong Gyu Jo, Kyeong Seop Song
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Patent number: 11882681Abstract: Disclosed are an electromagnetic shielding structure and a manufacturing method thereof, and an electronic product. The manufacturing method includes covering an injection mold on a circuit substrate, so that different circuit units on the circuit substrate are respectively accommodated in different injection molding cavities of the injection mold; injecting a non-conductive plastic sealant into the injection molding cavities so as to form non-conductive plastic sealing bodies on the circuit units, wherein spacing grooves are formed between the non-conductive plastic sealing bodies; and forming a conductive shielding layer on the non-conductive plastic sealing bodies, so that the conductive shielding layer covers the non-conductive plastic sealing bodies and fills the spacing grooves to form shielding barrier walls, thereby realizing shielding between the different circuit units in respective cavities.Type: GrantFiled: December 6, 2019Date of Patent: January 23, 2024Assignee: Weifang Goertek Microelectronics Co. Ltd.Inventors: Kaiwei Wang, Dewen Tian, Qinglin Song
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Patent number: 11882680Abstract: Embodiments of the present invention relate to electromagnetic interference (EMI) shielding structures. Rectangular EMI shielding panels are formed that include a first and second ends. A pair of rectangular EMI shielding panels are affixed orthogonal to each other at their first ends. The pair of rectangular EMI shielding panels are successively overlapped with each other to thereby form a plurality of interconnected EMI shielding planes. The pair of rectangular EMI shielding panels are affixed to each other at their second ends to form a helical EMI shielding structure that unfolds to an unfolded state and folds to a folded state along its center axis. Here, the plurality of interconnected EMI shielding planes are each angularly offset from each other about the center axis to form a helical structure when in the unfolded state. The EMI shielding panels include an encapsulating layer and/or metallic layer.Type: GrantFiled: November 14, 2022Date of Patent: January 23, 2024Assignee: VORBECK MATERIALS CORP.Inventors: Dan Scheffer, Kate Redmond, Trentice Bolar
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Patent number: 11875912Abstract: A shielded flat cable includes a plurality of ground lines disposed in a first plane, a pair of signal lines provided between the plurality of ground lines and disposed in the first plan, an insulating layer covering the plurality of ground lines and the pair of signal lines, and a shield layer covering the insulating layer. In a cross section perpendicular to a longitudinal direction, the plurality of ground lines include an adjacent ground line adjacent to one signal line of the pair of signal lines. A minimum distance between the pair of signal lines is smaller than a minimum distance between the adjacent ground line and the one signal line.Type: GrantFiled: March 25, 2021Date of Patent: January 16, 2024Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventor: Chiaki Kojima
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Patent number: 11871551Abstract: A RF (“Radio Frequency”) shielding container with an associated garment such as a jacket is described. The RF shielding container may be a pouch that holds and encapsulates an electronic mobile device such as a cell phone. The pouch is made of multiple layers of fabric including metalized layers that effectively block the reception and/or transmission of RF signals to and from the cell phone. A sealing mechanism formed on the pouch ensures the blockage of RF signals while offering ease of use while in combat. A garment such as a jacket or pants is designed to have internal pockets or cavities which can hold the RF shielding container. The RF shielding container may remain in the jacket during use, as well as when the mobile device is placed into or retrieved from the container.Type: GrantFiled: March 24, 2023Date of Patent: January 9, 2024Assignee: SLNT INC.Inventors: Aaron Zar, Byron Brodowicz
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Patent number: 11869717Abstract: A capacitor includes a capacitor element, a case housing the capacitor element, a filling resin filled in the case, and a board holder including a fixing part to which a circuit board mounted with an electronic circuit is to be fixed. The board holder is configured to hold the circuit board to be exposed from the filling resin.Type: GrantFiled: October 27, 2020Date of Patent: January 9, 2024Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Fumikazu Maeno, Toshihisa Miura, Eriko Kanatani
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Patent number: 11864330Abstract: A thermally isolating mounting boss for mechanically and electrically coupling a PCB to a chassis while thermally isolating the PCB from the chassis comprises a base section with a base surface coupled to the chassis and an isolation section comprising a plurality of pillars for thermally isolating the PCB from the chassis. A connector maintains the PCB in contact with the plurality of pillars, wherein the connector and the plurality of pillars form grounding circuits. The small cross-section area of each pillar and the cross-section area of the connector have increased thermal resistance to thermally isolate the PCB from the chassis. The pillars may extend from the base section or may be arranged radially outward of the base section.Type: GrantFiled: July 19, 2021Date of Patent: January 2, 2024Assignee: Dell Products L.P.Inventors: Qinghong He, Allen B. McKittrick
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Patent number: 11864365Abstract: An electromagnetic compatibility (EMC) housing having a first part and a second part for forming an enclosure when fitted together. The first and second parts include first and second interface surfaces respectively, for compressing a gasket interposed between the interface surfaces when the first and second parts are fitted together. At least one of the first and second interface surfaces includes a plurality of undercut regions for reducing compression of the gasket in the region when the first and second parts are fitted together.Type: GrantFiled: September 23, 2022Date of Patent: January 2, 2024Assignee: APTIV TECHNOLOGIES LIMITEDInventors: Janusz Duralek, Krzysztof Adamczyk
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Patent number: 11849856Abstract: A sleeping compartment with a sleeping region and an electrically conducting curtain, which can be arranged around the sleeping region, having a rail system by which the conducting curtain is mounted in a displaceable manner. The rail system includes at least one rail and a multiplicity of connecting elements, the connecting elements being connected to the conducting curtain and being mounted in the at least one rail in a displaceable manner. The rail system is configured such that the conducting curtain is connected to the at least one rail in an electrically conducting manner, preferably such that the conducting curtain is earthed by way of the rail.Type: GrantFiled: February 8, 2023Date of Patent: December 26, 2023Assignee: SH Immobilien GmbHInventor: Ernst Schwarzhans
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Patent number: 11856718Abstract: An arrangement includes a housing and a printed circuit board (PCB) arranged vertically above the housing. The housing includes: at least one protrusion attached to sidewalls and arranged on an outside of the housing at a lower end with at least one first through hole provided in the protrusion; holding devices each arranged inside a first through hole and/or between the PCB and the first through hole; and fastening elements configured to attach the housing to a heat sink or base plate. Each holding device is configured to clamp a corresponding fastening element such that the fastening elements are secured in defined positions, and to align each fastening element with a different first through hole. The PCB includes second through holes each arranged vertically above and aligned with a different fastening element. A diameter of each second through hole is less than the largest diameter of the respective fastening element.Type: GrantFiled: November 29, 2022Date of Patent: December 26, 2023Assignee: Infineon Technologies AGInventors: Alexander Herbrandt, Philipp Bräutigam, Andre Arens, Marco Ludwig
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Patent number: 11856742Abstract: The present disclosure relates to a self-curling shielding tube for improving workability of connecting or shielding a cable, securing high electromagnetic wave shielding performance, and minimizing weight and costs.Type: GrantFiled: November 19, 2019Date of Patent: December 26, 2023Assignee: LS CABLE & SYSTEM LTD.Inventors: Chang Suk Kim, Young Hoon Yang, Un Kyoo Park, Chang Eun Cho
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Patent number: 11843228Abstract: Provided is an electrical connection box 10 that includes a box main body 12 having a surface 14 provided with a component mounting portion 22 in which an electrical component 30 is mounted; and a cover member 16 covering the surface 14 of the box main body 12, in which an inner surface 48 of a top wall portion 42 of the cover member 16 is provided with a heat dissipation member holding portion 52 that protrudes toward the electrical component 30, and a plastic heat dissipation member 64 held by the heat dissipation member holding portion 52 is made to come into contact with a surface 66 of the electrical component 30.Type: GrantFiled: April 2, 2019Date of Patent: December 12, 2023Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventor: Kosuke Akiba