Patents Examined by Hung V. Ngo
  • Patent number: 11622483
    Abstract: A gradient electrically conductive-uniform thermally conductive dual network structure-based electromagnetic shielding polymer composite with low reflection and high absorption and a preparation method thereof. The electromagnetic shielding polymer composite includes a gradient conductive carbon nanotube network with a vertically oriented cell structure and a uniformly thermally conductive hexagonal boron nitride/carbon nanotube network constructed by the hexagonal boron nitride dispersed uniformly in the carbon nanotube network and the gradient carbon nanotube network. The gradient electrically conductive carbon nanotube network and the uniformly thermally conductive hexagonal boron nitride/carbon nanotube network form a composite synergistic dual function network structure so as to make the electromagnetic shielding polymer composite have a low reflection and high absorption and excellent thermal conductivity.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: April 4, 2023
    Assignees: NORTH UNIVERSITY OF CHINA, SHANXI ZHONGBEI NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Yaqing Liu, Hongji Duan, Guizhe Zhao
  • Patent number: 11612348
    Abstract: An electronic device includes a housing including a first cover member, a second cover member, and a side member enclosing a space between the first cover member and the second cover member; a support member coupled to or formed integrally with the side member; a printed circuit board disposed in the space and including a biometric circuit; a first conductive portion disposed at least partially in the side member; a second conductive portion and third conductive portion disposed at least partially in the second cover member and electrically connected to the printed circuit board; and at least one conductive path disposed in the space, configured to electrically connect the biometric circuit and the first conductive portion, and formed on the support member. The biometric circuit receives a biometric signal based on the first conductive portion, the second conductive portion, the third conductive portion, and the at least one conductive path.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: March 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hongki Kim, Injo Jeong, Youngjin Oh, Jungsoo Kim, Yongsang Yun, Chijeong Choi, Seonho Han
  • Patent number: 11612088
    Abstract: The present invention provides an anisotropic, thermal conductive, electromagnetic interference (EMI) shielding composite including a plurality of aligned polymer nanofibers to form a polymer mat or scaffold having a first and second planes of orientation of the polymer nanofibers. The first plane of orientation of the polymer nanofibers has a thermal conductivity substantially the same as or similar to that of the second plane, and the thermal conductivity of the first or second plane of orientation of the polymer nanofibers is at least 2-fold of that of a third plane of orientation of the polymer nanofibers which is about 90 degrees out of the first and second planes of orientation of the polymer nanofibers, respectively, while the electrical resistance of each of the first and second planes is at least 3 orders lower than that of the third plane. A method for preparing the present composite is also provided.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: March 21, 2023
    Assignee: Nano and Advanced Materials Institute Limited
    Inventors: Chi Ho Kwok, Mei Mei Hsu, Ka I Lee, Chenmin Liu
  • Patent number: 11603846
    Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 14, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Chia-Ying Hsu, Chia-Yu Yeh, Chi-Chang Teng
  • Patent number: 11602090
    Abstract: A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: March 7, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Yu-Fu Kuo, Jing-Jing Gong
  • Patent number: 11602091
    Abstract: The present application relates to an electromagnetic wave shielding film, which can provide an electromagnetic wave shielding film having excellent mechanical strength, flexibility, electrical insulation properties, bonding properties with other constituents, oxidation and high-temperature stability and the like, while having excellent electromagnetic shielding ability.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 7, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Jong Min Shin, Dong Woo Yoo, Jin Kyu Lee
  • Patent number: 11602042
    Abstract: An electronic apparatus includes a printed board and an electroconductive shield member disposed such as to cover a shield area which is a part of a front surface of the printed board. A wiring connecting an inside and an outside of the shield area is disposed on the front surface of the printed board. The shield member has an opening that connects an inside and an outside of the shield member, at a position where the wiring passes through an outer edge of the shield area, and that extends in an extending direction of the wiring. The opening is electrically connected to a conductor disposed on an opposite side of the wiring from the opening, and the opening and the conductor form a waveguide surrounding the wiring.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: March 7, 2023
    Assignee: Sony Interactive Entertainment Inc.
    Inventor: Kazuya Odagiri
  • Patent number: 11600977
    Abstract: A resin structure includes: a box-shape main body having multiple regions; and multiple lids assembled to the main body. The main body has a first partition wall extending to separate between a pair of the regions. A first one of the multiple lids covers one of the pair of the regions and has a second partition wall provided at its edge portion. A second one of the multiple lids covers the other of the pair of the regions and has a third partition wall provided at its edge portion. The first partition wall and the second partition wall are located to overlap each other in a thickness direction of the first partition wall to form a multi-layer wall structure, and the first partition wall and the third partition wall are located to overlap each other in the thickness direction to form a multi-layer wall structure.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: March 7, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Takaaki Kakimi, Masahiro Wada, Takao Nogaki, Kazuki Shoji, Takehisa Shimma
  • Patent number: 11591842
    Abstract: Lightweight, glidable shielded components (e.g. doors) may be used in conjunction with accredited enclosures to provide electromagnetic, acoustic and CBR protection.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: February 28, 2023
    Inventor: Marc Cordes
  • Patent number: 11589469
    Abstract: An electronic device is provided. The electronic device includes a housing, a fastened object, a fastener, and a base member. The housing includes a housing body and a bracket. The bracket is integrally formed on the housing body. The bracket includes a bracket stage, a bracket hole and a bracket recess. The bracket hole is formed on the bracket stage. The fastened object corresponds to the bracket stage. At least a portion of the base member is moveably inserted into the bracket recess. The base member includes a member fastening hole. The fastener passes through the fastened object and the bracket hole to connect to the member fastening hole of the base member.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: February 21, 2023
    Assignee: WISTRON NEWEB CORP.
    Inventors: Chun-Wei Wang, Che-Min Lin
  • Patent number: 11589468
    Abstract: An objective of the present invention is to improve the discharge capacity for liquid collected within a casing while suppressing liquid entering a discharge opening from the outside. A liquid discharge structure includes a plate-shaped bottom wall with a discharge opening for liquid, the liquid being collected inside a casing 1 which is configured to be installed in a vehicle, a blocking wall outside the bottom wall, wherein the blocking wall is overlapped with the discharge opening in a plan view on the bottom wall and opposed to the bottom wall with a gap between the blocking wall and the bottom wall, and a fixing mechanism which is disposed not to be overlapped with the discharge opening in the plan view, wherein the fixing mechanism is configured to fix the blocking wall relative to the bottom wall in an attachable and detachable manner.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: February 21, 2023
    Assignee: YAZAKI CORPORATION
    Inventors: Satoshi Yokoyama, Yusuke Nagai, Makoto Goto
  • Patent number: 11589485
    Abstract: A shield case including a base portion made of a nonmetal material and having a mounting surface on which the electronic component is mounted, a cover portion made of a metal material and covering surroundings of the electronic component and a metal plate abutting with an outer surface of the base portion and having an end portion projecting outward from the base portion. A side-wall end portion of the cover member includes a first end abutting with the mounting surface of the base portion, and a second end extending in a thickness direction of the base portion and abutting with the end portion of the metal plate.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: February 21, 2023
    Assignee: NISSAN MOTOR CO., LTD.
    Inventor: Tsutomu Yamazaki
  • Patent number: 11572959
    Abstract: The arrangement includes a pressure relief hatch for closing an opening in a wall in an electric cabinet, which. includes a body having an outer surface, an opposite inner surface, an outer perimeter, and a thickness. The body includes a centre portion with a first thickness, an intermediate portion with a second thickness, and an outer portion with a third thickness. The first thickness is greater than the third thickness and the second thickness decreases in a radially outward direction from the first thickness to the third thickness. A spring keeps the pressure relief hatch in a closed position in the opening during normal operation of the electric cabinet.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: February 7, 2023
    Assignee: ABB Schweiz AG
    Inventors: Pyry Hartikainen, Teemu Salmia, Hanna Rapinoja
  • Patent number: 11576286
    Abstract: A protective housing for shielding against electro-magnetic field (EMF) radiation includes a conductive mesh, a frame coupled to the conductive mesh and configured to define a shape of the conductive mesh, and a frame cover coupled to the frame and the conductive mesh, the frame cover including a main body coupled to the frame, a first swivel portion rotatably coupled to a first end of the main body, and a second swivel portion rotatably coupled to a second end of the main body, the first and second swivel portions corresponding to an entry of the protective housing.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: February 7, 2023
    Assignee: Denz Engineering Group, LLC
    Inventors: Navid Babhadiashar, Adam Teso, Linghao Gao
  • Patent number: 11575211
    Abstract: A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 7, 2023
    Assignee: Rockwell Collins, Inc.
    Inventors: Sean D. Howard, Julie M. Byrd, Eric Stewart, Raymond Y. Zheng
  • Patent number: 11570887
    Abstract: A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 31, 2023
    Assignee: Marvell Asia Pte, Ltd.
    Inventors: Shaowu Huang, Dance Wu
  • Patent number: 11564340
    Abstract: Example embodiments described in this disclosure are generally directed to a plastic enclosure that provides EMI shielding and heat sinking to an electronic assembly. In one embodiment, the enclosure includes a housing portion formed of a base material that includes a polymer containing graphene nanostructures and carbon nanostructures. The graphene nanostructures provide a thermal conductivity characteristic to the base material. A set of standoff elements made of the base material is provided inside the housing for mounting the electronic assembly. Heat generated by the electronic assembly is conducted out of the enclosure by the standoff elements due to the graphene nanostructures. The carbon nanostructures provide an electrical conductivity characteristic to the base material. A lid formed of the base material may be attached to the housing portion. The carbon nanostructures in the housing portion and the lid provide EMI shielding to the electronic assembly inside the enclosure.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: January 24, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Stuart Salter, Paul Kenneth Dellock, Thomas Hermann, Tye Winkel
  • Patent number: 11558987
    Abstract: The present disclosure relates to a radar apparatus including a circuit board provided inside a housing having an upper side open, and on which an RF element is mounted on an upper surface, and a cavity having an open lower side and coupled to the upper surface of the circuit board for accommodating the RF element, wherein the cavity includes a coupling portion extending downwardly in a region of a surface coupled to the circuit board, and the coupling portion is inserted into a coupling hole formed in the circuit board to contact a ground plane of the circuit board.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: January 17, 2023
    Assignee: HL KLEMOVE CORP.
    Inventor: KwanHo Kim
  • Patent number: 11553629
    Abstract: An electronic device including a shielding member for performing an electromagnetic interference (EMI) shielding function is provided. The electronic device includes a printed circuit board including a first area in which first electronic components having a first frequency as a driving frequency are mounted, and a second area in which second electronic components having a second frequency as a driving frequency are mounted, a shielding film disposed to cover the first area and the second area of the printed circuit board and attached to a first ground portion of the printed circuit board, and at least one conductive member formed to extend in a direction perpendicular to an extending direction of the printed circuit board. The at least one conductive member includes a first end that contacts the shielding film, and a second end that contacts a second ground portion of the printed circuit board, the second end being disposed between the first area and the second area of the printed circuit board.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: January 10, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myeonggil Lee, Hyein Park, Jangsun Yoo, Jaedeok Lim, Jihye Moon, Cheehwan Yang, Kwangyong Lee, Moonhee Lee
  • Patent number: 11551857
    Abstract: At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: January 10, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Min-Feng Chung, Meihua Chen, Po-I Wu