Patents Examined by Ida M. Soward
  • Patent number: 11456439
    Abstract: A light emitting element and a display device including the same are provided. The light emitting element includes a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, a protective layer surrounding an outer surface of at least one of the first semiconductor layer, the second semiconductor layer, and the active layer, and an insulating layer surrounding an outer surface of the protective layer. A surface of at least one of the first semiconductor layer, the second semiconductor layer, and the active layer includes a first lattice point, wherein the protective layer includes a first atom and a second atom, and wherein the first atom of the protective layer is at the first lattice point.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 27, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yun Hyuk Ko, Chang Hee Lee, Jin Oh Kwag, Keun Kyu Song, Yun Ku Jung, Sung-Chan Jo, Jae Kook Ha
  • Patent number: 11456374
    Abstract: The methods of manufacture of GeSiSn heterojunction bipolar transistors, which include light emitting transistors and transistor lasers and photo-transistors and their related structures are described herein. Other embodiments are also disclosed herein.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: September 27, 2022
    Inventor: Matthew H. Kim
  • Patent number: 11450834
    Abstract: A display device includes: multiple layers including a display element layer, the multiple layers including a sealing layer for covering the display element layer; and a polarization plate attached to a first layer and a second layer of the multiple layers with an adhesive layer. The multiple layers includes inorganic films and organic films. All of the inorganic films are disposed to avoid an edge area that is at least a part of a peripheral portion of the resin substrate. The polarization plate has an edge above the edge area of the resin substrate. The first layer is disposed to avoid the edge area of the resin substrate. The first layer at an edge has an upper surface sloping downward toward the edge area. The second layer has a portion in the edge area of the resin substrate and between the resin substrate and the adhesive layer.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: September 20, 2022
    Assignee: JAPAN DISPLAY INC.
    Inventor: Kazuhiro Odaka
  • Patent number: 11444265
    Abstract: A flexible display device includes a flexible display panel having a bending area to be folded, and including a display substrate, and a thin-film encapsulation layer above the display substrate, a driving portion, and a function layer below the flexible display panel, and including a step portion below which the flexible display panel is electrically connected to the driving portion.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: September 13, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Soohee Oh, Hyunggyu Park, Seonggeun Won, Hirotsugu Kishimoto
  • Patent number: 11444262
    Abstract: A display panel including a display area and a non-display area surrounding the display area, wherein the non-display area includes: a substrate, at least a part of a surface of the substrate being non-planar; and an inorganic layer conformally located on one side of the substrate and in contact with the at least a part of the surface.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: September 13, 2022
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Shilong Wang, Zhiliang Jiang, Li Song
  • Patent number: 11444263
    Abstract: A flexible display panel. The flexible display panel includes: a flexible substrate; a display element arranged on the flexible substrate; and a packaging layer covering the display element, the packaging layer including an inorganic thin film and an organic thin film that are stacked alternately, in which two protrusion structures that are engaged with each other are arranged between at least two adjacent thin films of the packaging layer.
    Type: Grant
    Filed: October 12, 2019
    Date of Patent: September 13, 2022
    Assignees: Ordos Yuansheng Optoelectronics Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Xiaodong Meng, Lingling Ma, Zihua Li, Zhibo Wen, Hengbo Liu, Yu Yuan, Lu Cai, Dong Xu, Guofang Xu, Xinpeng Gao, Qiang Wang, Ruiqing Zhang, Qiang Guo, Wenqiang Jin, Xudong Wang
  • Patent number: 11430968
    Abstract: A display device, including: a display panel including a light emitting element and an encapsulation layer covering the light emitting element; a color conversion panel overlapping the display panel, the color conversion panel including a color conversion element; a column spacer between the display panel and the color conversion panel; a filling layer filling a space between the display panel and the color conversion panel and surrounding the column spacer; and a buffer layer between the column spacer and the encapsulation layer of the display panel, the buffer layer including silicon oxycarbide (SiOxCy).
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: August 30, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yohan Kim, Jongjin Park, Won Min Yun, Seungju Lee, Sumin Jung, Young Cheol Joo, Yoon Hyeung Cho
  • Patent number: 11430740
    Abstract: Microelectronic devices with an embedded die substrate on an interposer are described. For example, a microelectronic device includes a substrate housing an embedded die. At least one surface die is retained above a first outermost surface of the substrate. An interposer is retained proximate a second outermost surface of the substrate.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 30, 2022
    Assignee: Intel Corporation
    Inventors: Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman, Amruthavalli Pallavi Alur
  • Patent number: 11424303
    Abstract: An array substrate may include a base substrate and a pixel defining layer on the base substrate. The pixel defining layer may include a plurality of thickness thinning regions. The thickness thinning regions may have a smaller height than other areas of the pixel defining layer on the base substrate. The plurality of the thickness thinning regions may be configured to guide flow of fillers to form an encapsulating layer on the pixel defining layer.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: August 23, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hongda Sun, Youngsuk Song, Zhen Song, Guoying Wang
  • Patent number: 11424309
    Abstract: The A substrate includes a base substrate, a wiring layer, a flexible layer, and a gate driver on array circuit, which are sequentially stacked from bottom to top. One side of the wiring layer is provided with a through hole penetrating the flexible layer to expose the gate driver on array circuit, so that the gate driver on array circuit is electrically connected to the wiring layer with the through hole.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 23, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Bin Xu, Hongyu Xu
  • Patent number: 11410897
    Abstract: A semiconductor structure includes a circuit carrier, a dielectric layer, a conductive terminal, a semiconductor die, and an insulating encapsulation. The circuit carrier includes a first surface and a second surface opposite to each other, a sidewall connected to the first and second surfaces, and an edge between the second surface and the sidewall. The dielectric layer is disposed on the second surface of the circuit carrier and extends to at least cover the edge of the circuit carrier. The conductive terminal is disposed on and partially embedded in the dielectric layer to be connected to the circuit carrier. The semiconductor die encapsulated by the insulating encapsulation is disposed on the first surface of the circuit carrier and electrically coupled to the conductive terminal through the circuit carrier.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih
  • Patent number: 11411201
    Abstract: A flexible organic light emitting diode display panel includes a substrate, a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer doped with copper or silver and is disposed on the substrate. A doping concentration of copper or silver in the first inorganic layer is 8-40 atom percent. The organic layer is disposed on the first inorganic layer. The second inorganic layer is doped with copper or silver and is disposed on the organic layer. A doping concentration of copper or silver in the second inorganic layer is 8-40 atom percent.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: August 9, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Wei Liu
  • Patent number: 11404341
    Abstract: A package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The conductive structures include elliptical columns. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die and the conductive structures.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: August 2, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin, Hsi-Kuei Cheng, Yi-Jen Lai
  • Patent number: 11398609
    Abstract: A display device includes a display panel including a main area, a bending area at which the display panel is bendable, and a sub area, in order. The main area includes a display area and a non-display area which is adjacent to the display area. The bending area connects the sub area to the main area at the non-display area thereof, and is recessed from outer side surfaces of the main area and the sub area, to define a recess portion of the display panel at the bending area.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: July 26, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seung Wook Kwon, Jeong Seok Lee, Chan Ho Moon, Woo Yong Sung
  • Patent number: 11398489
    Abstract: Some embodiments include apparatuses and methods having a substrate, a memory cell string including a body, a select gate located in a level of the apparatus and along a portion of the body, and control gates located in other levels of the apparatus and along other respective portions of the body. At least one of such apparatuses includes a conductive connection coupling the select gate or one of the control gates to a component (e.g., transistor) in the substrate. The connection can include a portion going through a portion of at least one of the control gates.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: July 26, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Toru Tanzawa, Tamotsu Murakoshi, Deepak Thimmegowda
  • Patent number: 11393871
    Abstract: A method for fabricating an array substrate, a display panel, and a display device is provided. The array substrate is divided into a plurality of pixel regions, and each of the pixel regions is provided with a pixel thin film transistor (TFT). At least one of the pixel regions is provided with a pressure component and a force TFT, the force TFT includes a first electrode, a second electrode and a control electrode, and the pressure component is connected to one of the first electrode and the control electrode of the force TFT. At least one of layer structures of the pixel TFT is disposed in the same layer as a corresponding layer structure of the force TFT.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: July 19, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yuzhen Guo, Xue Dong, Haisheng Wang, Chunwei Wu, Yingming Liu, Xiaoliang Ding, Xueyou Cao, Chihjen Cheng
  • Patent number: 11387284
    Abstract: A method of monitoring the closed system includes performing a page capturing on a web page of the closed system, searching from a captured page, according to configuration information of data to be monitored of the closed system, a text content corresponding to the data to be monitored, and converting the text content corresponding to the data to be monitored into monitored data which a system monitoring platform is capable of recognizing, and storing the monitored data.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: July 12, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Zhiqiang Jiao, Guangcai Yuan
  • Patent number: 11387296
    Abstract: A flexible display panel and a method of fabricating the same are provided. The flexible display panel has a display region and a bending region. The flexible display panel has a substrate, an organic pattern layer, layered structures, first holes, and second holes. The organic pattern layer is at the bending region and disposed on the substrate. The layered structures cover the organic pattern layer and the substrate located at the display region. The first holes pass through the layered structures and the organic pattern layer located at the bending region. The second holes pass through the layered structures located at the display region, wherein the second holes are adjacent to the bending region. When the bending portion is bent, the flexible display panel has a specific bending shape by disposing an organic pattern layer. Further, the first holes and the second holes are formed to balance stress.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: July 12, 2022
    Assignee: Wuhan China Star Optoelectronies Semiconductor Display Technology Co., Ltd.
    Inventor: Hong Gao
  • Patent number: 11380738
    Abstract: Inorganic and organic LEDs are integrated in a single chip. In an integrated multi-color micro-LED display panel, arrays of different color micro LEDs are integrated with corresponding driver circuitry. Some colors of micro LEDs are inorganic micro LEDs, and other colors are organic micro LEDs. Inorganic versus organic can be selected on the basis of efficiency, for example using inorganic micro LEDs for blue pixels and organic micro LEDs for red and green pixels. In one approach, an array of pixel drivers is first fabricated on a supporting substrate. Multiple strata of micro LEDs are then stacked on top of the base substrate. The strata containing inorganic micro LEDs are fabricated first, with one color per stratum. A single stratum containing all of the organic micro LEDs is then fabricated at the top of the stack.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: July 5, 2022
    Assignee: Hong Kong Beida Jade Bird Display Limited
    Inventors: Lei Zhang, Qiming Li, Fang Ou
  • Patent number: 11380873
    Abstract: A display panel and an electronic device are disclosed. The display panel includes a light-emitting layer, an encapsulation layer, and a touch layer. The light-emitting layer includes a plurality of pixel units and a plurality of isolating units disposed among the pixel units. The touch layer includes at least an insulating dielectric layer covering the encapsulation layer, and a plurality of touch units. The touch layer further includes a plurality of recessed portions disposed on the insulting dielectric layer and corresponding to the pixel units.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: July 5, 2022
    Assignee: Wuhan China Star Optoelectronies Semiconductor Display Technology Co., Ltd.
    Inventors: Weixin Ma, Caiqin Chen, Yu Zhao