Patents Examined by Ida M. Soward
  • Patent number: 11127788
    Abstract: A semiconductor device is provided. The semiconductor device has a semiconductor layer including a source/drain region, a first magnetic layer over the semiconductor layer, and a first dielectric layer over the source/drain region and adjacent the first magnetic layer. The semiconductor device has a metal structure extending through the first dielectric layer, a second magnetic layer over the metal structure, and a second dielectric layer over the first magnetic layer and adjacent the first dielectric layer.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: September 21, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Baohua Niu, Da-Shou Chen
  • Patent number: 11127797
    Abstract: A display device including: a sensor device; a display module to display an image and having a first through-hole in which the sensor device is positioned; and a bottom panel cover on one surface of the display module and having a second through-hole in which the sensor device is positioned. The first through-hole has breadth that increases from the one surface of the display module toward another surface of the display module opposite to the one surface of the display module.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: September 21, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jai Ku Shin, Dong Jin Park, Dong Woo Seo, Sung Chul Choi
  • Patent number: 11121342
    Abstract: A display panel includes a light-emitting substrate, an encapsulation layer, and a color filter substrate. The encapsulation layer includes at least a first nano-stack layer for reflecting light emitted from the color filter substrate. The first nano-stack layer includes a first inorganic layer and a first organic layer disposed in a stack arrangement, and the first organic layer having a refractive index less than a refractive index of the first inorganic layer. By using at least one first nano-stack provided in the encapsulation layer to reflect red and/or green light emitted from the color filter substrate, the present invention can reduce light loss of the red light quantum dot conversion unit and the green light quantum dot conversion unit due to scattering, and improve light output efficiency.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: September 14, 2021
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Yuanyuan Li
  • Patent number: 11121330
    Abstract: An organic light-emitting diode (OLED) display panel and a display device are provided. The OLED display panel includes a substrate, a driving circuit layer formed on a side of the substrate, a light-emitting material layer formed on a side of the driving circuit layer away from the substrate, a sensing unit formed on another side of the substrate away from the driving circuit layer and configured to receive light reflected by a fingerprint surface. In a fingerprint identifying region of the OLED display panel, the substrate includes a through hole, and the light emitted from the light-emitting material layer and reflected by the fingerprint surface travels through the through hole and arrivals the sensing unit.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: September 14, 2021
    Inventor: Wenqi Li
  • Patent number: 11114641
    Abstract: The present disclosure discloses a display panel. The display panel may include multiple thin film layers. The multiple thin film layers may include a first layer and a second layer adjacent to the first layer. The first layer may define a recess at a face toward the second layer. The second layer may include a protrusion at a face toward the first layer. The protrusion may be engaged in the recess. A diameter of a tip of the protrusion may be larger than a diameter of a root of the protrusion. A shape of a space in the recess may match with a contour of the protrusion.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: September 7, 2021
    Assignee: Bazhou Yungu Electronics Technology Co., Ltd.
    Inventors: Yiying Xu, Enting Zhao, Yuansheng Sun, Xiangwei Zhang
  • Patent number: 11114483
    Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: September 7, 2021
    Assignee: OmniVision Technologies, Inc.
    Inventors: Chien-Chan Yeh, Ying-Chih Kuo, Wei-Feng Lin, Chun-Sheng Fan
  • Patent number: 11107933
    Abstract: A two-terminal device (TTD) capable of preventing leakage current by using diffusion current having bidirectionality and generated due to a potential barrier by an insulator, and a lighting device using the TTD are disclosed.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: August 31, 2021
    Inventor: Teresa Oh
  • Patent number: 11107770
    Abstract: An improved chip package, and methods for fabricating the same are provided that utilize two tier packaging of an optical die and another die commonly disposed over a substrate. In one example, a chip package is provided that includes an optical die, a core die, and an electrical/optical interface die are all disposed over a common substrate. In one example, a first routing region is provided between the core and electrical/optical interface dies, a second routing region is provided between the electrical/optical interface die and the optical dies, and a third routing region is disposed between the substrate and the core and electrical/optical interface dies.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 31, 2021
    Assignee: XILINX, INC.
    Inventors: Suresh Ramalingam, Kun-Yung Chang, Yohan Frans, Chuan Xie, Mayank Raj
  • Patent number: 11108020
    Abstract: A flexible display panel and a display device. The flexible display panel includes a flexible substrate having a display area and a non-display area surrounding the display area; the display panel also includes at least one blocking wall located on the non-display area and surrounding the display area, a light-emitting structure located on the display area, and a packaging film covering the light-emitting structure and the blocking wall; the flexible display panel has a bending area and a non-bending area, and the thickness of the parts, in the bending area, of the blocking wall is not equal to the thickness of the parts, in the non-bending area, of the blocking wall.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: August 31, 2021
    Assignee: BOE Technology Group Co., Ltd.
    Inventor: Tao Wang
  • Patent number: 11108019
    Abstract: An organic light emitting diode (OLED) display panel includes a light transmitting area at least partially disposed in an electronic component setting area. A transparent filling layer, a built-in encapsulation layer, and a planarization layer are disposed in the light transmitting area. By providing the transparent filling layer in the light transmitting area to replace part of a film layer material, light transmittance is improved, and there is no technical problem that it is difficult to package. The built-in encapsulation layer reduces the speed at which water and oxygen penetrate the inside of a display panel through the transparent filling layer.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: August 31, 2021
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Jiangjiang Jin
  • Patent number: 11101445
    Abstract: A flexible OLED display device includes: a flexible substrate, a buffer layer, an OLED light emitting layer, and a thin film encapsulation layer; wherein a portion of the thin film encapsulation layer located in the non-display area has a thickness from a position close to the display area to a position away from the display area The flexible substrate and a portion of the thin film encapsulation layer located in the first bezel area and the second bezel area are bent along a direction away from the display surface.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: August 24, 2021
    Inventors: Kun Pan, Xiaoguang Zhu, Shoucheng Wang
  • Patent number: 11101186
    Abstract: A substrate structure includes a wiring structure and a supporter. The wiring structure includes a first dielectric structure, a first circuit layer, a second dielectric structure and a second circuit layer. The first circuit layer is disposed on the first dielectric structure. The second dielectric structure covers the first dielectric structure and the first circuit layer. A pad portion of the first circuit layer is exposed from the first dielectric structure, and the second circuit layer protrudes from the second dielectric structure. The supporter is disposed adjacent to the first dielectric structure of the wiring structure, and defines at least one through hole corresponding to the exposed pad portion of the first circuit layer.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: August 24, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee
  • Patent number: 11095763
    Abstract: A light-emitting device or a display device that is less likely to be broken is provided. Provided is a light-emitting device including an element layer and a substrate over the element layer. At least a part of the substrate is bent to the element layer side. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side. Alternatively, provided is a light-emitting device including an element layer and a substrate covering a top surface and at least one side surface of the element layer. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: August 17, 2021
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Yoshiharu Hirakata, Tomoya Aoyama, Akihiro Chida
  • Patent number: 11092857
    Abstract: Disclosed is a display device having a thin film transistor substrate, which may prevent afterimage and flicker defects by reducing the non-uniformity of an electric field. In the thin film transistor substrate, a pixel electrode includes a transparent edge electrode and a transparent inner electrode, which are spaced apart from each other with a first slit having a first width interposed therebetween, and a common electrode is exposed from the other-side end of the transparent edge electrode by a second width, which is smaller than the first width, in the width direction of a data line. As such, an inner area and an edge area in each sub pixel have uniform electric field distribution.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: August 17, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Do-Yeon Kim, Byung-Sam Min, Jong-Hyun Kim
  • Patent number: 11094913
    Abstract: A flexible organic light emitting diode (OLED) display panel is provided, including: a flexible base and an organic light emitting layer, a thin film encapsulating layer, a polarizer, a glass cover, and a sealing, heat-dissipation glue sequentially formed on the flexible base. The sealing, heat-dissipation glue is formed on sidewalls of the OLED display panel to prevent moisture from entering into the OLED display panel. The sealing, heat-dissipation glue includes heat absorbing particles; the heat absorbing particles are configured for absorbing heat generated by the OLED display panel.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: August 17, 2021
    Inventor: Xuesi Qin
  • Patent number: 11088079
    Abstract: A package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 10, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
  • Patent number: 11088037
    Abstract: A semiconductor device includes a substrate including a circuit region and an outer border, a plurality of detecting devices disposed over the substrate and located between the circuit region and the outer border, first and second probe pads electrically connected to two ends of each detecting device, and a seal ring located between the outer border of the substrate and the detecting devices. A method for detecting defects in a semiconductor device includes singulating a die having a substrate, a plurality of detecting devices, a first probe pad and a second probe pad electrically connected to two ends of each detecting device, and a seal ring; probing the first and the second probe pads to determine a connection status of the detecting devices; and recognizing a defect when the connection status of the detecting devices indicates an open circuit.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 10, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yang-Che Chen, Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu
  • Patent number: 11081448
    Abstract: Microelectronic devices including an embedded die substrate including a molded component formed on or over a surface of a laminated substrate that, provides a planar outer surface independent of the contour of the adjacent laminated substrate surface. The molded component may be formed over at least a portion of the embedded die. In other examples, the molded component and resulting planar outer surface may alternatively be on the backside of the substrate, away from the embedded die. The molded component may include an epoxy mold compound; and may be formed through processes including compression molding and transfer molding.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 3, 2021
    Assignee: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Rahul N. Manepalli, Praneeth Akkinepally, Jesse C. Jones, Yosuke Kanaoka, Dilan Seneviratne
  • Patent number: 11081434
    Abstract: The present disclosure is directed to systems and methods for improving the impedance matching of semiconductor package substrates by incorporating one or more magnetic build-up layers proximate relatively large diameter, relatively high capacitance, conductive pads formed on the lower surface of the semiconductor package substrate. The one or more magnetic layers may be formed using a magnetic build-up material deposited on the lower surface of the semiconductor package substrate. Vias conductively coupling the conductive pads to bump pads on the upper surface of the semiconductor package substrate pass through and are at least partially surrounded by the magnetic build-up material.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: August 3, 2021
    Assignee: Intel Corporation
    Inventors: Zhiguo Qian, Kaladhar Radhakrishnan, Kemal Aygun
  • Patent number: 11081664
    Abstract: This organic EL element has one blue light emitting unit, and has a continuous emission spectrum. The organic EL element has one or two peak wavelengths in a blue light wavelength range of 440 nm-490 nm within this emission spectrum, the correlated color temperature of white light is 3300K or greater, and according to a special color rendering index (Ri) of white light, R6 is 60 or greater and R12 is 30 or greater.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: August 3, 2021
    Assignee: XIANYANG CHVT NEW DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Junichi Tanaka, Mitsuru Morimoto