Patents Examined by Jacob Ziegler
  • Patent number: 5124212
    Abstract: Compositions which cure by UV radiation in less than one second are obtained by mixing an alkenyl containing polydiorganosiloxane, a mercapto functional crosslinker of the mercapto functional polyorganosiloxane or mercapto organic compounds, a photosensitizer, a viscosity stabilizer, and optionally a reinforcing agent. These compositions can be packaged in one container and can be used as the primary coating for optical fibers.
    Type: Grant
    Filed: March 16, 1990
    Date of Patent: June 23, 1992
    Assignee: Dow Corning Corporation
    Inventors: Chi-long Lee, Michael A. Lutz
  • Patent number: 5124410
    Abstract: Graft polymers are prepared by the free radical reaction of a base polymer such as polyethylene or polypropylene with an olefinic compound containing a tertiary alkyl ester group, which may be a simple carboxylic acid or a carbamic acid ester group. Upon melt blending or the like with polymers containing other functional groups, such as carboxy- or epoxy-functionalized polyphenylene ethers, the t-butyl groups are removed by thermal degradation and there are obtained copolymers which are useful to compatibilize blends of the corresponding polymeric constituents.
    Type: Grant
    Filed: July 19, 1990
    Date of Patent: June 23, 1992
    Assignee: General Electric Company
    Inventor: John R. Campbell
  • Patent number: 5118748
    Abstract: A phenylene oxide polymer composition comprising (1) a phenylene oxide polymer; (2) a styrene/ethylene butylene/styrene block copolymer; and (3) a hydrated metal oxide; wherein the ratio by weight of the phenylene oxide polymer to the styrene/ethylene butylene/styrene block copolymer ranges from 90:10 to 10:90 and the content of the hydrated metal oxide ranges from 50 to 300 parts by weight per 100 parts by weight of the total amount of the phenylene oxide polymer and styrene/ethylene butylene/styrene block copolymer. This composition shows a high fire retardancy and little fuming and is excellent in tensile strength, elongation, low-temperature brittleness and organic solvent resistance.
    Type: Grant
    Filed: March 7, 1990
    Date of Patent: June 2, 1992
    Assignee: Mitsubishi Cable Industries Ltd.
    Inventors: Toshinori Fujita, Takahiko Hirata
  • Patent number: 5118750
    Abstract: A repositionable pressure-sensitive adhesive comprising from about 70% to about 99% solid, polymeric, acrylate, inherently tacky, infusible, solvent-insoluble, solvent-dispersible, elastomeric microspheres comprising at least one alkyl acrylate or alkyl methacrylate ester; and at least one polar monomer, and correspondingly, from about 30% to about 1% of a binder copolymer comprising an elastomeric polymeric backbone having pendant therefrom high Tg polymeric moieties.
    Type: Grant
    Filed: April 20, 1990
    Date of Patent: June 2, 1992
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Spencer F. Silver, Roger W. Leinen, Joaquin Delgado
  • Patent number: 5116909
    Abstract: A flame-retardant injection-molding resin composition. The composition contains (A) 100 parts by weight of a flame-retardant resin composed of 30% to 80% by weight of styrene resin having a reduced viscosity of methyl-ethyl-ketone soluble portions of 0.2 to 0.55 dl/g in N,N-dimethylformamide at a concentration of 0.3 g/dl at 30.degree. C., and from 20% to 70% by weight of a polyvinyl chloride resin having a polymerization degree of from 400 to 800; and (B) 0.5 to 10 parts by weight of a copolymer of from 3% to 35% by weight of a vinyl cyanide compound, 30% to 97% by weight of an alkyl acrylate and 0% to 67% by weight of a vinyl monomer being copolymerizable with the vinyl cyanide compound and the alkyl acrylate. The flame-retardant injection-molding resin composition provides injection-molded articles of high impact strength and low delamination tendency and has excellent thermal stability, flame resistance and heat stability.
    Type: Grant
    Filed: March 9, 1990
    Date of Patent: May 26, 1992
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Ikuhiro Mishima, Kenji Nishimoto, Hideki Hosoi
  • Patent number: 5116906
    Abstract: Disclosed is a thermoplastic resin composition which is improved in compatibility between polyphenylene ether and thermoplastic polyester and is excellent in processability, solvent resistance, and impact strength.This composition comprises:100 parts by weight of a composition comprising (A) 5-95% by weight of a polyphenylene ether and (B) 95-5% by weight of a thermoplastic polyester,(C) 0.5-100 parts by weight of an aromatic polycarbonate resin,(D) 0-50 parts by weight of a rubber-like polymer, and(E) 0.01-10 parts by weight of an amino resin obtained by modifying with an alcohol an addition reaction product of formaldehyde and at least one compound selected from the group consisting of melamine, guanamine and urea.
    Type: Grant
    Filed: February 8, 1990
    Date of Patent: May 26, 1992
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Yukio Mizuno, Takashi Maruyama
  • Patent number: 5115028
    Abstract: Polymer blends are provided comprising a glassy thermoplastic polymer having a glass transition temperature above ambient conditions, e.g., normal room temperature and between 0.1 and 4.0 weight percent of a rubbery polymer having a glass transition temperature below ambient temperature conditions, e.g., normal room temperature based on the weight of the blend. The blends can be produced by solution casting or by coagulation from solution followed by flocculation.
    Type: Grant
    Filed: January 31, 1990
    Date of Patent: May 19, 1992
    Assignee: Massachusetts Institute of Technology
    Inventors: Osman S. Gebizlioglu, Robert E. Cohen, Ali S. Argon, Haskell W. Beckham, Jian Qin
  • Patent number: 5115044
    Abstract: High impact strength thermoplastic molding compositions based on polyphenylene ether graft copolymers and polyamides and process for producing them. The compositions are distinguished by high toughness, very good phase adhesion, high solvent resistance, and high dimensional heat stability. The molding compositions contain 70 to 250 parts of a polyamide and 100 parts of a graft copolymer that is prepared by the reaction of 100 parts of a polyphenylene ether with 0.1 to 6 parts of a mixture of 10 to 50 mole-% maleic anhydride and 90 to 50 mole-% of a vinylaromatic compound. The molding compositions are used for the production of industrial items such as pipes, panels, or cases, for example.
    Type: Grant
    Filed: August 14, 1989
    Date of Patent: May 19, 1992
    Assignee: Huels Aktiengesellschaft
    Inventor: Wolfgang Neugebauer
  • Patent number: 5112907
    Abstract: A novel thermoplastic resin composition excellent in heat resistance, impact resistance, hardness is provided which comprises 100 parts by weight of a composition comprising (A) 5-95% by weight of a polyphenylene ether prepared by oxidation polymerization of at least one phenol compound represented by the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 which may be identical or different and represent a hydrogen atom, a halogen atom, a substituted or unsubstituted hydrocarbon residue, with a proviso that at least one of them is a hydrogen atom and (B) 95-5% by weight of a polyamide and 5-100 parts by weight of (C) a copolymer of an ethylene-.alpha.-olefin copolymer rubber with an alkenyl aromatic compound and an unsaturated carboxylic acid or its anhydride. This composition may further contain 0.01-30 parts by weight of an epoxy compound (D) for 100 parts by weight of the composition of (A) and (B).
    Type: Grant
    Filed: November 6, 1989
    Date of Patent: May 12, 1992
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Taichi Nishio, Hideyuki Kuribayashi, Takashi Sanada
  • Patent number: 5112914
    Abstract: The present invention provides a resin composition excellent in solvent resistance, mechanical properties, heat resistance, and processability which comprises:100 parts by weight of a composition comprising (A) 5-94 wt % of a modified polyphenylene ether resin and (B) 95-5 wt % of a thermoplastic polyester,(C) 0-100 parts by weight of a rubber-like polymer, and(D) 0.01-10 parts by weight of an amino resin obtained by modifying with an alcohol an addition reaction product of formaldehyde and at least one compound selected from the group consisting of melamine, guanamine and urea.
    Type: Grant
    Filed: January 30, 1990
    Date of Patent: May 12, 1992
    Assignee: Sumitomo Chemical Co., Ltd.
    Inventors: Yukio Mizuno, Takashi Maruyama
  • Patent number: 5110873
    Abstract: A thermosetting resin composition comprising(A) 60 to 95% by weight of a prepolymer or precopolymer selected from the group consisting of (A-1), (A-2) and (A-3) below,(A-1) a prepolymer of diallyl phthalate,(A-2) a precopolymer of diallyl terephthalate derived from diallyl terephthalate of the following formula (1) ##STR1## and an aromatic benzyl hydrocarbon having at least one hydrogen atom at the benzyl position and represented by the following formula (2) ##STR2## wherein each of R.sup.1 and R.sup.2 represents a member selected from the class consisting of a hydrogen atom and lower alkyl groups, and n is an integer of 1 to 3, and(A-3) a mixture of (A-1) and (A-2), and(B) 40 to 5% by weight of a polyacrylate or polymethacrylate of dipentaerythritol having at least 4 acryloyl or methacryloyl groups in the molecule and represented by the following formula ##STR3## wherein each R.sup.3 represents a hydrogen atom, --COCH.dbd.CH.sub.2 or ##STR4## and at least four R.sup.3 groups represents --COCH.dbd.CH.sub.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: May 5, 1992
    Assignee: Osaka Soda Co., Ltd.
    Inventors: Yoshimi Kono, Sabee Maeda
  • Patent number: 5110871
    Abstract: A rubber composition having excellent cut resistance and chipping resistance comprises 1-30 parts by weight of a particular resin obtained by reacting a particular hydroxyl group-containing cyclopentadiene resin with a compound selected from polyisocyanate and/or polybasic acid or its anhydride or ester at a particular equivalent ratio, based on 100 parts by weight of rubber.
    Type: Grant
    Filed: August 2, 1990
    Date of Patent: May 5, 1992
    Assignees: Bridgestone Corporation, Nippon Oil Co., Ltd.
    Inventors: Hitoshi Kondo, Makoto Sasaki, Yukio Kobayashi
  • Patent number: 5109065
    Abstract: An improved thermoplastic composition is described, comprising polyphenylene ether resin, polyamide resin, a saturated aliphatic polycarboxylic acid, and a modified polyolefin such as an ethyleneethyl acrylate-g-maleimide copolymer.
    Type: Grant
    Filed: August 10, 1989
    Date of Patent: April 28, 1992
    Assignee: GE Plastics Japan, Ltd.
    Inventors: Akihiro Saito, Kazunari Inoue, Hiromi Ishida, Masataka Morioka
  • Patent number: 5109069
    Abstract: A hydrogenated diene copolymer resin composition comprising (A) 5-70% by weight of a hydrogenated diene copolymer which is a hydrogenation product of a random copolymer of at least one conjugated diene and 3-50% by weight of an alkenyl aromatic compound having a number average molecular weight of 5,000-1,000,000 and a molecular weight distribution (Mw/Mn) of 10 or less, the vinyl content in the diene portion of the random copolymer being 10-90%, at least 70% of the olefinic unsaturation of the random copolymer being hydrogenated, and (B) 95-30% by weight of at least one resin selected from the group consisting of a polypropylene resin, a polyphenylene ether resin and an alkenyl aromatic compound polymer resin.
    Type: Grant
    Filed: December 6, 1989
    Date of Patent: April 28, 1992
    Assignee: Japan Synthetic Rubber Co., Ltd.
    Inventors: Tooru Shibata, Toshio Teramoto, Yasuo Takeuchi, Kenya Makino, Masaaki Mawatari, Minoru Maeda, Shinichi Kimura, Minoru Hasegawa, Kunio Goshima, Mikio Takeuchi
  • Patent number: 5108842
    Abstract: Curable compositions containing a polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and bonding sheets therefor and having excellent physical and electrical properties.
    Type: Grant
    Filed: May 20, 1991
    Date of Patent: April 28, 1992
    Assignee: General Electric Company
    Inventors: John E. Hallgren, Victoria J. Eddy, James E. Tracy
  • Patent number: 5109068
    Abstract: There is disclosed a styrene-based polymer composition which comprises(A) 10 to 98% by weight of a styrene-based polymer having syndiotactic configuration with a racemic pentad of 30% or more and(B) 90 to 2% by weight of polyphenylene ether having an inrinsic viscosity of 0.28 dl/g or more at 30.degree. C. in chloroform.Also, a flame retarder, a flame-retardant aid, a rubber-like elastomer or an inorganic filler may optionally be added to the composition.Further, also disclosed is a stretched molding comprising stretching the above composition.
    Type: Grant
    Filed: August 2, 1989
    Date of Patent: April 28, 1992
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Komei Yamasaki, Keisuke Funaki, Akikazu Nakano, Takashi Sumitomo
  • Patent number: 5106912
    Abstract: Disclosed is an antistatic thermoplastic resin composition comprised of (A) 100 wt.parts of a thermoplastic resin and (B) 0.1-40 wt.parts of a polymer comprising 20-100 wt. % of units an anionic monomer represented by the formula (I): ##STR1## wherein R.sub.1 is H or --CH.sub.3, A.sub.1 is ##STR2## in which n is 0, 1 or 2, ##STR3## in which B is an alkylene, arylene or aralkylene group which may have an ester bond, or ##STR4## in which B is as defined above and R.sub.6 is H or an alkyl group, or A.sub.1 is ##STR5## X is N or P, and R.sub.2, R.sub.3, R.sub.4 and R.sub.5 independently represent an alkyl, aryl or aralkyl group may have a substituent,and 80-0 wt. % of units of a copolymerizable vinyl or vinylidene monomer.
    Type: Grant
    Filed: September 11, 1990
    Date of Patent: April 21, 1992
    Assignee: Mitsubishi Rayon Company, Ltd.
    Inventors: Naoki Yamamoto, Hiroki Hatakeyama
  • Patent number: 5106918
    Abstract: A method for dispersing a second polymer within a first polymer is disclosed, the polymers being mutually miscible and when blended exhibit lower critical solution temperature (LCST) type behavior. The first and second polymers are blended together at a temperature for easy processing and then phase separated at a temperature above the LCST of the blended polymer pair. The phase separated polymers are then cooled to a temperature wherein the polymer pair become fixed in the phase separated state.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: April 21, 1992
    Assignee: The B. F. Goodrich Company
    Inventors: Frank E. Karasz, Wansoo Huh
  • Patent number: 5106919
    Abstract: Compatible mixtures of styrene copolymers of type SAN (AES, ABS, SAN) with polyglutarimides, characterized in that the polyglutarimides are prepared by imidization of poly(meth)acrylates and/or poly(meth)acrylic acid with amides of formulaX--Z--NHRwhereX=H, hydrocarbyl or, when ##STR1## a --NHR radical or a --Y--CO--NHR radical; R=aryl; ##STR2## --C.sub.6 H.sub.4 --SO.sub.2. The mixtures composed of SAN copolymers and N-aryl polyglutarimides having a Tg of at least 140.degree. C. are claimed as new mixtures.
    Type: Grant
    Filed: February 7, 1990
    Date of Patent: April 21, 1992
    Assignee: Mountedipe S.r.l.
    Inventors: Luciano Canova, Giorgio Giannotta, Enrico Albizzati
  • Patent number: 5106696
    Abstract: A compatibilized polymer alloy has been developed which has excellent processability under thermoforming conditions and the molded articles produced from the alloy exhibit superior gloss, shrinkage, surface hardness, polarity, strength and high heat distortion. The alloy is, in general, comprised of a polyolefin composition, a polystyrene copolymer, or polymer blend, and a compatibilizing agent. This polymer composition or alloy is particularly useful in producing packaging materials and food containers.
    Type: Grant
    Filed: November 15, 1988
    Date of Patent: April 21, 1992
    Assignee: Ferro Corporation
    Inventors: Deenadayalu Chundury, Anthony S. Scheibelhoffer