Abstract: Memory arrays employing flying bit lines to increase effective bit line length for supporting higher performance, increased memory density, and related methods. To increase memory density, the memory array has a first memory sub-bank and one or more second memory sub-banks. The first memory sub-bank includes a first bit line(s) for each of its memory column circuits. To avoid the need to extend the length of the first bit lines to be coupled to the second memory bit cells in the second memory sub-bank, each memory sub-bank has its own dedicated first and second bit lines coupling their respective memory bit cells to access circuitry. The second bit lines effectively “fly” independent of the first bit lines of the first memory sub-bank. The first bit lines of the first memory sub-bank do not have to be extended in length to provide bit lines for the second memory sub-bank.

Abstract: The memory device includes a plurality of dies, and each die includes a plurality of blocks with a plurality of word lines. Some of the word lines are arranged in a plurality of exclusive OR (XOR) sets with each XOR set containing word lines in the same positions across the plurality of dies. The memory device further includes a controller that is configured to program the word lines of the blocks of at least one of the dies in a first programming direction. The controller is further configured to program the word lines of the blocks of at least one other die in a second programming direction that is opposite of the first programming direction.

Abstract: According to One embodiment, a semiconductor memory device includes: a first memory cell array; a second memory cell array arranged above the memory cell array; a third memory cell array arranged adjacent to the first memory cell array; a fourth memory cell array arranged above the third memory cell array and arranged adjacent to the second memory cell array; a first word line coupled to the first memory cell array and the second memory cell array; a second word line coupled to the third memory cell array and the fourth memory cell array; a first bit line coupled to the first memory cell array and the fourth memory cell array; and a second bit line coupled to the second memory cell array and the third memory cell array.

Abstract: A semiconductor device capable of obtaining the threshold voltage of a transistor is provided. The semiconductor device includes a first transistor, a first capacitor, a first output terminal, a first switch, and a second switch. A gate and a source of the first transistor are electrically connected to each other. A first terminal of the first capacitor is electrically connected to the source. A second terminal and the first output terminal of the first capacitor are electrically connected to a back gate of the first transistor. The first switch controls input of a first voltage to the back gate. A second voltage is input to a drain of the first transistor. The second switch controls input of a third voltage to the source.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for scheduling targeted refreshes in a memory device. Memory cells in a memory device may be volatile and may need to be periodically refreshed as part of an auto-refresh operation. In addition, certain rows may experience faster degradation, and may need to undergo targeted refresh operations, where a specific targeted refresh address is provided and refreshed. The rate at which targeted refresh operations need to occur may be based on the rate at which memory cells are accessed. The memory device may monitor accesses to a bank of the memory, and may use a count of the accesses to determine if an auto-refresh address or a targeted refresh address will be refreshed.

Abstract: The semiconductor memory device of the embodiment includes: a substrate; a first memory pillar extending in a first direction from the substrate, the first memory pillar including first memory cell transistors, a first selection transistor, a second selection transistor, second memory cell transistors, a third selection transistor, a fourth selection transistor, third memory cell transistors, a fifth selection transistor, a sixth selection transistor, fourth memory cell transistors, a seventh selection transistor, and an eighth selection transistor; a first select gate line; first word lines; a second select gate line; a third select gate line; second word lines; a fourth select gate line; a fifth select gate line; third word lines; a sixth select gate line; a seventh select gate line; fourth word lines; and an eighth select gate line.

Abstract: A nonvolatile memory device includes a memory cell array and a control unit. The memory cell array includes a plurality of memory regions coupled to a plurality of word lines. The plurality of memory regions include first and second memory regions coupled to upper and lower word lines, respectively. The control logic performs, after receiving first data and second data, a first program operation on the first memory region to store the first data and a second program operation on the second memory region to store the second data.

Abstract: A method for operating a memory device is provided. The method includes providing a high voltage signal to a memory cell array including a plurality of memory cells using a first wiring, providing a logic signal to the memory cell array using a second wiring, and providing a shielding signal to the memory cell array using a third wiring arranged between the first wiring and the second wiring. A highest voltage level of the logic signal is lower than a highest voltage level of the high voltage signal, and the shielding signal includes a negative first voltage level in a first mode and a positive second voltage level in a second mode.

Abstract: Systems, methods, and apparatuses relating to interlocking transistor active regions are disclosed. An apparatus includes a gate including electrically conductive material and an active material including a doped semiconductor material. A portion of the active material overlapped by the gate has an at least substantially triangular shape. An apparatus includes a plurality of active materials. Each active material includes tapered ends and a plurality of gates. The plurality of active materials is arranged in an interlocking pattern with at least some tapered ends of the active materials interlocking with at least some others of the tapered ends. The plurality of gates overlaps the interlocked tapered ends of the plurality of active materials.

Abstract: A memory circuit which includes: A synchronous memory cell array, configured to receive a clock signal and having address lines and bit lines. A margin agent, determining a status of the synchronous memory cell array based on a time duration between a transition of the clock signal and a change on a signal derived from a bit line due to a signaling on at least one of the address lines. In another aspect, a memory cell, having a bit line configured to provide data input/output to the memory cell may be provided with a comparator, comparing a voltage on the bit line with a reference voltage and indicating of a status of the memory cell thereby. Firmware may receive the indication of the status of a memory cell array, and transmit the indication, issue an alert, and/or reconfigure the memory circuit responsive to the status.

Abstract: A memory device, and a method of operating the memory device, includes a memory block in which a plurality of cell pages are coupled to each of word lines. The memory device also includes a peripheral circuit configured to adjust a time point at which a verify voltage is applied to a selected word line among the word lines according to an order of performing a program operation during a verify operation of a selected cell page. The memory device further includes a control logic circuit configured to transmit, to the peripheral circuit, an operation code for adjusting a time point at which the verify voltage is output.

Abstract: A memory device includes a memory cell array, a row address decoder configured to generate a plurality of main word line driving signals and a plurality of sub word line driving signals, based on an odd signal representing that a main word line driving signal driving an odd word line is activated, generate a plurality of encoded sub word line driving signals used for driving a target word line by outputting the plurality of sub word line driving signals in a first order, and, based on an even signal representing that a main word line driving signal driving an even word line is activated, generate the plurality of encoded sub word line driving signals by outputting the plurality of sub word line driving signals in a second order, and a word line driving circuit configured to drive the target word line at a first voltage level or a second voltage level.

Abstract: Stochastic or near-stochastic physical characteristics of resistive switching devices are utilized for generating data distinct to those resistive switching devices. The distinct data can be utilized for applications related to electronic identification or random number generation. As one example, data generated from physical characteristics of resistive switching devices on a semiconductor chip can be utilized to form a distinct identifier sequence for that semiconductor chip, utilized for verification applications for communications with the semiconductor chip or utilized for generating cryptographic keys or the like for cryptographic applications.

Abstract: Memories might include an array of memory cells and a controller for access of the array of memory cells. The controller might be configured to cause the memory to initiate an array operation on the array of memory cells, indicate an unavailability to initiate a next array operation, append a delay interval to an array access time of the array operation, and indicate an availability to initiate a next array operation in response to a completion of the delay interval. The delay interval might have a duration determined in response to an indication of temperature.

Abstract: A nonvolatile memory device includes a memory cell array, a voltage generator, a voltage path circuit and a wordline defect detection circuit. The memory cell array includes memory cells and wordlines connected to the memory cells. The voltage generator generates a wordline voltage applied to the wordlines. The voltage path circuit between the voltage generator and the memory cell array transfers the wordline voltage to the wordlines. The wordline defect detection circuit is connected to a measurement node between the voltage generator and the voltage path circuit. The wordline defect detection circuit measures a path leakage current of the voltage path circuit based on a measurement voltage of the measurement node to generate an offset value corresponding to the path leakage current in a compensation mode and determines defect of each wordline of the wordlines based on the offset value and the measurement voltage in a defect detection mode.

Abstract: According to one embodiment, a memory system includes a semiconductor memory device including a memory cell capable of holding at least 4-bit data and a controller configured to control a first write operation and a second write operation based on the 4-bit data. The controller includes a conversion circuit configured to convert 4-bit data into 2-bit data. The semiconductor memory device includes a recovery controller configured to recover the 4-bit data based on the converted 2-bit data and data written in the memory cell by the first write operation. The first write operation is executed based on the 4-bit data received from the controller, and the second write operation is executed based on the 4-bit data recovered by the recovery controller.

Abstract: According to one embodiment, a memory device includes a first chip and a second chip provided over the first chip. The first chip includes a first substrate, a first electrode, and a first memory cell array provided between the first substrate and the first electrode. The second chip includes a second substrate, a second electrode in contact with the first electrode, and a second memory cell array provided between the second substrate and the second electrode.

Abstract: A semiconductor memory device includes: a first semiconductor layer extending in a first direction; a first conductive layer and a second conductive layer that are arranged in the first direction and each opposed to the first semiconductor layer; a first insulating portion disposed between the first semiconductor layer and the first conductive layer, the first insulating portion containing oxygen (O) and hafnium (Hf); a second insulating portion disposed between the first semiconductor layer and the second conductive layer, the second insulating portion containing oxygen (O) and hafnium (Hf); and a first charge storage layer disposed between the first insulating portion and the second insulating portion, the first charge storage layer being spaced from the first conductive layer and the second conductive layer.

Abstract: An in-memory computation (IMC) circuit includes a memory array formed by memory cells arranged in row-by-column matrix. Computational weights for an IMC operation are stored in the memory cells. Each column includes a bit line connected to the memory cells. A biasing circuit is connected between each bit line and a corresponding column output. A column combining circuit combines and integrates analog signals at the column outputs of the biasing circuits. Each biasing circuit operates to apply a fixed reference voltage level to its bit line. Each biasing circuit further includes a switching circuit that is controlled to turn on for a time duration controlled by asps comparison of a coefficient data signal to a ramp signal to generate the analog signal dependent on the computational weight. The ramp signal is generated using a reference current derived from a reference memory cell.

Abstract: In a memory array with a cross-point structure, at each cross-point junction a programmable resistive memory element, such as an MRAM memory cell, is connected in series with a threshold switching selector, such as an ovonic threshold switch. The threshold switching selector switches to a conducting state when a voltage above a threshold voltage is applied. When powered down for extended periods, the threshold voltage can drift upward. If the drift is excessive, this can make the memory cell difficult to access and can disturb stored data values when accessed. Techniques are presented to determine whether excessive voltage threshold drift may have occurred, including a read based test and a time based test. Techniques are also presented for initializing a cross-point array, for both first fire and cold start, by using voltage levels shifted from half-select voltage levels used in a standard memory access.