Abstract: A method to perform an on demand refresh operation of a memory sub-system is disclosed. The method includes identifying a temporal attribute of user data stored in the memory component, upon determining that the identified temporal attribute satisfies a time condition, providing an indication whether a refresh operation of the user data improves performance of the memory component, receiving an indication to perform the refresh operation of the memory component, and responsive to a time between the refresh operation and a previously performed refresh operation not satisfying a threshold criterion, refraining from performing the refresh operation of the memory component.

Abstract: A nonvolatile memory device includes a memory block with an unused line connected to dummy cells and used lines connected to normal cells, and a controller which applies an erase voltage to the memory block, applies an unused line erase voltage to the unused line, and applies a word line erase voltage to the used lines during an erase operation. The dummy cells are not programmed during a program operation while the normal cells are programmed, the unused line erase voltage transits from a first voltage to a floating voltage at a first time point, and the controller reads the dummy cells and controls at least one of the magnitude of the first voltage and the first time point based on the result of reading the dummy cells.

Abstract: A semiconductor memory device includes a memory block, a plurality of bit lines, a plurality of select gate lines, a plurality of word lines, and a controller. The memory block includes a plurality of memory strings, each memory string including a selection transistor and a plurality of memory cells. The plurality of bit lines are arranged in the first direction and connected to the respective memory strings. The plurality of select gate lines are arranged in the second direction and connected to gates of the respective selection transistors of the memory strings. The plurality of word lines are arranged in the third direction and connected to gates of the respective memory cells of the memory strings. The controller is configured to perform an erase operation in a unit of the memory block, and perform a sequence of erase verify operations.

Abstract: According to one embodiment, a memory system includes n memory cells, each capable of storing j bits of data; and a controller. The controller is configured to write a first portion of each of first data to n-th data from among n×j data with consecutive logical addresses to the n memory cells one by one. The first data has a lowest logical address among the n×j pieces of data. The first data to the n-th data have ascending consecutive logical addresses. The controller is configured to write the first portion of one of the first to n-th data as a first bit of the j bits, and write the first portion of another one of the first to n-th data except said one of the first to n-th data as a second bit of the j bits.

Abstract: Embodiments of erasing methods for a three-dimensional (3D) memory device are disclosed. The 3D memory device includes multiple decks vertically stacked over a substrate, wherein each deck includes a plurality of memory cells. The erasing method includes checking states of the plurality of memory cells of an erase-inhibit deck and preparing the erase-inhibit deck according to the states of the plurality of memory cells. The erasing method also includes applying an erase voltage at an array common source, applying a hold-release voltage on unselected word lines of the erase-inhibit deck, and applying a low voltage on selected word lines of a target deck.

Abstract: A memory controller includes, in one embodiment, a memory interface and a controller circuit. The memory interface is configured to interface with a memory interface configured to interface with a memory having a plurality of memory blocks. Each memory block has a plurality of strings. The controller circuit is configured to perform a string defect leakage check on one of the memory blocks during a first programming operation of the one memory block, determine whether the one memory block has one or more string to string shorts based on the string defect leakage check, and resolve the string to string shorts in response to determining that the one of the memory blocks has the string to string shorts.

Abstract: According to the one embodiment, a memory system includes a semiconductor memory device and a memory controller. The semiconductor memory device includes: first and second memory cells stacked above a substrate; a first word line coupled to the first and second memory cells; a first bit line coupled to the first memory cell; and a second bit line coupled to the second memory cell. A first state read operation includes a first read operation for reading data from the first memory cell and a second read operation for reading data from the second memory cell. A first read voltage is applied to the first word line during a first period for executing the first read operation, and a second read voltage is applied to the first word line during a second period for executing the second read operation.

Abstract: A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.

Abstract: A memory system includes a nonvolatile memory configured to execute one of a plurality of read operations, including a first read operation and a second read operation, and a memory controller configured to issue a read command to the nonvolatile memory to cause the nonvolatile memory to execute one of the plurality of read operations. The memory controller is configured to receive a read request, estimate a reliability level of a result of a read operation to be executed by the nonvolatile memory to read data from a physical address specified in the read request, select one of the first and second read operations to be executed first in a read sequence corresponding to the read request by the nonvolatile memory based on the estimated reliability level, and instruct the nonvolatile memory to execute the selected read operation.

Abstract: Storage device programming methods, systems and media are described. A method may include encoding data to generate an encoded set of data. A first programming operation may write the encoded set of data to a memory device. The method includes encoding, using a second encoding operation based on the data, to generate a second set of encoded data. The second set of encoded data is stored to a cache. A first decoding operation is performed, based on the second set of encoded data and the encoded set of data, to generate a decoded set of data. A second decoding operation is performed to generate a second decoded set of data. The second decoded set of data is encoded to generate a third set of encoded data. The method includes performing a second programming operation to write the third set of encoded data to the memory device.

Abstract: A memory device configured to perform a program operation and a backup operation together includes a memory block including a main sub block including selected memory cells in which program data is programmed among a plurality of memory cells respectively connected to a plurality of word lines, and a backup block in which page data included in the program data is backed up, a peripheral circuit configured to perform a plurality of program loops to program the program data in the selected memory cells, and control logic configured to control the peripheral circuit to back up any one of the page data while programming the selected memory cells in preset program loops among the plurality of program loops.

Abstract: Provided herein may be a semiconductor memory device and a method of operating the semiconductor memory device. The semiconductor memory device may include: a memory block including upper pages, a center page, and lower pages; a peripheral circuit configured to perform a read operation on the memory block; and a control logic configured to control the peripheral circuit to perform the read operation and control the peripheral circuit such that, during the read operation, based on a location of a selected page among the plurality of pages, a pass voltage to be applied to first adjacent pages disposed adjacent to the selected page in a first direction differs from a pass voltage to be applied to second adjacent pages disposed adjacent to the selected page in a second direction.

Abstract: Techniques to couple a high bandwidth memory device on a silicon substrate and a package substrate are disclosed. Examples include selectively activating input/out (I/O) or command and address (CA) contacts on a bottom side of a logic layer for the high bandwidth device based on a mode of operation. The I/O and CA contacts are for accessing one or more memory devices include in the high bandwidth memory device via one or more data channels.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: sub-blocks divided with respect to a buffer page in which buffer cells are included; a voltage generator for, in a program operation of a selected sub-block among the sub-blocks, applying a first pass voltage to unselected word lines connected to the selected sub-block, and applying a second pass voltage lower than the first pass voltage to unselected word lines connected to an unselected sub-block; and a buffer line circuit for selectively turning on or turning off the buffer cells by selectively applying a turn-on voltage or a turn-off voltage to buffer lines connected to the buffer cells. A position of the buffer page is set as a default according to a physical structure of memory cells included in the sub-blocks, and is reset according to an electrical characteristic of the memory cells.

Abstract: A method for detecting a “slow to erase” condition of a non-volatile memory structure, wherein the method comprises initiating an erase/verify memory operation with respect to the memory structure, wherein the erase/verify memory operation comprises applying an erase verify voltage according to an alternating word line scheme; following the erase/verify memory operation, determining if a first bit scan mode criteria is satisfied; and, if the first bit scan mode criteria is satisfied, initiating a read/verify memory operation wherein, the read/verify memory operation comprises applying a read-pass voltage according to an all word line scheme, and a magnitude of the read-pass voltage is greater than a magnitude of the erase verify voltage. Following the read/verify memory operation, the method also comprises determining if a second bit scan mode criteria is satisfied and, if the criteria is not satisfied, designating the memory structure with a fail status.

Abstract: Crossbar arrays with reduced disturbance and methods for programming the same are disclosed. In some implementations, an apparatus comprises: a plurality of rows; a plurality of first columns; a plurality of second columns; a plurality of devices. Each of the plurality of devices is connected among one of the plurality of rows, one of the plurality of first columns, and one of the plurality of second columns. The device further comprises a shared end on the plurality of first columns or the plurality of the second columns connecting to the plurality of the devices in the same row or column; the shared end is grounding or holds a stable voltage potential. In some implementations, one of the devices is: a RRAM, a floating date, a phase change device, an SRAM, a memristor, or a device with tunable resistance. In some implementations the stable voltage potential is a constant DC voltage.

Abstract: Methods of operating a memory device are disclosed. A method may include receiving a write command, and in response to the write command, performing a write operation without precharging a local input/output line subsequent to receipt of the write command and prior to performing the write operation. Another method may include receiving a read command, performing a read operation in response to the read command, and receiving an additional command without precharging the local input/output line subsequent to performing the read operation and prior to receiving the additional command. Memory devices and systems are also disclosed.

Abstract: A semiconductor device is provided which includes: a first group including a plurality of first memory blocks; a second group including a plurality of second memory blocks; a first common source line connected to the first group; a second common source line connected to the second group; a source line voltage supplying circuit supplying a source line voltage; a first switch controlling a connection between the first common source line and the source line voltage supplying circuit; and a second switch controlling a connection between the second common source line and the source line voltage supplying circuit. When one first memory block among the plurality of first memory blocks of the first group is selected, the first switch may be turned on, and the second switch may be turned off.

Abstract: A method of operating a semiconductor device includes applying a first voltage to a first source select line coupled to first source select transistors of memory strings included in an unselected memory block, among memory blocks, floating the first source select line after the first voltage is applied thereto, applying a second voltage having a lower voltage level than the first voltage to a second source select line coupled to second source select transistors of the memory strings included in the unselected memory block, applying a precharge voltage to a common source line, and applying a program voltage to a word line coupled to selected memory cells of memory strings included in a selected memory block, among the memory blocks.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for scheduling targeted refreshes in a memory device. Memory cells in a memory device may be volatile and may need to be periodically refreshed as part of an auto-refresh operation. In addition, certain rows may experience faster degradation, and may need to undergo targeted refresh operations, where a specific targeted refresh address is provided and refreshed. The rate at which targeted refresh operations need to occur may be based on the rate at which memory cells are accessed. The memory device may monitor accesses to a bank of the memory, and may use a count of the accesses to determine if an auto-refresh address or a targeted refresh address will be refreshed.