Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells each connected to word lines and disposed in memory holes. The memory holes are arranged in rows comprising strings which are grouped into blocks comprising a first plane and a second plane. A control means is configured to program memory cells of the first plane and the second plane connected to one of the word lines using iterations of a program operation. The control means terminates programming of the first plane prior to completing programming of the first plane in response to determining the first plane programs slower than the second plane by a predetermined number of the iterations of the program operation. The control means adjusts the predetermined number of the iterations based on an additional verify iteration performed on at least some of the memory cells beyond the iterations of the program operation.

Abstract: Disclosed are a three-dimensional flash memory, to which a GSL-removed structure is applied, and an operating method thereof.

Abstract: Memory devices and methods for operating the same are provided. A memory device can include at least one command contact and at least one data contact. The memory device can be configured to detect a condition in which the at least one command contact is connected to a controller and the at least one data contact is disconnected from the controller, and to enter, based at least in part on detecting the condition, a first operating mode with a lower nominal power rating than a second operating mode. Memory modules including one or more such memory devices can be provided, and memory systems including controllers and such memory modules can also be provided.

Abstract: A storage device operated by zone and data processing system including the same are provided.

Abstract: A method of programming a memory includes performing a plurality of programming shots is provided. Each programming shot includes a pre-charge stage and a programming stage and includes the following steps. Applying a common source line voltage to a common source line or applying a bit line voltage to a bit line in the pre-charge stage, wherein the common source line voltage or the bit line voltage is applied by using incremental-step-pulse programming (ISSP) in the plurality of pre-charge stages. Applying a programming voltage to a selected word line in the programming stage, wherein the programming voltage is applied by using ISSP in the plurality of programming stages.

Abstract: In one embodiment, a semiconductor storage device includes memory cell transistors, and a word line electrically connected to the memory cell transistors. The device further includes a voltage generator configured to generate a first voltage transferred to the word line, the voltage generator including a voltage divider configured to divide the first voltage with first and second resistance elements, the first or second resistance element being a variable resistance element that receives a first digital signal indicating a resistance value and is changeable to the resistance value. The device further includes a control unit configured to output the first digital signal, wherein the control unit outputs the first digital signal such that a theoretical waveform of the first voltage in boosting the first voltage in an erasing verifying operation is different from a theoretical waveform of the first voltage in boosting the first voltage in a reading operation.

Abstract: A memory device includes a memory block with memory cells that are arranged in word lines. Control circuitry in the memory device selects a word line to program; sets a programming pulse voltage to a starting value; and determines an operating temperature and compares the operating temperature to a first threshold temperature. In response to the operating temperature being less than the first threshold temperature, the control circuitry sets a program voltage step size to a baseline. In response to the operating temperature being greater than a first threshold temperature, the control circuitry sets the program voltage step size to a high temperature step size that is less than the baseline step size. The control circuitry programs the selected word line. Each program loop includes a programming pulse, and the control circuitry increases a magnitude of the programming pulse between program loops by the program voltage step size.

Abstract: A semiconductor structure includes a vertical stack of repetition units, where each instance of the repetition unit extends along a first horizontal direction and includes a first electrically conductive strip, a first memory film located over the first electrically conductive strip, discrete semiconductor channels that are laterally spaced apart from each other along the first horizontal direction and located above the first memory film, a second memory film located above the discrete semiconductor channels, a second electrically conductive strip located above the second memory film, and an insulating strip located above the first electrically conductive strip.

Abstract: A memory device includes a target memory block and a peripheral circuit configured to float local word lines which are coupled to the target memory block while an erase voltage rises toward a target level, apply a first voltage to the local word lines after the erase voltage reaches the target level, and apply one or more group voltages to the local word lines after applying the first voltage.

Abstract: The present disclosure relates to a nonlinearity compensation circuit for a memristive device. The circuit according to an embodiment includes at least one power source unit to apply an input pulse; a modulation unit connected to the at least one power source unit to adjust a pulse width of an update pulse to be applied to the memristive device; and the memristive device to which the modulated update pulse is applied.

Abstract: A semiconductor structure includes a vertical stack of repetition units, where each instance of the repetition unit extends along a first horizontal direction and includes a first electrically conductive strip, a first memory film located over the first electrically conductive strip, discrete semiconductor channels that are laterally spaced apart from each other along the first horizontal direction and located above the first memory film, a second memory film located above the discrete semiconductor channels, a second electrically conductive strip located above the second memory film, and an insulating strip located above the first electrically conductive strip.

Abstract: A method of operating a semiconductor device includes: starting a program operation on selected memory cells among a plurality of memory cells in response to a program command; suspending the program operation in response to a program suspend command; and performing a pre-verify operation by using a modified verify voltage in response to a program resume command.

Abstract: The present technology relates to an electronic device. A memory device including a plurality of memory cells connected to a plurality of word lines arranged between a plurality of source select lines and a plurality of drain select lines, a peripheral circuit configured to perform a program operation of programming data in selected memory cells among the plurality of memory cells, and a program operation controller configured to control the peripheral circuit to apply a voltage, for turning on or off source select transistors connected to the plurality of source select lines, to the plurality of source select lines, while applying a pass voltage to the plurality of word lines after applying a program voltage to selected word lines connected to the selected memory cells.

Abstract: Systems, apparatuses and methods may provide for technology that includes a charge pump and applies a program voltage from the charge pump to selected wordlines in the NAND memory. The technology may also conduct a discharge of the program voltage from the charge pump and maintain a connection between the selected wordlines and a pass voltage of the charge pump while the program voltage is being discharged. In one example, the connection between the selected wordlines and the pass voltage prevents the selected wordlines from floating.

Abstract: A memory device includes one or more memory blocks. Each memory block includes a plurality of first sense amplifier circuits, a plurality of row segments, and a plurality of row decoders. The row segments and the first sense amplifier circuits are arranged alternately along a first direction. Each row segment includes a plurality of memory cells arranged in rows and columns. Each column of memory cells extends in the first direction. The row segments are divided into N groups of row segments, and N is greater than one. The row decoders are coupled to the row segments respectively, and divided into N groups of row decoders.

Abstract: This application relates to the technical field of data storage, and discloses a method for finding a common optimal reference voltage and a memory storage-system. The method includes: providing a lookup table for optimal reference voltage offset of each programmed state of target memory and a 1-bit count difference voltage offset corresponding to predetermined 1-bit count index at different time intervals; when there is a NAND device of a memory storage system with UECC or bit error rate exceeding criteria, detecting current 1-bit count difference voltage offset corresponding to the predetermined 1-bit count index, and obtaining optimal reference voltage offset in the lookup table with the current 1-bit count difference voltage offset as index; and applying the corresponding reference voltage offset to initial common reference voltage of all NAND devices of the memory storage system. This application can accurately adjust the reference voltage.

Abstract: According to one embodiment, a memory system includes n memory cells, each capable of storing j bits of data; and a controller. The controller is configured to write a first portion of each of first data to n-th data from among n×j data with consecutive logical addresses to the n memory cells one by one. The first data has a lowest logical address among the n×j pieces of data. The first data to the n-th data have ascending consecutive logical addresses. The controller is configured to write the first portion of one of the first to n-th data as a first bit of the j bits, and write the first portion of another one of the first to n-th data except said one of the first to n-th data as a second bit of the j bits.

Abstract: The present disclosure provides a method for erasing a memory device. The method includes applying a word-line voltage to a word line of the memory device, wherein a first set of memory cells coupled to the word line are each configured to store a first number of bits data. The method also includes applying a hold voltage to a selected dummy line for a first time period, wherein a second set of memory cells coupled to the selected dummy line are each configured to store a second number of bits data less than the first number of bits data. The method further includes removing the hold voltage from the selected dummy line after the first time period such that an electric potential of the selected dummy line rises to a first voltage higher than the word-line voltage; and increasing the first time period incrementally in each of subsequent erase loops.

Abstract: Methods, systems, and devices for programming techniques for polarity-based memory cells are described. A memory device may use a first type of write operation to program one or more memory cells to a first state and a second type of write operation to program one or more memory cells to a second state. Additionally or alternatively, a memory device may first attempt to use the first type of write operation to program one or more memory cells, and then may use the second type of write operation if the first attempt is unsuccessful.

Abstract: An apparatus is provided that includes a control circuit coupled to a plurality of non-volatile memory cells. The control circuit is configured to perform a program-verify iteration on a first set of the non-volatile memory cells in a plurality of program loops, determine that the first set of the non-volatile memory cells passes verification to a particular programmed state in a first number of program loops, determine a first voltage based on the first number of program loops, add an adaptive voltage offset to the first voltage to obtain a second voltage, and program a second set of the non-volatile memory cells in a plurality of program loops using the second voltage. The adaptive voltage offset varies as a function of temperature.