Abstract: A memory device comprises a substrate and a memory array disposed above the substrate, the memory array comprising a plurality of vertically stacked layers, each vertically stacked layer comprising a plurality of word lines. The memory device further comprises a plurality of vertical string driver circuits disposed above the memory array, wherein each of the plurality of vertical string driver circuits comprises one or more semiconductor devices coupled to a respective one of the plurality of word lines.

Abstract: A memory device includes a set of inputs, and a first register that includes a first register field to store a value for enabling application of one of a plurality of command/address (CA) on-die termination (ODT) impedance values to first inputs that receive the CA signals; a second register field to store a value for enabling application of one of a plurality of chip select (CS) ODT impedance values to a second input that receives the CS signal; and a third register field to store a value for enabling application of a clock (CK) ODT impedance value to third inputs that receive the CK signal. The memory device also includes second and third registers to store values for selecting one of the plurality of CA ODT impedance values and one of the plurality of CS ODT impedance values for application to the first inputs and second input, respectively.

Abstract: Methods, systems, and devices for memory management associated with charge leakage in a memory device are described. A memory device may identify a charge leakage associated with one or more memory cells or access lines, and may determine whether to invert a logic state stored by a memory cell or a set of memory cells to improve the likelihood that the memory cells are read properly in the presence of charge leakage. In some examples, the memory device may also store an indication that the complement of the detected logic state was written, such as a bit flip indication, which may correspond to one memory cell or a set of memory cells.

Abstract: A magnetic storage device includes a magnetic body including first and second magnetic regions and a magnetic connection region that connects the first and second magnetic regions, and in which a plurality of magnetic domains each storing information by a magnetization direction thereof is formed, a read element that is electrically connected to the magnetic connection region and by which a magnetization direction of one of the magnetic domains is read, and a write element by which a magnetic domain having a magnetization direction is formed in the magnetic body according to information to be stored. The magnetic domains formed in each of the first and second magnetic regions are shifted in a predetermined direction in response to current that flows through the corresponding one of the first and second magnetic regions.

Abstract: Control logic in a memory device executes a first operation comprising a first set of programming pulses and a first set of program verify operations on a first portion of a first subset of memory cells to be programmed to identify a first start voltage level. A second set of programming pulses including at least one programming pulse having the first start voltage level is caused to be applied to program a second portion of the first subset of memory cells. A second operation including a third set of programming pulses and a second set of program verify operations are executed on a first portion of the second subset of memory cells to identify a second start voltage level.

Abstract: A semiconductor memory device includes a memory cell array and a peripheral circuit. The memory cell array includes at least two planes. The peripheral circuit performs a memory operation on a selected plane of the at least two planes during a single plane operation and performs a dummy operation on an unselected plane of the at least two planes.

Abstract: A semiconductor device includes a memory cell array including a plurality of memory blocks, a control logic, a level shifter configured to generate a first internal voltage and a second internal voltage lower than the first internal voltage using a received external voltage on the basis of a control signal from the control logic, and a row decoder configured to provide the first and second internal voltages generated by the level shifter to the memory cell array. The level shifter generates the first internal voltage using the external voltage, generates the second internal voltage using the generated first internal voltage in a power-up mode of the semiconductor device, and generates the second internal voltage using the external voltage in a standby mode of the semiconductor device.

Abstract: A memory device includes a cell area including memory blocks, and a peripheral circuit area including peripheral circuits that execute an erase operation for each of the memory blocks. Each memory block includes word lines that are stacked on a substrate, channel structures penetrate through the word lines, and a source region that is disposed on the substrate and connected to the channel structures. During the erase operation in which an erase voltage is provided to the source region of a target memory block among the memory blocks, the peripheral circuits reduce a voltage of a first word line from a first bias voltage to a second bias voltage at a first time, and to reduce a voltage of a second word line, different from the first word line, from a third bias voltage to a fourth bias voltage at a second time different from the first time.

Abstract: A nonvolatile semiconductor memory device according to one embodiment of the present invention includes: a memory cell array and a control circuit. The control circuit executes a first reading operation and a second reading operation. The first reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between a control gate electrode and source of the selected memory cell to a first value. The second reading operation is an operation of reading a threshold voltage set in the selected memory cell by setting a voltage between the control gate electrode and source of the selected memory cell to a second value lower than the first value. When executing the second reading operation, the control circuit keeps a voltage of the control gate electrode of the selected memory cell to 0 or a positive value.

Abstract: According to one embodiment, a memory system includes a semiconductor memory device including a memory cell capable of holding at least 4-bit data and a controller configured to control a first write operation and a second write operation based on the 4-bit data. The controller includes a conversion circuit configured to convert 4-bit data into 2-bit data. The semiconductor memory device includes a recovery controller configured to recover the 4-bit data based on the converted 2-bit data and data written in the memory cell by the first write operation. The first write operation is executed based on the 4-bit data received from the controller, and the second write operation is executed based on the 4-bit data recovered by the recovery controller.

Abstract: According to one embodiment, the semiconductor memory medium includes a first memory cell, a first word line coupled to the first memory cell, and a row decoder coupled to the first word line. A write operation is executed multiple times on the first memory cell within a first period from after an execution of an erase operation to an execution of a next erase operation. The write operation includes at least one of program loops each including a program operation and a verify operation. In the verify operation, the row decoder applies a verify voltage to the first word line. The verify voltage is set in accordance with a number of executed write operations on the first memory cell within the first period.

Abstract: In a three dimensional non-volatile memory structure that etches part of the top of the memory structure (including a portion of the select gates), data is stored on a majority (or all but one) of the word lines as x bits per memory cell while data is stored on a top edge word line that is closest to the etching with variable bits per memory cell. In one example embodiment that implements vertical NAND strings, memory cells connected to the top edge word line and that are on NAND strings adjacent the etching store data as n bits per memory cell and memory cells connected to the top edge word line and that are on NAND strings not adjacent the etching store data as m bits per memory cell, where m>x>n.

Abstract: Described are systems and methods for estimating the resistance-capacitance time constant of an electrical circuit (e.g., of a wordline of a memory device). An example system comprises: a memory device comprising a plurality of memory cells electrically coupled to a plurality of wordlines; a resistance-capacitance (RC) measurement circuit to measure a voltage at a specified wordline of the plurality of wordlines; and a processing device coupled to the memory device. The processing device is configured to: apply an initial voltage to a selected wordline of the plurality of wordlines; discharge the selected wordline for a discharge period of time; float the selected wordline until a voltage at the selected wordline is stabilized; determine, by the RC measurement circuit, a stabilized voltage at the selected wordline; and estimate, based on the stabilized voltage, an RC time constant of the wordline.

Abstract: A circuit includes a linear regulator coupled with a memory array and a pump regulator coupled with a charge pump, the charge pump to provide a supply voltage to the linear regulator. A digital-to-analog converter (DAC) has an output coupled with the pump regulator. Control logic is coupled with the DAC and is to perform operations including causing a digital input value to be provided to the DAC to selectively adjust the supply voltage based on a programmable offset value.

Abstract: A method to perform an on demand refresh operation of a memory sub-system is disclosed. The method includes identifying a temporal attribute of user data stored in the memory component, upon determining that the identified temporal attribute satisfies a time condition, providing an indication whether a refresh operation of the user data improves performance of the memory component, receiving an indication to perform the refresh operation of the memory component, and responsive to a time between the refresh operation and a previously performed refresh operation not satisfying a threshold criterion, refraining from performing the refresh operation of the memory component.

Abstract: According to one embodiment, a memory system includes n memory cells, each capable of storing j bits of data; and a controller. The controller is configured to write a first portion of each of first data to n-th data from among n×j data with consecutive logical addresses to the n memory cells one by one. The first data has a lowest logical address among the n×j pieces of data. The first data to the n-th data have ascending consecutive logical addresses. The controller is configured to write the first portion of one of the first to n-th data as a first bit of the j bits, and write the first portion of another one of the first to n-th data except said one of the first to n-th data as a second bit of the j bits.

Abstract: A semiconductor memory device includes a memory block, a plurality of bit lines, a plurality of select gate lines, a plurality of word lines, and a controller. The memory block includes a plurality of memory strings, each memory string including a selection transistor and a plurality of memory cells. The plurality of bit lines are arranged in the first direction and connected to the respective memory strings. The plurality of select gate lines are arranged in the second direction and connected to gates of the respective selection transistors of the memory strings. The plurality of word lines are arranged in the third direction and connected to gates of the respective memory cells of the memory strings. The controller is configured to perform an erase operation in a unit of the memory block, and perform a sequence of erase verify operations.

Abstract: A nonvolatile memory device includes a memory block with an unused line connected to dummy cells and used lines connected to normal cells, and a controller which applies an erase voltage to the memory block, applies an unused line erase voltage to the unused line, and applies a word line erase voltage to the used lines during an erase operation. The dummy cells are not programmed during a program operation while the normal cells are programmed, the unused line erase voltage transits from a first voltage to a floating voltage at a first time point, and the controller reads the dummy cells and controls at least one of the magnitude of the first voltage and the first time point based on the result of reading the dummy cells.

Abstract: Embodiments of erasing methods for a three-dimensional (3D) memory device are disclosed. The 3D memory device includes multiple decks vertically stacked over a substrate, wherein each deck includes a plurality of memory cells. The erasing method includes checking states of the plurality of memory cells of an erase-inhibit deck and preparing the erase-inhibit deck according to the states of the plurality of memory cells. The erasing method also includes applying an erase voltage at an array common source, applying a hold-release voltage on unselected word lines of the erase-inhibit deck, and applying a low voltage on selected word lines of a target deck.

Abstract: A memory system includes a nonvolatile memory configured to execute one of a plurality of read operations, including a first read operation and a second read operation, and a memory controller configured to issue a read command to the nonvolatile memory to cause the nonvolatile memory to execute one of the plurality of read operations. The memory controller is configured to receive a read request, estimate a reliability level of a result of a read operation to be executed by the nonvolatile memory to read data from a physical address specified in the read request, select one of the first and second read operations to be executed first in a read sequence corresponding to the read request by the nonvolatile memory based on the estimated reliability level, and instruct the nonvolatile memory to execute the selected read operation.