Patents Examined by Jayprakash N. Gandhi
  • Patent number: 10880987
    Abstract: A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: December 29, 2020
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xigui Fang, Zhenzhong Wang, Dengqun Yu, Zhanwei Wang, Shuming Zhu
  • Patent number: 10856446
    Abstract: A cooling manifold positioned on an electrical or computer to provide liquid cooling for a plurality of slot-mounted electrical modules received in a corresponding plurally of module slots arranged in faceplate assembly of an electrical or computer card is described and illustrated.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: December 1, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Franklin D. Boyden, Jimmy Chun-Chuen Leung
  • Patent number: 10852012
    Abstract: An outdoor unit of an air-conditioning apparatus includes a casing forming an outer shell, a terminal block disposed in the casing, a terminal block support element configured to support the terminal block, and an earth grounding plate sandwiched between the terminal block and the terminal block support element. An engaging portion to be engaged with the terminal block support element is provided in the earth grounding plate. A fixing element is provided to fasten the terminal block and the earth grounding plate engaged with the terminal block support element by the engaging portion together to the terminal block support element.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: December 1, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuto Takeuchi, Kazuho Ito
  • Patent number: 10856448
    Abstract: Compressed air cooling is disclosed. In an embodiment, an assembly includes an input configured to receive compressed air. The assembly also includes an expansion chamber configured to at least in part contain an expansion of the compressed air. The assembly also includes a base configured to be thermally cooled via the expansion of the compressed air and configured to be coupled to an electronic component.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: December 1, 2020
    Assignee: Facebook, Inc.
    Inventors: Scott C. Wiley, Andrew Gold, Ahmad Byagowi
  • Patent number: 10834832
    Abstract: An image display device includes a frame including posts partitioning the inside space defined by rectangular frame members in a grid, and a display unit including two or more light-emitting diodes (LEDs) disposed on one surface of a substrate and a case accommodating the substrate and the LEDs. The case includes a bottom plate and an opening facing the bottom plate. The bottom plate faces the substrate, the opening exposes the LEDs, and a rear surface of the bottom plate is waterproofed. The display unit is accommodated in each of two or more compartments partitioned in a grid by the posts of the frame. A rear plate covers, from the rear surface of the bottom plate, the frame in which the display unit is accommodated, and a magnet is attached to a surface of the rear plate to attach/detach the rear plate to/from the frame.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: November 10, 2020
    Inventor: Yoshinosuke Mori
  • Patent number: 10820455
    Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: October 27, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae-eun Kim, Jeungsoo Kim, Junghoon Kim
  • Patent number: 10798854
    Abstract: Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 6, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner
  • Patent number: 10798847
    Abstract: In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Michael Aaron Schroeder, Erich Nolan Ewy
  • Patent number: 10794937
    Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 6, 2020
    Inventors: Masashi Kosuga, Takeshi Kato, Takeshi Tajiri, Hidehiko Takahara, Nobuaki Gorai
  • Patent number: 10787014
    Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: September 29, 2020
    Assignee: Apple Inc.
    Inventors: Lee E. Hooton, Marwan Rammah, James A. Bertin, Stoyan P. Hristov, William A. Counts
  • Patent number: 10782749
    Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wendell Lengefeld, Abhishek Mehta, William Mark Megarity, Mark E. Steinke, Benjamin Colin Heshmat
  • Patent number: 10784065
    Abstract: An activatable thermal fuse includes a first electrical terminal, a second electrical terminal, and an electrically conductive bridge element having a first electric contact with the first electrical terminal and a second electric contact with the second electrical terminal. At least a part of the bridge element is displaceable from a first position in which the first contact is established to a second position in which the first contact is opened, and a thermally sensitive member releases the part when exposed to a predetermined temperature value. An activating element blocks displacement of the part from the first position, in a first position of the activating element, and enables the displacement of the part in a second position of the activating element. A method of manufacturing a printed circuit board, a method of monitoring, and an electronic circuit including the thermal fuse are also provided.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: September 22, 2020
    Assignee: SCHURTER AG
    Inventors: Guido Signer, Peter Straub, Benjamin Schibli
  • Patent number: 10785863
    Abstract: A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: September 22, 2020
    Assignee: Raytheon Company
    Inventors: Susan C. Trulli, Christopher M. Laighton
  • Patent number: 10767939
    Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: September 8, 2020
    Assignee: International Business Machines Corporation
    Inventors: Gerd Schlottig, Stephan Paredes, Ingmar G. Meijer, Thomas Brunschwiler
  • Patent number: 10772190
    Abstract: Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: September 8, 2020
    Assignee: APPLE INC.
    Inventors: Kristopher P. Laurent, Brett W. Degner
  • Patent number: 10770439
    Abstract: An electronic module comprising a first electronic unit 51 which has a first insulating substrate 61 and a first electronic element 41 provided on the first insulating substrate 61 via a first conductor layer 21, a second electronic unit 52 which has a second insulating substrate 62 and a second electronic element 42 provided on the second insulating substrate 62 via a second conductor layer 22, a connecting body 29 provided between the first electronic unit 51 and the second electronic unit 52 and a coil 70 wound around the connecting body 29.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: September 8, 2020
    Inventors: Junya Yuguchi, Kousuke Ikeda, Kenichi Suzuki
  • Patent number: 10772192
    Abstract: The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: September 8, 2020
    Assignee: KEYSSA SYSTEMS, INC.
    Inventors: Roger D. Isaac, Mostafa Naguib Abdulla
  • Patent number: 10763191
    Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 1, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John Franz, Harvey Lunsman, Steven Dean
  • Patent number: 10765039
    Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Xudong Tang
  • Patent number: 10755880
    Abstract: A temperature-dependent switch has a housing with a cover part having a lower side and an upper side and with an electrically conductive lower part having a circumferential shoulder and a circumferential wall with an upper section that overlaps the cover part. The switch has a first external contact surface on the upper side of the cover part and a second external contact surface externally on the housing, wherein the upper section of the circumferential wall presses the cover part onto the circumferential shoulder. A temperature-dependent switching mechanism is arranged in the housing and, depending on its temperature, establishes or opens an electrically conductive connection between the first and second external contact surfaces. A circumferential cutting burr is arranged on the shoulder in the lower part.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: August 25, 2020
    Inventor: Marcel P. Hofsaess