Patents Examined by Jayprakash N. Gandhi
  • Patent number: 10306814
    Abstract: A three-phase two-level power electronics assembly is disclosed in one form including a thermally conductive base plate, a heat dissipation unit, mounted on a first face of the base plate, connectors for three-phase AC output, chopper DC outputs, and two poles of a DC link, and a set of power electronics devices mounted on a second face of the base plate, whereby the power electronic devices are arranged within the three-phase two-level power electronics assembly in rows to provide a three phase AC output as well as chopper DC outputs and connected to the respective connectors, whereby the rows connected to the three-phase AC output and the rows connected to the chopper DC outputs are alternately arranged on the base plate. Also disclosed is a power converter, in particular a static power converter, having at least one three-phase two-level power electronics assembly as specified above.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: May 28, 2019
    Assignee: ABB Schweiz AG
    Inventor: Tobias Schluer
  • Patent number: 10273722
    Abstract: The combination of: a) an electronic device having a wall portion with first and second ends and at least one enlargement on each of opposite sides of the wall portion; and b) a security system. The security system is made up of an elongate body, with third and fourth ends, and a connecting assembly. The body has first and second legs and a base joined together to cooperatively define a ā€œUā€ shape. The connecting assembly and the body are configured so that with the security system operatively positioned, the first and second legs, base, and connecting assembly cooperatively encircle the elongate wall portion and the body is confined between at least first and second of the enlargements on the opposite sides of the elongate wall portion. In one form, a tether is secured to the connecting assembly and to a fixed support.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: April 30, 2019
    Assignee: Se-Kure Controls, Inc.
    Inventor: Roger J. Leyden
  • Patent number: 10242808
    Abstract: In some embodiments, an apparatus includes a housing and a purge valve. The housing defines a cavity and a lumen extending from a volume of the cavity to a volume outside the cavity. The purge valve is disposed within the lumen and includes an occlusion member. A portion of the occlusion member has a width substantially equal to a width of an end portion of the lumen such that the portion of the occlusion member is disposed within the end portion of the lumen when the purge valve is in a first configuration. The portion of the occlusion member being disposed outside the end portion of the lumen when the purge valve is in a second configuration.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: March 26, 2019
    Assignee: IOXUS, INC.
    Inventors: Thor E. Eilertsen, Chad Hall, Lothar Franz Bieg
  • Patent number: 10231361
    Abstract: In some embodiments, a rack system is configured to comprise a removable fan system. The fan system enables thermal management of the rack system. The removable fan system includes a replaceable fan tray that can be assembled in the rack system by engaging a connecting mechanism and connecting a connecting cable. The fan tray is engaged with the connecting mechanism to be securely attached to the rack system. The fan tray is connected to a bus bar to receive power or necessary data to be operated. The fan tray can be disassembled from the rack system while the bus remains active, and enables access to the server or the rack system. The replaceable fan tray enables easy replacement of the fan system and access to the rear side of the rack system.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 12, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chao-Jung Chen, Chih-Ming Chen
  • Patent number: 10182515
    Abstract: In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: January 15, 2019
    Assignee: THE BOEING COMPANY
    Inventors: Charles E. Kusuda, Jeffrey W. Glasnovich, Erik L. Godo, Roy D. Nye, Namsoo P. Kim
  • Patent number: 10170267
    Abstract: Provided is a current fuse that can improve the rating while also preventing explosive scattering of metal in association with arc discharge and enabling reliable cutting off of a circuit. The current fuse (1) includes an insulating substrate (2), a main fuse element (3) disposed on the insulating substrate (2), and a sub-fuse element (4) disposed on the insulating substrate (2) and having a higher melting point than the main fuse element (3). The main fuse element (3) and the sub-fuse element (4) are connected in parallel.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: January 1, 2019
    Assignee: Dexerials Corporation
    Inventor: Yoshihiro Yoneda
  • Patent number: 10141150
    Abstract: A compact, high breaking capacity fuse that includes a top and bottom insulative layer and a single piece fusible element disposed between the top and bottom insulative layer. The top and bottom insulative layers include cavities that are aligned at assembly to form a chamber in which a fusible element portion of the single piece fusible element is disposed. The single piece fusible element additionally includes terminal portions that extend along outer surfaces of the top and bottom insulative layers.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: November 27, 2018
    Assignee: LITTELFUSE, INC.
    Inventors: Edwin C. Aberin, Redante R. Abad, Chito D. Sumalinog
  • Patent number: 10074500
    Abstract: A compact fusible disconnect switch device having a reduced switch housing size and increased power density is configured to be face mounted to a panel. A fuse cover assembly allows installation and removal of a fuse without having to open the panel. Line-side and load-side terminals are provided on a common side of the housing. In-line mechanical ganging and simultaneous application is provided for combinations of the compact fusible disconnect switch devices.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: September 11, 2018
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Tyler John Neyens, Patrick Alexander von zur Muehlen, Matthew Rain Darr, Shungang Su, Jessica Ann Dunker
  • Patent number: 10062530
    Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: August 28, 2018
    Assignee: DONGGUAN LITTELFUSE ELECTRONICS CO., LTD.
    Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
  • Patent number: 10053810
    Abstract: The laundry treatment apparatus may include a cabinet providing an accommodation space, a drum rotatably provided inside the cabinet, a front cover unit provided on a portion of a front surface of the cabinet and having a cover hole provided to enable introduction and discharge of laundry into the drum, and a door assembly provided on the front cover unit so as to open or close the cover hole. The door assembly includes a hinge unit having one side separably coupled to the front cover unit and a remaining side separably coupled to the door assembly, so as to rotate the door assembly, and a handle unit separably coupled to the door assembly. The hinge unit and the handle unit are separably coupled to the door assembly by exchanging positions thereof.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: August 21, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Seonil Heo, Kihyun Kim
  • Patent number: 10056211
    Abstract: A heat-reactive switch includes an airtight container with a housing and a lid plate, two conductive terminal pins fixed in through-holes in the lid plate, a fixed contact point fixed on one of the conductive terminal pins, a heater connected to the other conductive terminal pin and to the lid plate, a heat-reactive plate connected to the housing internal surface, the bending direction becoming inverted at a predetermined temperature, and a mobile contact point provided at the end of the heat-reactive plate. A heating element has a plurality of serpentine portions made from a metal plate in ribbon form, disposed between the lid plate and the heat-reactive plate so as to be parallel thereto. At least two of the serpentine portions are disposed to face each other while sandwiching the conductive terminal pin. Each portion follows the inner peripheral surface of the housing and have planar portions facing each other.
    Type: Grant
    Filed: May 23, 2014
    Date of Patent: August 21, 2018
    Assignee: UBUKATA INDUSTRIES CO., LTD.
    Inventors: Tomohiro Hori, Yoshio Yamaguchi
  • Patent number: 10031562
    Abstract: A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module.
    Type: Grant
    Filed: February 5, 2014
    Date of Patent: July 24, 2018
    Assignee: International Business Machines Corporation
    Inventors: Andreas C. Doering, Ronald P. Luijten, Bruno Michel, Stephan Paredes
  • Patent number: 10032583
    Abstract: In a protective circuit substrate having a circuit substrate and a protective element, the protective element including: an insulating substrate; a heat-generating element; first and second electrodes laminated on the insulating substrate; a first and second connecting terminals provided on one side edge of a mounting surface to be mounted to the circuit substrate, the first connecting terminals being continuous with the first and second electrodes; a heat-generating element extracting electrode provided in a current path between the first and second electrodes and electrically connected to the heat-generating element; and a meltable conductor provided between the first and second electrodes, wherein the circuit substrate includes a region for mounting the protective element in which no electrode pattern other than a connecting electrode to the protective element is provided.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: July 24, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Yuji Furuuchi, Takashi Fujihata, Koichi Mukai
  • Patent number: 9939860
    Abstract: An electronic device according to the invention includes a second electronic device and a first electronic device removably connected with the second electronic device; the electronic device includes a first heat dissipation channel in the first electronic device and a second heat dissipation channel in the second electronic device. In a disconnected state, the heat dissipation airflow flows through the first heat dissipation channel to perform heat dissipation of the first electronic device. In a connected state, the first air inlet of the first heat dissipation channel communicates with the second air outlet of the second heat dissipation channel, and the heat dissipation airflow may enter into the first heat dissipation channel via the second heat dissipation channel so as to perform heat dissipation of the first electronic device by the second heat dissipation channel and the first heat dissipation channel.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: April 10, 2018
    Assignees: Beijing Lenovo Software Ltd., Lenovo (Beijing) Co. Ltd.
    Inventor: Guowen Zhang
  • Patent number: 9941086
    Abstract: Provided is a fusible link unit (electrical component unit) including a fusible link (electrical component), a battery terminal fixed to an electrode post (electrode) of a battery, and a support member formed as a different body from the battery terminal and fixed to the battery, the support member supporting the fusible link (electrical component), in which the fusible link (electrical component) includes a main link body (main electrical component body) and a power supply terminal made of conductive metal to be exposed from the main link body (main electrical component body) and electrically connected to the electrode post (electrode) through the battery terminal, and the support member supports the main link body (main electrical component body) such that the main link body extends in an orthogonal direction substantially orthogonal to an installation surface portion.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: April 10, 2018
    Assignee: Yazaki Corporation
    Inventors: Shinya Onoda, Yoshinori Ishikawa, Tatsumasa Itagaki, Takahiro Shiohama
  • Patent number: 9886060
    Abstract: The general field of the invention is that of electronic mission preparation systems, notably for aircraft pilots. The system comprises a removable touch tablet and an associated connection support or docking station intended to be mounted on an aircraft instrument panel. The connection support comprises a mechanical support comprising translational guiding means and a pivoting pallet comprising mechanical means for rapidly locking and unlocking the touch tablet This connection support also comprises a memory card and electrical connectors. These provisions together ensure both the electrical and mechanical connections of the tablet to the avionics system via the connection support.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: February 6, 2018
    Assignee: Thales
    Inventors: Jean-Marie Goy, Dorian Santiago, Alice Bertaud Du Chazaud
  • Patent number: 9887057
    Abstract: A fuse includes first, second, and third terminals disposed on a substrate. Respective ends of one or more primary conductors of the fuse are connected to one of the first and the second terminals. The primary conductors have a first conductivity and are configured to open when a primary current between the first and the second terminals exceeds a first predetermined threshold. One or more secondary conductors have an end connected to the third terminal. The secondary conductors are configured to ignite when a secondary current through the secondary conductors exceeds a second predetermined threshold. When ignited, the secondary conductors open the primary conductors to thereby stop the primary current.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: February 6, 2018
    Assignee: Littelfuse, Inc.
    Inventors: Johnny Lam, Martyn A. Matthiesen, Matthew P. Galla, Jianhua Chen
  • Patent number: 9860987
    Abstract: An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: January 2, 2018
    Assignee: DEERE & COMPANY
    Inventors: Brij N. Singh, Thomas Roan, Andrew D. Wieland, Neal D. Clements
  • Patent number: 9852869
    Abstract: A switch module with a built-in structure of anti-surge and dual disconnection mainly comprises an overcurrent protection switch having plates and insulating elements for anti-surge and dual disconnection structure ingeniously built inside a heat-resisting housing. The switch module has a first connecting point and a second connecting point for operation. When overvoltage occurs, temperature of at least one metal oxide varistor would instantly rise up to a degree higher than the melting point thereof, melting at least one thermo-sensitive piece, loosening at least one spring element, displacing a pushing element and thus forcing the connecting points detaching from each other to turn off the switch and stop supplying electricity power; meanwhile, insulating elements would isolate conductive components such as thermo-sensitive pieces, spring elements and plates to further ensure a complete disconnection and more of electricity safety.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: December 26, 2017
    Inventors: Yi-Hsiang Wang, I-Ying Wang
  • Patent number: 9826662
    Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: November 21, 2017
    Assignee: General Electric Company
    Inventors: Joo Han Kim, Graham Charles Kirk, Jay Todd Labhart, Binoy Milan Shah, Yogen Vishwas Utturkar, Pramod Charmarthy, Tao Deng