Patents Examined by Jayprakash N. Gandhi
  • Patent number: 11856687
    Abstract: A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: December 26, 2023
    Inventor: Sandro Bulovic
  • Patent number: 11665813
    Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: May 30, 2023
    Inventors: Feng Zhou, Shohei Nagai
  • Patent number: 11483921
    Abstract: A holder has a holding body, a spring member, and a tensioning member. The holding body forms a cavity to receive the electronic component. A connecting section has a thermally conductive heat conductive section adjacent to the cavity. The tensioning member tensions the spring member. The spring member supports itself in a tensioned state on a counter-holding member. The spring member moves a connecting surface of the holding body to the cooling body and/or presses it against the cooling body.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: October 25, 2022
    Assignee: ebm-papst Mulfingen GmbH & Co. KG
    Inventors: Christoph Holderbach, Alexander Lust, Nico Hirschlein
  • Patent number: 11406005
    Abstract: A substrate for mounting electronic element includes: a first substrate including a first surface and a second surface opposed thereto, the first substrate being made of an insulating material; a second substrate made of a carbon material; at least one surface metal layer located on the first surface, including at least one mounting portion for at least one electronic element; and a bonding metal layer on the second surface. Heat conduction of the second substrate in a direction perpendicular to a longitudinal direction of the at least one mounting portion is greater than heat conduction of the second substrate in the longitudinal direction of the at least one mounting portion, and a width of the bonding metal layer is greater than or equal to a maximum width of the at least one surface metal layer in a direction perpendicular to the longitudinal direction of the at least one mounting portion.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: August 2, 2022
    Inventor: Noboru Kitazumi
  • Patent number: 11324147
    Abstract: A power conversion device includes a cooling structure capable of cooling down, by a coolant that flows through a first flow channel formed by a first wall portion and a second wall portion facing with each other, a first electronic component and a second electronic component mounted on an external surface of the first wall portion. The first wall portion is formed in a stepwise shape, and includes a first mount portion on which the first electronic component is mounted, a second mount portion which has a different height from the first mount portion, and on which the second electronic component is mounted, and a first connection portion that is extended between the first mount portion and the second mount portion.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: May 3, 2022
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Takeshi Kobayashi, Daiki Kudo, Masahiro Shimada, Kenichi Sasaki
  • Patent number: 11024478
    Abstract: An overheating destructive disconnecting method for switch, which enables a first elastic force to concurrently apply force to an overheating destructive member and a movable conductive member. Moreover, the force direction causes the movable conductive member to concurrently contact a first conductive member and a second conductive member to form a conductive circuit. A second elastic force acts on the movable conductive member, and the force direction thereof causes the movable conductive member to separate away from the first conductive member or the second conductive member, The overheating destructive member is positioned in a required non-electric transmission path and at a distance from the movable conductive member. When the overheating destructive member is destructed or deformed under a fail temperature condition, the first elastic force is lessened or lost, at which time the second elastic force causes the movable conductive member to change position, thereby breaking the current-carrying circuit.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: June 1, 2021
    Assignee: GREEN IDEA TECH INC.
    Inventor: Hsiang-Yun I
  • Patent number: 10993352
    Abstract: A pluggable module assembly includes a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall forming a cavity configured to hold an electrical component therein. The top wall has an opening above the cavity aligned with the electrical component receiving a thermal transfer device that is separate and discrete from the housing. The thermal transfer device transmits heat from the electrical component to fins separated by channels at an upper thermal interface. The upper thermal interface is exposed from above the housing for interfacing with an external heat sink for transferring heat from the thermal transfer device.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: April 27, 2021
    Inventor: Alan Weir Bucher
  • Patent number: 10950401
    Abstract: The invention relates to a thermally triggered, mechanical switching device, consisting of a heat-sensitive means and a mechanical force-storage means, wherein the heat-sensitive means blocks or unblocks the movement path of a switching piece; furthermore, the switching piece is preloaded and held by the mechanical force-storage means, and comprising a housing that accommodates the aforementioned means. According to the invention, the housing is designed as a cartridge-shaped shell which receives a plunger in the interior thereof, which plunger is mounted in a movable manner through a first end-side opening in the housing and is supported against a fusible shaping part under pretension, wherein the fusible shaping part is arranged so as to cover a second opening, which is located opposite the first end-side opening, in such a way that, when the melting temperature of the fusible shaping part is reached, said fusible shaping part is displaced by the plunger and the plunger takes on a changed position.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: March 16, 2021
    Assignee: DEHN SE + CO KG
    Inventor: Stephan Hierl
  • Patent number: 10880987
    Abstract: A circuit board includes an upper surface, a lower surface, a first end surface connecting the upper surface and lower surface, and a heat dissipation block. The first end surface of the circuit board has an open slot, the open slot extending through the upper surface and lower surface, and the heat dissipation block being arranged inside the open slot. The heat dissipation block has a first surface, the first surface facing away from the lower surface of the circuit board and extending to the first end surface of the circuit board. The inside of the open slot has a stop structure, the stop structure preventing the heat dissipation block from moving toward the first end surface of the circuit board.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: December 29, 2020
    Assignee: InnoLight Technology (Suzhou) Ltd.
    Inventors: Xigui Fang, Zhenzhong Wang, Dengqun Yu, Zhanwei Wang, Shuming Zhu
  • Patent number: 10852012
    Abstract: An outdoor unit of an air-conditioning apparatus includes a casing forming an outer shell, a terminal block disposed in the casing, a terminal block support element configured to support the terminal block, and an earth grounding plate sandwiched between the terminal block and the terminal block support element. An engaging portion to be engaged with the terminal block support element is provided in the earth grounding plate. A fixing element is provided to fasten the terminal block and the earth grounding plate engaged with the terminal block support element by the engaging portion together to the terminal block support element.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: December 1, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuto Takeuchi, Kazuho Ito
  • Patent number: 10856446
    Abstract: A cooling manifold positioned on an electrical or computer to provide liquid cooling for a plurality of slot-mounted electrical modules received in a corresponding plurally of module slots arranged in faceplate assembly of an electrical or computer card is described and illustrated.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: December 1, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Franklin D. Boyden, Jimmy Chun-Chuen Leung
  • Patent number: 10856448
    Abstract: Compressed air cooling is disclosed. In an embodiment, an assembly includes an input configured to receive compressed air. The assembly also includes an expansion chamber configured to at least in part contain an expansion of the compressed air. The assembly also includes a base configured to be thermally cooled via the expansion of the compressed air and configured to be coupled to an electronic component.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: December 1, 2020
    Assignee: Facebook, Inc.
    Inventors: Scott C. Wiley, Andrew Gold, Ahmad Byagowi
  • Patent number: 10834832
    Abstract: An image display device includes a frame including posts partitioning the inside space defined by rectangular frame members in a grid, and a display unit including two or more light-emitting diodes (LEDs) disposed on one surface of a substrate and a case accommodating the substrate and the LEDs. The case includes a bottom plate and an opening facing the bottom plate. The bottom plate faces the substrate, the opening exposes the LEDs, and a rear surface of the bottom plate is waterproofed. The display unit is accommodated in each of two or more compartments partitioned in a grid by the posts of the frame. A rear plate covers, from the rear surface of the bottom plate, the frame in which the display unit is accommodated, and a magnet is attached to a surface of the rear plate to attach/detach the rear plate to/from the frame.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: November 10, 2020
    Inventor: Yoshinosuke Mori
  • Patent number: 10820455
    Abstract: A display device includes a display panel to display an image; a heat radiating member at a side portion of the display panel and including a first adhesive layer, a second adhesive layer, and a heat radiating layer between the first adhesive layer and the second adhesive layer; and a heat generating member overlapping the display panel and the heat radiating member when viewed in a plan view, and the heat radiating member includes a first area overlapping the heat generating member and a second area adjacent to the first area when viewed in a plan view, the first adhesive layer and the second adhesive layer are connected to each other through a plurality of through holes defined through the heat radiating layer, and the plurality of through holes includes a through hole in the second area.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: October 27, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae-eun Kim, Jeungsoo Kim, Junghoon Kim
  • Patent number: 10798847
    Abstract: In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Michael Aaron Schroeder, Erich Nolan Ewy
  • Patent number: 10794937
    Abstract: A power conversion device of the present invention includes a power conversion circuit configured to convert power; a conductor configured to transmit a current to the power conversion circuit; and a coreless current sensor configured to detect the current, in which the coreless current sensor includes: a magnetic field detection portion configured to detect a magnetic field of the current; and a shield portion that faces the magnetic field detection portion, the conductor includes: a first conductor portion that passes through a space between the magnetic field detection portion and the shield portion; and a second conductor portion connected to the first conductor portion via a first bent portion, and the first bent portion is formed such that the space between the magnetic field detection portion and the shield portion is not disposed in a direction perpendicular to a face of the second conductor portion closest to the shield portion.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 6, 2020
    Inventors: Masashi Kosuga, Takeshi Kato, Takeshi Tajiri, Hidehiko Takahara, Nobuaki Gorai
  • Patent number: 10798854
    Abstract: Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: October 6, 2020
    Assignee: Ford Global Technologies, LLC
    Inventors: Guangyin Lei, Michael W. Degner
  • Patent number: 10787014
    Abstract: This application relates to a portable electronic device. The portable electronic device includes an operational component capable of generating heat and walls that define a cavity capable of carrying the operational component. The portable electronic device further includes a support plate that is welded to at least one of the walls. The support plate includes a thermally conductive layer that is thermally coupled to the operational component, where the thermally conductive layer includes a first material that is capable of conducting at least some of the heat away from the electronic component. The support plate further includes a first stiffness promoting layer that is welded to the thermally conductive layer, where the first stiffness promoting layer includes a second material having sufficient material hardness for welding the support plate to at least one of the walls such as to increase a stiffness of the support plate.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: September 29, 2020
    Assignee: Apple Inc.
    Inventors: Lee E. Hooton, Marwan Rammah, James A. Bertin, Stoyan P. Hristov, William A. Counts
  • Patent number: 10785863
    Abstract: A MMIC support and cooling structure having a three-dimensional, thermally conductive support structure having a plurality of surfaces and a circuit having a plurality of heat generating electrical components disposed on a first portion of the surfaces and interconnected by microwave transmission lines disposed on a second portion of the plurality of surfaces of the thermally conductive support structure.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: September 22, 2020
    Assignee: Raytheon Company
    Inventors: Susan C. Trulli, Christopher M. Laighton
  • Patent number: 10782749
    Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 22, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wendell Lengefeld, Abhishek Mehta, William Mark Megarity, Mark E. Steinke, Benjamin Colin Heshmat