Abstract: The present invention is directed to a portable power supply system. The system is capable of converting DC power from one or more removable, rechargeable battery packs to AC power for corded power tools and appliance. The system is also capable of receiving AC power from an AC power supply and converting the AC power to DC power and using the DC power to charge the removable, rechargeable battery packs. The system includes a heat sink to assist in dissipating heat generated by various electronic components in the system. The heat sink also serves as a structural element to provide structural support to a housing of the system.

Abstract: An electronic rack liquid cooling system includes a rack manifold having a rack liquid supply line or channel and a rack liquid return line or channel. The liquid supply line is to receive first cooling liquid from a cooling liquid source and the liquid return line is to return first warmer liquid carrying the exchanged heat back to the cooling liquid source. The electronic rack further includes an array of server blades arranged in a stack therein. Each server blade includes one or more liquid cold plates associated with one or more information technology (IT) components. The electronic rack further includes a set of one or more liquid distribution units (LDUs) coupled between the rack liquid supply and return lines and the server blades. Each LDU includes an LDU container, a liquid supply port, a liquid return port, one or more pairs of supply sub-ports and return sub-ports, and a heat exchange channel or tube.

Abstract: A cooling device for stored energy sources, in particular for motor vehicles, is provided. The cooling device includes: multiple separate cooling modules, through which coolant can flow, for absorbing heat from the stored energy source, each module having an inflow and an outflow; a common feed line, from which the inflows of the cooling modules branch off; and a common discharge line, into which the outflows of the cooling modules open.

Abstract: Thermal management systems and corresponding use methods are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an outer surface and an inner surface. The computing device also includes a heat generating component supported by the housing. The computing device includes a phase change device adjacent or physically connected to the heat generating component. The phase change device includes a first side and a second side. The first side is closer to the heat generating component than the second side. The second side is opposite the first side. The phase change device is compressible, such that when a force is applied to the outer surface of the housing, the inner surface of the housing flexes towards the second side of the phase change device and the phase change device is compressed.

Abstract: The present invention relates to a display apparatus. According to an embodiment of the present invention, the display apparatus includes a case, a display inside the case, and a heat exchanger disposed on a rear surface of the case to perform heat exchange between an outside and an inside of the case, wherein a first space and a second space separated from each other are formed on a front surface and a rear surface of the display, respectively, and heat exchange is performed between the first space and the second space, wherein heat exchange with the second space and the outside is performed through the heat exchanger. Thereby, the temperature inside the display apparatus that is installable outside may be effectively cooled.

Abstract: A fuse housing assembly and a fuse kit are provided. The fuse housing assembly and the fuse kit are configured to allow for fuses having terminals of different sizes to be mounted onto a circuit board. The fuse housing assembly and the fuse kit include a spacer configured to protect the exposed portions of the fuse terminals from the environment and prevent the proximal ends of the fuse terminals from breaking the fuse elements. Further, the spacer retains the fuse body of the respective fuses and the fuse terminals in a fixed position relative to each other so as to prevent the fuse terminals from being bent.

Abstract: An apparatus includes a base, one or more first fins, one or more second fins and one or more thermoelectric generation units. The base may be thermally couplable to an electrical module that generates heat while operational. The first fins may be thermally connected to the base. The second fins may be thermally isolated from the base. The thermoelectric generation units may be (i) disposed between the first fins and the second fins and (ii) configured to convert a heat difference between the first fins and the second fins into an electrical signal at a port thereby cooling the electrical module.

Abstract: A fusible link unit (1) includes a battery (5) with a battery post (3) projecting on an upper surface of the battery (5), a fuse unit (9) arranged on the upper surface of the battery (5) and having a battery terminal (7) connected to the battery post (3), and a fuse cover (11) covering an outer circumference of the fuse unit (9). A deck board (13) is arranged above the fuse cover (11) so as to be capable of being opened and closed. The fuse cover (11) is fixed by being held between the battery (5) and the deck board (13) in a closed state of the deck board (13).

Abstract: The disclosure discloses an electronic device, which comprises a case and at least one display module. The case comprises a base, a housing, two connection ports and a track. The housing is disposed above the base and has an opening. The two connection ports are disposed in the housing and corresponding to the opening. The track is disposed on the edge of the base, and at least one end of the track is adjacent to the opening. At least one display module is disposed on the case and electrically connected to a corresponding one of the two connection ports and is adapted to slide on the track to generate a displacement in relative to the case. The disclosure also discloses a case which is adapted to be connected to at least one display module in the electronic device.

Abstract: A cooling system comprising of a coolant manifold, a heat sink configured to fit in the coolant manifold, a plurality of cooling fins formed in the heat sink, and a coolant configured to flow through the coolant manifold to the heat sink. Diamond shaped pin fins associated with the heat sink create a series of divergent fluid paths for the cooling fluid that helps to create turbulence and improved heat transfer.

Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.

Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.

Abstract: A switching device having a housing, with a cover that can pivot about a rotational axis, and a securing device for carrier rail mounting. The cover has at least one coupling contact for an electrical and/or signal-type contact connection with at least one engageable switching device. A closing or releasing of the contact connection occurs with a pivoting of the cover. A locking or unlocking of the securing device occurs with a pivoting of the cover. The securing device has a spring-elastic clipping element shaped on the housing, for force-locking securing to a carrier rail end face, and has a sliding element, which is mounted such that it can slide in a linear manner within the housing and is coupled to the cover, for interlocking securing to the carrier rail end face opposite the clipping element.

Abstract: An intelligent power module and a manufacturing method thereof are provided. The intelligent power module includes a radiator, an insulating layer, a circuit wiring, a circuit component and a metal wire. At least part of a lower surface of the radiator is defined as a heat dissipating area, the heat dissipating area is provided with a heat dissipating corrugation, the insulating layer is provided to an upper surface of the radiator, the circuit wiring is provided to the insulating layer, and the circuit component is provided to the circuit wiring and is connected to the circuit wiring via the metal wire.

Abstract: An integrated air cooling and arc resistant system is provided for a voltage drive. The system comprises a cabinet including a back, an upper portion and a lower portion. The system further comprises a plurality of power cells disposed in the cabinet. The system further comprises a central chimney vertically disposed in the cabinet. The system further comprises a transformer disposed in the cabinet and being underneath the plurality of power cells. The transformer has a top end and a bottom end. The system further comprises a vertical plenum disposed in the back of the cabinet. The vertical plenum is configured to flow cool air passing from the plurality of power cells towards the bottom end of the transformer.

Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.

Abstract: A power converter includes: two switching elements; a positive electrode conductive plate: a negative electrode conductive plate; a mid-point conductive plate; a first heat sink; and a second heat sink. The positive electrode conductive plate is connected to a high-potential terminal of a series connection of the two switching elements, and the negative electrode conductive plate is connected to a low-potential terminal of the series connection. The mid-point conductive plate is connected to a middle point of the series connection. The first heat sink faces the positive electrode conductive plate and the negative electrode conductive plate with a first isolating layer interposed therebetween, and is connected to a ground terminal. The second heat sink faces the mid-point conductive plate with a second isolating layer interposed therebetween, and is isolated from the ground terminal.

Abstract: A housing assembly has an insertion opening adapted for insertion of an electronic unit and includes a first housing, a second housing, a thermal pad, and a guide structure. The second housing is opposite to the first housing, a space is formed between the first housing and the second housing, and the space is in communication with the insertion opening. The thermal pad is disposed on one side of the first housing facing the second housing. The guide structure is disposed inside the space and is adapted to guide the electronic unit to move towards the first housing when the electronic unit is inserted into the space through the insertion opening and moves, so that the electronic unit comes into contact with the thermal pad.

Abstract: An electronic component unit includes: first electronic components which do not need to be cooled; second electronic components which are cooled; a first circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; a second circuit board in which the first electronic component is mounted on a first surface and in which the second electronic component is mounted on a second surface; and one cooling plate which includes a first cooling surface and a second cooling surface, the second electronic component mounted on the second surface of the first circuit board is cooled by contact with the first cooling surface of the cooling plate, and the second electronic component mounted on the second surface of the second circuit board is cooled by contact with the second cooling surface of the cooling plate.

Abstract: A heat sink includes a plurality of apertures extending therethrough. The heat sink is arranged substantially parallel to a circuit board and includes at least one aperture transversely aligned with a corresponding IC chip of the circuit board. An underside of the heat sink is structurally connected to the circuit board. A plurality of thermal bridges is provided. Each thermal bridge includes a center bridge pad and at least one footer pad, connected via at least one offset wire. Each thermal bridge is aligned with a corresponding aperture. An underside of each footer pad is attached to the heat sink, with the offset wire extending into the corresponding aperture to suspend the center bridge pad at least partially into the aperture above the IC chip, thus creating a thermal load path. The apparatus separates a thermal load path from a structural load path in a circuit board environment.