Abstract: It is an object of the present invention to provide a method and an apparatus for soldering inspection of a surface mounted circuit board, which can improve an inspection accuracy by obtaining a highly accurate X-rays transmission image corresponding to a real shape of the mounted surface.

Abstract: A spin-welding apparatus utilizing a servo motor assembly has a closed-loop control circuit for rotating one part of the workpiece being welded relative to the other. In use, the servo motor immediately rotates the first part up to a set speed at which welding will occur, and a power cylinder moves the first part into frictional contact with the second part. Contact between the two parts is observed by a microprocessor interrogating a signal from the servo output corresponding to an increase in the load on the servo motor due to frictional drag between the parts, with "contact" being identified as surpassing a predetermined threshold error or variance value between the closed-loop system's input and output values. The microprocessor then counts a predetermined number of revolutions, and terminates rotation of the servo motor and first part.

Abstract: A method for increasing the strength of a solder joint between a nickel-iron lead frame of an electronic circuit module and a copper pad of a printed circuit board on which the module is mounted includes baking the joint for at least one hour at a temperature in the range 373K to 456K. The baking step is found to significantly increase the strength of the joint.

Abstract: A method for welding together two workpieces includes the steps of abutting workpieces together along respective edges of each of the workpieces, and locating one end of a rotatable tool astride the edges and against the workpieces. The tool is provided with a relatively narrow pin extending from the working end of the tool to engage the workpiece edges. The tool and pin are rotated to heat the workpiece edges, and the tool and workpieces are relatively moved. Electric current is supplied between the workpiece edges and the pin, with electrical resistance occurring between the workpiece edges and pin to provide heat in addition to the heat generated by friction occurring between the pin and workpieces to weld the workpieces together.

Abstract: There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space. A wire bonding mechanism is provided at a downstream portion of the transfer path.

Abstract: Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon reheating (reflow heating), the solder bridges melt first, and become subsumed into the solder masses. In instances where the preform is placed on a surface of an electronic component and reflowed, the solder masses become solder balls on pads of the electronic component. In instances where the preform is placed between two electronic components and reflowed, the solder masses become solder joints connecting the two electronic components. The preform may be prefabricated with a carrier, for later application to or between electronic components, and may be used to form solder balls on one or more unsingulated semiconductor dies on a semiconductor wafer.

Abstract: A process for improving the fillet-forming capability of brazeable aluminum articles includes providing a brazeable aluminum article, having at least one surface; and contacting the surface with a dilute, aqueous solution of fluoridic compounds, for at least 5 seconds at a temperature ranging from about 150.degree. to 212.degree. F. to produce an oxide-free surface which can be readily brazed with a minimal drip loss.

Abstract: A method for cleaning a bonding tool of a bonding apparatus includes a step of positioning a tip portion of the bonding tool between a pair of discharge electrodes, which are primarily used for removing a covering that covers a bonding wire, and a step of causing an electrical discharge across the discharge electrodes by applying a high voltage, such as of 3500 V, by connecting the discharge electrodes to positive and negative poles of a discharge power source, respectively. The electrical discharge is performed with the bonding wire kept inside the bonding tool so as not to project out of the bonding tool or after the bonding wire is removed from the bonding tool.

Abstract: A bonding tool for use in tape automated bonding and wedge bonding of gold and gold plated leads or wires to contact pads of electronic devices is fabricated of Aluminum Oxide ceramic without electrically conductive metallic binders. The bonding tool has a microscopically rough surface that is brought into compressive contact with the gold leads or wires and manipulated ultrasonically or thermosonically in order to form a molecular bond between the gold lead or wire and the contact pad of the electronic device. The Aluminum Oxide ceramic bonding tool is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions and is not readily abraded by the gold leads.

Abstract: A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.

Abstract: The power supply may be operated during a given cycle sequentially to produce high and low frequency drive signals for operating an ultrasonic transducer for sequentially producing an ultrasonic output at the two frequencies to carry out bonding operations at two different bond sites respectively.

Abstract: Multiple I/O pads are arranged in a pattern on a surface of an integrated circuit package, and an obstruction in the package prevents a planer solder flux mask from lying flat on the surface around the I/O pads. Such an obstruction can, for example, be a lid in the package which projects above the I/O pads, or it can be an encapsulant which covers a chip in the package and projects above the I/O pads. Despite the presence of the obstruction, solder flux is dispensed on the I/O pads of the integrated circuit package by the steps of --a) providing a pin block that has a base from which multiple pins project, and the ends of the pins match the pattern of the I/O pads; b) coating the ends of the pins with a solder flux; and, c) transferring a portion of the solder flux from the ends of the pins to the I/O pads by temporarily touching the coated ends of the pins against the I/O pads.

Abstract: A device exists for translational friction welding of a first component and a second component. The device includes a holder to hold the first component within an open ended frame having an open space within for receiving the first component. The frame includes a base and transversely spaced apart first and second members which longitudinally extend from the base to an open end of the frame at which is located a clamping feature used to clamp the first component in the holder with a clamping force having force components oriented along three orthogonal axis and has opposing tapering pressure surfaces which open outwardly in a first direction and taper inwardly in a second direction which is perpendicular to the first direction. A sacrificial block on the second component has block ends with surfaces that conforms to the surfaces of one of the clamping features. In a preferred embodiment the clamping feature is a compound wedge shaped notch and the block ends have corresponding compound wedge shapes.

Abstract: A method is provided for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder globules, after the passage on the wave of solder, the printed circuit boards are further artificially cooled at an approximately constant time-temperature gradient of 20 K/sec.

Abstract: A method for fabricating a field emission display and the resulting display device are disclosed. The method includes the steps of arranging a sealing layer between a face plate and a substrate, heating the sealing layer until the substrate layer adheres to the face plate, and then pulling the face plate away from the substrate so that the vacuum is improved. The sealing layer may be constructed from glass and heated with a heating coil made from Ni-chrome wire. The elements can be positioned using industrial robots using common manufacturing techniques.

Abstract: A plasma addressed liquid crystal display device having a plasma cell and a liquid crystal cell stacked one above the other is manufactured by a method of forming stripe-shaped barrier ribs by printing to a substrate on which a plurality of plasma electrodes are previously formed, filling a temporary reinforcing material between each of the stripe-shaped barrier ribs to bury the periphery of the individual barrier ribs, polishing to planarize a top portion of each of the barrier ribs buried in the reinforcing material, removing the temporary reinforcing material to expose the plasma electrodes and finally joining a dielectric sheet in contact with the planarized top portions of the barrier ribs, to assemble a plasma cell. Barrier ribs formed in the plasma cell of the plasma addressed liquid crystal display device can be polished stably with no worry of destruction.

Abstract: According to two aspects of the invention, a FED and a process for making a FED are provided which effectuate more accurate and efficient sealing between a faceplate and a backplate assembly, with more accurate and efficient sealing between the faceplate and cathode member. The FED is made according to a process including: aligning the faceplate and the cathode member; disposing an adhesive between the faceplate and the cathode member; pressing the faceplate and the cathode member together; disposing a frit seal between the faceplate and the backplate assembly; and heating the frit seal to a temperature sufficient to cause the frit to seal.

Abstract: Described is a method of making high purity copper sputtering target. The method avoids melting and casting and involves stacking segments of high purity copper plates, and heating, forging and annealing to produce a diffusion bonded unitary structure.

Abstract: A high temperature thick-film hybrid circuit is characterized by a surface-mount circuit component that is electrically interconnected with a conductor. The surface-mount circuit component of the thick-film hybrid circuit is bonded to the conductor with a soldering technique employing dual-solder layers. The dual-solder layers enable component attachment to the conductor at a temperature below the maximum processing temperature of the component, while forming a solder joint that exhibits suitable adhesion properties at temperatures in excess of 165.degree. C. The dual-solder layers can be chosen to inhibit tin diffusion from the solder, silver leaching from the conductor, and the formation of a brittle intermetallic at the solder-conductor interface.

Abstract: The present invention relates to a method for manufacturing a metallized luminescent screen for a CRT. At least one phosphor layer is deposited (10) on an inner surface of a faceplate panel to form the luminescent screen. The panel containing the screen is then preheated (12) to a temperature equal to, or in excess of, a minimum film-forming temperature and prewetted (14) by applying water to the screen. An aqueous filming emulsion containing a copolymer of acrylates and methacrylates with an average molecular weight of from 250,000 to 500,000 is applied (16) to the prewetted screen and dried (18) to form a film layer. Next, a layer of aluminum is deposited (20) onto the film layer, and the panel, bearing the metallized screen, is sealed to a funnel by heating the panel and the funnel through a sealing cycle. The sealing cycle(22) has a first rate of temperature increase to a first temperature and a second rate of temperature increase, less than the first rate, to a second temperature.