Abstract: A box connector for cable comprises an annular connector in which one or more inwardly extending arms are formed. The inwardly extending arms are formed such that cable may be inserted in one direction, but cannot be pulled out in the other direction until the inwardly extending arms are released. In use, the box connector is inserted into an electrical box prior to inserting cable. Thereafter, cable is threaded into the electrical box. Once the cable is threaded into the electrical box, the cable is fixedly held via the inwardly extending arms.

Abstract: An electrical signal connection, an electrical signaling system, and a method of connecting printed circuit boards. The electrical signal connection having a first conductive via and a second conductive via disposed in a first printed circuit board. A first conductive trace with a first end and a second end has the first end electrically coupled to the first conductive via at a first distance from the top surface of the first printed circuit board. The second end of the first conductive via is electrically coupled to the second printed circuit board. A second conductive trace with a first end and a second end has the first end being electrically coupled to the second conductive via at a second distance from the top surface of the first printed circuit board. The second end being is electrically coupled to the second printed circuit board.

Abstract: The invention relates to a method for producing a functional assembly as well as a functional assembly. According to the inventive method, at least one first material and a second material which are provided with different properties are applied layer by layer, partially in some parts, so as to create an encapsulation from the first material and a strip conductor structure from the second material, one or several functional units being embedded in the layer structure and being contacted with the strip conductor structure when the materials are applied. The disclosed method makes it possible to carefully structure a unit while offering a great degree of creative freedom.

Abstract: A wiring board includes a core substrate, a first laminated structure formed on a surface of the substrate and including conductive and insulation layers, and a second laminated structure formed on the opposite surface of the substrate and including conductive and insulation layers. The substrate has a connection conductor made of a plating. The insulation layers of the first laminated structure have connection conductors stacked one over another and made of platings. The insulation layers of the second laminated structure have connection conductors stacked one over another and made of platings. The connection conductors of the laminated structures are stacked on the connection conductor of the substrate. The connection conductors of the laminated structures include outer-layer connection conductors which have positions shifted in a substantially same direction from the position of the connection conductor of the substrate.

Abstract: A holding apparatus includes a receiving element and an elastic element. The receiving element is fixed on a circuit board and receives an upright plug-in element. The receiving element defines two through holes in two sides of the receiving element. The through holes have different axial lines. The elastic element includes a main pole and two branch poles respectively perpendicularly extending down from two ends of the main pole. Two opposite pins respectively extend from distal ends of the branch poles. The pins of the elastic element are respectively inserted in the through holes of the receiving element, to locate the upright plug-in element between the elastic element and the receiving element.

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract: A wiring substrate has pads formed from a plurality of metal layers and vias connected to the pads. The plurality of metal layers have a metal layer exposed through the wiring substrate, and a first metal layer which is interposed between the metal layer and the vias and which prevents diffusion of metal included in the vias into the metal layer. A second metal layer which is less subject to oxidation than the first metal layer is provided between the vias and the first metal layer, and the vias are connected to the second metal layer.

Abstract: The present invention discloses a switch cabinet connection and combination apparatus, wherein upper line-in/line-out terminals of a medium-voltage switch cabinet are connected to upper contact boxes via a conductor, and lower line-in/line-out terminals thereof are connected to lower contact boxes via the conductor, and remaining gaps to be insulated are filled with a solid insulating material. The present invention further discloses a method of manufacturing a switch cabinet connection and combination apparatus including the steps of: connecting upper line-in/line-out terminals of a medium-voltage switch cabinet via a conductor to upper contact boxes; connecting lower line-in/line-out terminals thereof via the conductor to lower contact boxes; and pouring a solid insulating material for molding. The present invention realizes high reliability, small volume, and no pollution of the medium-voltage switch cabinet.

Abstract: An electrical device mounting assembly for recessed mounting of high and low voltage components in order to provide electrical power and low voltage signals to a television or home entertainment center is provided. Mounting surfaces are provided within the mounting assembly to recess electrical components therein and behind the wall surface. The assembly includes a mounting frame for receipt of mounting devices such as high voltage boxes and low voltage mounting plates. The mounting devices are secured at an angle with respect to the mounting frame, thereby minimizing the depth of the mounting frame while providing sufficient space for recessing plug ends of electrical cords and terminal ends of signal cables within the wall. The electrical device mounting assembly provides a recessed area on a wall for mounting all the various electrical and signal hookups for a television or home entertainment system.

Abstract: The present invention relates to a method for forming a via in a substrate and a substrate with a via. The method includes the following steps: (a) providing a substrate; (b) forming a groove on a first surface of the substrate; (c) forming a conductive metal on the groove so as to form a central groove; (d) forming an annular groove that surrounds the conductive metal; (e) forming an insulating material in the central groove and the annular; groove; and (f) removing part of the substrate to expose the conductive metal and the insulating material.

Abstract: Locking mechanism (1) and a housing (2) equipped with one such locking mechanism, to hold a plug-in module (5), and a modular system (3) which comprises a housing and a plug-in module, wherein the locking mechanism (1) has an actuating mechanism (4) for unlocking of the plug-in module. The invention is characterized in that the actuating mechanism (4) is connected to a lifting mechanism (6) in order to lift a plug-in module (5) held in the housing (2) when unlocking.

Abstract: A layout method for a bridging electrode capable of shielding a bright spot includes the steps of: providing a substrate; forming a transparent electroconductive layer, having neighboring pattern blocks, on the substrate; forming an alignment film layer, having bridging grooves for crossing between the pattern blocks, over the substrate; forming an electroconductive layer, having wires respectively correspondingly disposed over the bridging grooves, over the substrate; forming an electroconductive correspondence layer on one side of the electroconductive layer to shield the wires; and forming a protection layer over the substrate to enhance optical transmission and protect the substrate, the transparent electroconductive layer, the alignment film layer and the electroconductive layer. Meanwhile, the invention also provides a structure of the bridging electrode capable of shielding the bright spot and corresponding to the layout method.

Abstract: Various aspects of the disclosure provide low index metamaterials. The low index metamaterials may be used to form soft and/or hard electromagnetic (EM) boundaries to facilitate desired EM performance or propagation in applications including feed horns, spatial feed/combiners, isolation barriers between antennas or RF modules, and reduced radar cross-section applications. In one aspect, a low index metamaterial comprises a dielectric layer and a plurality of conductors on a surface of the dielectric layer, embedded in the dielectric layer or both, wherein the low index metamaterial appears as a medium having a dielectric constant less than one with respect to electromagnetic waves at predetermined frequencies and propagating at grazing angles with respect to a surface of the low index metamaterial.

Abstract: A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole and contoured such that a sheet for positioning the electronic component in the penetrating hole is laminated horizontally with respect to the first surface of the core substrate over the penetrating hole.

Abstract: A conductive film stacked member includes: a first conductive film formed on a substrate; and a second conductive film formed on the first conductive film, wherein the width of the second conductive film is narrower than the width of the first conductive film, and the second conductive film has a surface convexly curved in the direction away from the first conductive film in a cross-sectional view.

Abstract: An electronic device includes a housing, a printed circuit board (PCB) defining a mounting hole and one or more fixing mechanisms. The fixing mechanism includes a fixing member and a screw. The fixing member includes a main body and a number of elastic connection portions interconnecting the housing and the main body for adjusting a position of the main body relative to the housing. The main body defines a threaded hole. The screw passes through the mounting hole of the PCB and is threaded into the threaded hole of the main body, to fix the PCB on the main body.

Abstract: A circuit board includes a circuit substrate, a dielectric layer, and a patterned circuit structure. The dielectric layer covers a first surface and at least a first circuit of the circuit substrate. The dielectric layer has a second surface, at least a blind via extending from the second surface to the first circuit, a first intaglio pattern, and a second intaglio pattern. The patterned circuit structure includes at least a second circuit and a plurality of third circuits. The second circuit is disposed in the first intaglio pattern. The third circuits are disposed in the second intaglio pattern and the blind via. Each third circuit has a first conductive layer, a second conductive layer, and a barrier layer. The first conductive layer is located between the barrier layer and the second intaglio pattern and between the barrier layer and the blind via. The second conductive layer covers the barrier layer.

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.

Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.

Abstract: A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having through holes formed therein, and a second connection terminal group including a plurality of connection terminals formed at at least the peripheral portion of a back surface of the substrate. The first connection terminal group is connected to the second connection terminal group by way of the through holes. A build-up multilayer interconnection layer having via holes is formed on the top surface of the substrate, so that the first connection terminal group is connected to the second connection terminal group through the build-up multilayer interconnection layer and the through holes.