Abstract: During frequency detection, a constant current source outputs an output current to charge a variable capacitor for multi-period. In a calibration mode, according to a comparison result between a cross voltage of the variable capacitor and a reference voltage, a capacitance value of the variable capacitor is adjusted. In a monitor mode, according to a reference frequency and the cross voltage of the variable capacitor, a frequency under test of a circuit under test is detected.

Abstract: An arc detection circuit includes a current detector and arc determination unit. The current detector detects a current flowing through a transmission line which connects an electric power supply device and an electric power conversion circuit. The arc determination unit calculates, from a result of measurement of the current, an area of interest and an area for comparison. The area of interest is an area of a region of interest defined by a predetermined frequency range and predetermined time for determination. The area for comparison is an area of a portion in which detected strength exceeds a predetermined strength threshold in the region of interest. The arc determination unit determines an electric arc has occurred when a ratio between the area of interest and the area for comparison exceeds a predetermined area-ratio threshold.

Abstract: The present invention provides a clamper and a lighting fixture. An elastic layer for contacting a panel is disposed on a rotatable clamping portion. In addition to that, a distance from a lowest point of one end of the panel clamped by the rotatable clamping portion to a carrier plate supporting a polarizer at one side of the panel adjacent to a thin film transistor is greater than a thickness of the polarizer. Accordingly, the present invention prevents the panel and the polarizer at one side of the panel adjacent to the thin film transistor from being damaged from clamping.

Abstract: A chip testing system and an environment control apparatus are provided. The chip testing system includes the environment control apparatus, a central control device, and a chip testing device. The environment control apparatus includes an apparatus body and a pressing device. When the chip testing device is disposed in an accommodating chamber of the apparatus body, and the central control device controls the pressing device to press a plurality of side surfaces of a plurality of chips carried by the chip testing device, the central control device controls the chip testing device to perform a testing operation to the chips. After the chip testing device performs the testing operation to the chips, a plurality of movable members of the pressing device protrude from a contacting surface of the pressing device and push the chips to separate the chips and the contacting surface.

Abstract: An optical device is formed on an optical IC chip. The shape of the optical IC chip is rectangular or parallelogram. The optical device induces: an optical device circuit; a first optical waveguide that is coupled to the optical device circuit; a pad that is electrically connected to the optical device circuit; a grating coupler; and a second optical waveguide that is coupled to the grating coupler. The pad is formed in a region close to a first side of the optical IC chip. The grating coupler is formed in a specified region, which is not close to the first side, on the optical IC chip. The first optical waveguide and the second optical waveguide are respectively extended to an edge of the optical IC chip.

Abstract: An eddy current system and methods of performing operations on a structure using the eddy current system are presented. The eddy current system comprises an ion beam source and a magnetic field source with at least one of variable output intensity or variable output orientation.

Abstract: A method of installing a stroke sensor that enables the stroke sensor to be adjusted in a simple process is provided. The method has the steps of: arranging a second magnet, relative to the magnetic field detecting element, at a physically determinable first reference position and obtaining an indicator value S1; attaching the first magnet and the magnetic field detecting element to structures different from each other, respectively, and positioning the first magnet, relative to the magnetic field detecting element, at a physically determinable second reference position, and obtaining an indicator value S2, wherein the second reference position corresponds to the first reference position; calculating ?S=S1?S2, wherein ?S is a difference between the indicator value S1 and the indicator value S2; and modifying a process in the processor such that a sum of the indicator value S and ?S is outputted.

Abstract: An electronic device includes: a detection circuit configured to determine one or more operating data, one or more device sensor data, or a combination thereof associated with operation of the electronic device; a trigger circuit operably coupled to the circuit, the trigger circuit configured to generate a stress input based on detecting one or more target criteria from the one or more operating data, the one or more device sensor data, or a combination thereof; and a degradation sensor operably coupled to the trigger circuit, the degradation sensor having a threshold voltage and being configured to record the target criteria that occurs during operation of the electronic device, wherein the degradation sensor is configured to record the target criteria based on degradation of the threshold voltage according to the stress input.

Abstract: A system and method for monitoring analog front-end (AFE) circuitry of an inductive position sensor. A redundant AFE channel is provided and alternatively utilized with a sine AFE channel or a cosine AFE channel of the AFE circuitry to obtain a voltage difference that may result in a detection angle error at the electronic control unit (ECU) of the inductive position sensor.

Abstract: Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.

Abstract: A display device including a first substrate including a display area and a non-display area, a circuit film connected to the first substrate, a printed circuit board (PCB) connected to the circuit film, and a first inspection pad, a second inspection pad, and a third inspection pad located in the non-display area and a bridge configured to electrically connect the first inspection pad, the second inspection pad, and the third inspection pad. The circuit film includes a first line electrically connected to the first inspection pad, a second line electrically connected to the second inspection pad, a third line electrically connected to the third inspection pad, and a branch point configured to branch at least one line from the first line, the second line, and the third line into two sub-lines. The PCB includes a test pad unit connected to the first line, the second line, and the third line.

Abstract: A testing device includes a transmitter circuit, a receiver circuit, and a loopback circuit. The transmitter circuit is configured to receive a plurality of first test signals. The receiver circuit is configured to receive input data from a plurality of pads in a normal mode. The loopback circuit is coupled to the plurality of pads and input terminals of a sampler circuit, and the loopback circuit is configured to transmit the plurality of first test signals from the transmitter circuit to the input terminals of the sampler circuit, in order to generate test data for subsequent analysis.

Abstract: An electromagnetic induction type coordinate positioning apparatus includes a first induction coil, a second induction coil, a first amplification circuit, a second amplification circuit, and a control circuit. The first induction coil and the second induction coil respectively generate a first induction signal and a second induction signal when a pointer device comes close. The first amplification circuit and the second amplification circuit may be electrically connected to the first induction coil and the second induction coil, to receive the first induction signal and the second induction signal. The control circuit controls the first amplification circuit and the second amplification circuit to amplify the first induction signal and the second induction signal, so that a power level of the amplified first induction signal and a power level of the amplified second induction signal reach a first predefined level and a second predefined level.

Abstract: The present disclosure provides an analysis method for a semiconductor device for analyzing a plurality of process parameters for manufacturing a HKMG fin field effect transistor. The analysis method specifically includes: establishing a plurality of process parameter models by grouping the plurality of process parameters in pairs; performing sensitivity analysis on each of the process parameter models; extracting a plurality of key process parameter models from the plurality of process parameter models based on the results of the sensitivity analysis; and performing data mining on the plurality of key process parameter models to determine a plurality of key process parameters and their correlations among the plurality of key process parameters. According to the analysis method provided by the present disclosure, related process parameters are highlighted by data mining and grouping, and the source of process parameter changes is explained. It is possible to adjust the process.

Abstract: In one aspect, an angle sensor includes analog circuitry configured to generate an analog value having a tangent value, an analog-to-digital converter configured to convert the analog value to a digital value and digital circuitry configured to receive the digital value. The analog circuitry includes a plurality of magnetoresistance elements that include a first magnetoresistance element configured to provide a cosine value indicative of a magnetic field along a first axis and a second magnetoresistance element configured to provide a sine value indicative of the magnetic field along a second axis orthogonal to the first axis. The tangent value is determined by the cosine and sine values. The digital circuitry includes an angle processor configured to use the digital value and a fixed value in an arctangent algorithm to generate an angle of a direction of the magnetic field.

Abstract: A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT. The scanning system is configured to update the time-dependent map of the emissions based on combinations of the emissions of light at certain locations.

Abstract: The present invention is a storage tank including: a tank; a tank main body that stores a liquid material; a cover body that covers an opening of the tank main body; a support body that is positioned opposite to the cover body; a seal body that is sandwiched by a flange provided at the opening end of the tank main body and the cover body; and tightening members that tighten the cover body and the support body, and is capable of, even when the thickness of the flange provided at the opening end of the tank main body is thin, attaching the cover body on the flange while maintaining a contact property.

Abstract: A terminal block for current measurement in a power grid. The terminal block includes a shunt and a temperature sensor, and is configured to be connected to an Intelligent Electronic Device IED and a primary device. Furthermore, a respective IED and a system for current measurement including the IED and the terminal block are disclosed as well as a method for calibration of the system and a method for current measurement in power grids. A voltage measurement unit in the IED is adapted to measure a voltage drop at the shunt; a current flowing through the shunt can be calculated from the temperature and from calibration data. The terminal block enables a particularly efficient calibration method.

Abstract: An image test system includes a test assembly and an image capture card. The test assembly is provided for capturing test signals from test objects, and incudes a first transmission interface, a second transmission interface, and an interface conversion circuit. The interface conversion circuit is connected with the first transmission interface, and converts signal transmission forms of the test signals. The second transmission interface is connected with the interface conversion circuit. Besides, the image capture card is provided for connecting with the second transmission interface, and captures image data from the test signals.

Abstract: A high speed arc suppressor and method include a first phase-specific arc suppressor configured to suppress arcing across contacts of the power contactor in a positive domain and a second phase-specific arc suppressor configured to suppress arcing across the contacts in a negative domain. First and second high speed switches are configured to enable and disable operation of an associated one of the first and second phase-specific arc suppressors. First and second drivers are configured to drive the first and second high speed switches.